DataSheet.es    


PDF M50LPW040 Data sheet ( Hoja de datos )

Número de pieza M50LPW040
Descripción 4 Mbit 512Kb x8/ Uniform Block 3V Supply Low Pin Count Flash Memory
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



Hay una vista previa y un enlace de descarga de M50LPW040 (archivo pdf) en la parte inferior de esta página.


Total 30 Páginas

No Preview Available ! M50LPW040 Hoja de datos, Descripción, Manual

M50LPW040
4 Mbit (512Kb x8, Uniform Block)
3V Supply Low Pin Count Flash Memory
PRELIMINARY DATA
s SUPPLY VOLTAGE
– VCC = 3V to 3.6V for Program, Erase and
Read Operations
– VPP = 12V for Fast Program and Fast Erase
(optional)
s TWO INTERFACES
– Low Pin Count (LPC) Standard Interface for
embedded operation with PC Chipsets.
– Address/Address Multiplexed (A/A Mux) In-
terface for programming equipment compati-
bility.
s LPC HARDWARE INTERFACE MODE
– 5 Signal Communication Interface supporting
Read and Write Operations
– Hardware Write Protect Pins for Block Pro-
tection
– Register Based Read and Write Protection
– 5 Additional General Purpose Inputs for plat-
form design flexibility
– Synchronized with 33 MHz PCI clock
s PROGRAMMING TIME
– 10µs typical
– Quadruple Byte Programming Option
s 8 UNIFORM 64 Kbyte MEMORY BLOCKS
s PROGRAM/ERASE CONTROLLER
– Embedded Byte Program and Block/Chip
Erase algorithms
– Status Register Bits
s PROGRAM and ERASE SUSPEND
– Read other Blocks during Program/Erase
Suspend
– Program other Blocks during Erase Suspend
s FOR USE in PC BIOS APPLICATIONS
s ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 26h
TSOP40 (N)
10 x 20mm
PLCC32 (K)
Figure 1. Logic Diagram (LPC Interface)
VCC VPP
3
ID0-ID2
GPI0-
GPI4
5
4
LAD0-
LAD3
WP
LFRAME
CLK
IC
RP
INIT
M50LPW040
TBL
VSS
AI05435
March 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/36

1 page




M50LPW040 pdf
M50LPW040
Top Block Lock (TBL). The Top Block Lock
input is used to prevent the Top Block (Block 7)
from being changed. When Top Block Lock, TBL,
is set Low, VIL, Program and Block Erase
operations in the Top Block have no effect,
regardless of the state of the Lock Register. When
Top Block Lock, TBL, is set High, VIH, the
protection of the Block is determined by the Lock
Register. The state of Top Block Lock, TBL, does
not affect the protection of the Main Blocks (Blocks
0 to 6).
Top Block Lock, TBL, must be set prior to a Pro-
gram or Block Erase operation is initiated and
must not be changed until the operation completes
or unpredictable results may occur. Care should
be taken to avoid unpredictable behavior by
changing TBL during Program or Erase Suspend.
Write Protect (WP). The Write Protect input is
used to prevent the Main Blocks (Blocks 0 to 6)
from being changed. When Write Protect, WP, is
set Low, VIL, Program and Block Erase operations
in the Main Blocks have no effect, regardless of
the state of the Lock Register. When Write Protect,
WP, is set High, VIH, the protection of the Block is
determined by the Lock Register. The state of
Write Protect, WP, does not affect the protection of
the Top Block (Block 7).
Write Protect, WP, must be set prior to a Program
or Block Erase operation is initiated and must not
be changed until the operation completes or un-
predictable results may occur. Care should be tak-
en to avoid unpredictable behavior by changing
WP during Program or Erase Suspend.
Reserved for Future Use (RFU). These pins do
not have assigned functions in this revision of the
part. They must be left disconnected. (Pin 9 in the
PLCC32, and Pin 21 in the TSOP40, may also be
driven High or driven Low.)
Address/Address Multiplexed (A/A Mux)
Signal Descriptions
For the Address/Address Multiplexed (A/A Mux)
Interface see Figure 2, Logic Diagram, and Table
3, Signal Names.
Address Inputs (A0-A10). The Address Inputs
are used to set the Row Address bits (A0-A10) and
the Column Address bits (A11-A18). They are
latched during any bus operation by the Row/Col-
umn Address Select input, RC.
Data Inputs/Outputs (DQ0-DQ7). The Data In-
puts/Outputs hold the data that is written to or read
Table 3. Signal Names (A/A Mux Interface)
IC Interface Configuration
A0-A10
Address Inputs
DQ0-DQ7
Data Inputs/Outputs
G Output Enable
W Write Enable
RC Row/Column Address Select
RB Ready/Busy Output
RP Interface Reset
VCC Supply Voltage
Optional Supply Voltage for Fast
VPP Program and Fast Erase
Operations
VSS Ground
NC Not Connected Internally
from the memory. They output the data stored at
the selected address during a Bus Read opera-
tion. During Bus Write operations they represent
the commands sent to the Command Interface of
the internal state machine. The Data Inputs/Out-
puts, DQ0-DQ7, are latched during a Bus Write
operation.
Output Enable (G). The Output Enable, G, con-
trols the Bus Read operation of the memory.
Write Enable (W). The Write Enable, W, controls
the Bus Write operation of the memory’s Com-
mand Interface.
Row/Column Address Select (RC). The Row/
Column Address Select input selects whether the
Address Inputs should be latched into the Row
Address bits (A0-A10) or the Column Address bits
(A11-A18). The Row Address bits are latched on
the falling edge of RC whereas the Column
Address bits are latched on the rising edge.
Ready/Busy Output (RB). The Ready/Busy pin
gives the status of the memory’s Program/Erase
Controller. When Ready/Busy is Low, VOL, the
memory is busy with a Program or Erase operation
and it will not accept any additional Program or
Erase command except the Program/Erase
Suspend command. When Ready/Busy is High,
VOH, the memory is ready for any Read, Program
or Erase operation.
5/36

