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PDF PD57060S Data sheet ( Hoja de datos )
| Número de pieza | PD57060S | |
| Descripción | RF POWER TRANSISTORS The LdmoST Plastic FAMILY | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de PD57060S (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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N-CHANNEL ENHANCEMENT-MODE LATERAL
MOSFETs
PD57060
PD57060S
RF POWER TRANSISTORS
The LdmoST Plastic FAMILY
• EXCELLENT THERMAL STABILITY
• COMMON SOURCE CONFIGURATION
• POUT = 60 W with 14.3 dB gain @ 945 MHz /
28V
• NEW RF PLASTIC PACKAGE
DESCRIPTION
The PD57060S is a common source N-Channel,
enhancement-mode lateral Field-Effect RF power
transistor. It is designed for high gain, broad band
commercial and industrial applications. It operates
at 28 V in common source mode at frequencies of
up to 1 GHz. PD57060S boasts the excellent gain,
linearity and reliability of ST’s latest LDMOS
technology mounted in the first true SMD plastic
RF power package, PowerSO-10RF. PD57060S’s
superior linearity performance makes it an ideal
solution for base station applications.
The PowerSO-10 plastic package, designed to
offer high reliability, is the first ST JEDEC
approved, high power SMD package. It has been
specially optmized for RF needs and offers
excellent RF performances and ease of assembly.
Mounting recommendations are available in
www.st.com/rf/ (look for application note AN1294)
PowerSO-10RF
(formed lead)
ORDER CODE
PD57060
BRANDING
PD57060
PowerSO-10RF
(Straight lead)
ORDER CODE
PD57060S
BRANDING
PD57060S
ABSOLUTE MAXIMUM RATINGS (TCASE = 25 °C)
Symbol
Parameter
V(BR)DSS Drain-Source Voltage
VGS Gate-Source Voltage
ID Drain Current
PDISS Power Dissipation (@ Tc = 70°C)
Tj Max. Operating Junction Temperature
TSTG
Storage Temperature
THERMAL DATA (TCASE = 70 °C)
Rth(j-c) Junction -Case Thermal Resistance
March, 21 2003
Value
65
± 20
7
79
165
-65 to +150
1.0
Unit
V
V
A
W
°C
°C
°C/W
1/12
1 page  
TEST CIRCUIT SCHEMATIC
PD57060 - PD57060S
VGG+
+
RF
IN
+ VDD
+
RF
OUT
NO TES:
1. DIMENSIONS AT COMPONENT SYMBOLS ARE REFERENCE FOR COMPONENT PLACEMENT.
2. GAP BETWEEN GROUND & TRANSMISSION LINE = 0.056 [1.42] +0.002 [0.05] -0.000 [0.00] TYP.
3. DIMENSIONS OF INPUT AND OUTPUT COMPONENT FROM EDGE OF TRANSMISSION LINES.
TEST CIRCUIT COMPONENT PART LIST
COMPONENT
DESCRIPTION
L1,L2
INDUCTOR, 5 TURNS AIR WOUND #22AWG, ID 0.059{1.49}, NYLON COATED
MAGNET WIRE
FB1,FB2
SHIELD BEAD SURFACE MOUNT EMI
R1 18 kΩ, 1 W SURFACE MOUNT CHIP RESISTOR
R2 4.7 MΩ, 1 W SURFACE MOUNT CHIP RESISTOR
R3 120 Ω, 2 W SURFACE MOUNT CHIP RESISTOR
C1,C2
3 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C3,C10,C11,C15
47 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C4,C9
0.8-8.0 pF GIGA TRIM VARIABLE CAPACITOR
C5,C6,C7,C8
7.5 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C12 1000 pF ATC 700B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C13,C17
0.1 µF, 500 V SURFACE MOUNT CERAMIC CHIP CAPACITOR
C14 10 µF, 50 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR
C16 100 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C18 220 µF, 63 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR
BOARD
ROGER, ULTRA LAM 2000, THK 0.030”, εr = 2.55 2oz. ED Cu 2 SIDES.
5/12
5 Page 
PD57060 - PD57060S
DIM.
A1
A2
A3
A4
a
b
c
D
D1
E
E1
E2
E3
F
G
R1
R2
T1
T2
PowerSO-10RF Straight Lead MECHANICAL DATA
mm Inch
MIN.
TYP.
MAX
MIN.
TYP.
1.62
1.67
1.72
0.064
0.065
3.4
3.5
3.6
0.134
0.137
1.2
1.3
1.4
0.046
0.05
0.15
0.2
0.25
0.005
0.007
0.2 0.007
5.4
5.53
5.65
0.212
0.217
0.23
0.27
0.32
0.008
0.01
9.4
9.5
9.6
0.370
0.374
7.4
7.5
7.6
0.290
0.295
15.15
15.4
15.65
0.595
0.606
9.3
9.4
9.5
0.365
0.37
7.3
7.4
7.5
0.286
0.292
5.9
6.1
6.3
0.231
0.24
0.5 0.019
1.2 0.047
0.25
0.8 0.031
6 deg
6 deg
10 deg
10 deg
Note (1): Resin protrusions not included (max value: 0.15 mm per side)
MAX
0.068
0.142
0.054
0.009
0.221
0.012
0.377
0.298
0.615
0.375
0.294
0.247
0.01
CRITICAL DIMENSIONS:
- Overall width (L)
11/12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet PD57060S.PDF ] | |
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