5 Page





M50LPW040 arduino
M50LPW040
Read Memory Array Command. The Read Mem-
ory Array command returns the memory to its
Read mode where it behaves like a ROM or
EPROM. One Bus Write cycle is required to issue
the Read Memory Array command and return the
memory to Read mode. Once the command is is-
sued the memory remains in Read mode until an-
other command is issued. From Read mode Bus
Read operations will access the memory array.
While the Program/Erase Controller is executing a
Program or Erase operation the memory will not
accept the Read Memory Array command until the
operation completes.
Read Status Register Command. The Read Sta-
tus Register command is used to read the Status
Register. One Bus Write cycle is required to issue
the Read Status Register command. Once the
command is issued subsequent Bus Read opera-
tions read the Status Register until another com-
mand is issued. See the section on the Status
Register for details on the definitions of the Status
Register bits.
Read Electronic Signature Command. The Read
Electronic Signature command is used to read the
Manufacturer Code and the Device Code. One
Bus Write cycle is required to issue the Read
Electronic Signature command. Once the
command is issued subsequent Bus Read
operations read the Manufacturer Code or the
Device Code until a Read Memory Array
command is issued.
After the Read Electronic Signature Command is
issued the Manufacturer Code and Device Code
can be read using Bus Read operations using the
addresses in Table 10.
Program Command. The Program command
can be used to program a value to one address in
the memory array at a time. Two Bus Write
operations are required to issue the command; the
second Bus Write cycle latches the address and
data in the internal state machine and starts the
Program/Erase Controller. Once the command is
issued subsequent Bus Read operations read the
Status Register. See the section on the Status
Register for details on the definitions of the Status
Register bits.
If the address falls in a protected block then the
Program operation will abort, the data in the
memory array will not be changed and the Status
Register will output the error.
During the Program operation the memory will
only accept the Read Status Register command
and the Program/Erase Suspend command. All
other commands will be ignored. Typical Program
times are given in Table 12.
Note that the Program command cannot change a
bit set at ‘0’ back to ‘1’ and attempting to do so will
Table 10. Read Electronic Signature
Code
Address
Manufacturer Code
00000h
Device Code
00001h
Note: For A19 value, refer to Table 2.
Data
20h
26h
not cause any modification on its value. One of the
Erase commands must be used to set all of the
bits in the block to ‘1’.
See Figure 14, Program Flowchart and Pseudo
Code, for a suggested flowchart on using the
Program command.
Quadruple Byte Program Command. The Qua-
druple Byte Program Command can be only used
in A/A Mux mode to program four adjacent bytes
in the memory array at a time. The four bytes must
differ only for the addresses A0 and A1.
Programming should not be attempted when VPP
is not at VPPH. The operation can also be executed
if VPP is below VPPH, but result could be uncertain.
Five Bus Write operations are required to issue the
command. The second, the third and the fourth
Bus Write cycle latches respectively the address
and data of the first, the second and the third byte
in the internal state machine. The fifth Bus Write
cycle latches the address and data of the fourth
byte in the internal state machine and starts the
Program/Erase Controller. Once the command is
issued subsequent Bus Read operations read the
Status Register. See the section on the Status
Register for details on the definitions of the Status
Register bits.
During the Quadruple Byte Program operation the
memory will only accept the Read Status register
command and the Program/Erase Suspend com-
mand. All other commands will be ignored. Typical
Quadruple Byte Program times are given in Table
12.
Note that the Quadruple Byte Program command
cannot change a bit set to ‘0’ back to ‘1’ and
attempting to do so will not cause any modification
on its value. One of the Erase commands must be
used to set all of the bits in the block to ‘1’.
See Figure 15, Quadruple Byte Program Flow-
chart and Pseudo Code, for a suggested flowchart
on using the Quadruple Byte Program command.
Chip Erase Command. The Chip Erase Com-
mand can be only used in A/A Mux mode to erase
the entire chip at a time. Erasing should not be at-
tempted when VPP is not at VPPH. The operation
can also be executed if VPP is below VPPH, but re-
sult could be uncertain. Two Bus Write operations
are required to issue the command and start the
Program/Erase Controller. Once the command is
issued subsequent Bus Read operations read the
11/36

11 Page







PáginasTotal 30 Páginas
PDF Descargar[ Datasheet M50LPW040.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
M50LPW040"4 Mbit 512Kb x8 Uniform Block 3V Supply Low Pin Count Flash Memory"
Uniform Block 3V Supply Low Pin Count Flash Memory"
M50LPW0404 Mbit 512Kb x8/ Uniform Block 3V Supply Low Pin Count Flash MemoryST Microelectronics
ST Microelectronics
M50LPW041"4 Mbit 512Kb x8 Uniform Block 3V Supply Low Pin Count Flash Memory"
Uniform Block 3V Supply Low Pin Count Flash Memory"
M50LPW0414 Mbit 512Kb x8/ Uniform Block 3V Supply Low Pin Count Flash MemoryST Microelectronics
ST Microelectronics

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar