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PDF IBB110P Data sheet ( Hoja de datos )

Número de pieza IBB110P
Descripción Integrated Telecom Circuits
Fabricantes Clare . 
Logotipo Clare . Logotipo



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IBB110P
Integrated Telecom Circuits
Load Voltage
Load Current
Max RON
IBB110P
350
100
35
Units
V
mA
Description
The IBB110P Multifunction Telecom switch combines two
350V Form B relays and one optocoupler in a single
package. The relay uses optically coupled MOSFET tech-
nology to provide 1500V of input to output isolation. The
efficient MOSFET switches and photovoltaic die use
Clare’s patented OptoMOS architecture. The optically
Features
Three Functions in One Package
Small 16 Pin SOIC Package (PCMCIA Compatible)
Bi-Directional Current Sensing
Bi-Directional Current Switching
3750VRMS Input/Output Isolation
FCC Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Tape & Reel Versions Available
coupled input uses highly efficient GaAIAs infrared LEDs.
IBB110P’s allow telecom circuit designers to combine
three discrete functions in a single component. The The
IBB110P small package uses less space than traditional
discrete component solutions.
Approvals
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-12
VDE Compatible
BSI Certified:
BS EN 60950:1992 (BS7002:1992)
Certificate #:7969
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
BS EN 41003:1993
Certificate #:7969
Ordering Information
Part #
IBB110P
IBB110PTR
Description
16 Pin SOIC (50/Tube)
16 Pin SOIC (1000/Reel)
Pin Configuration
IBB110P Pinout
1
(N/C)
16
2 15 (Form B)
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
10ms
3
4
5
6
14
13
12 (Form B)
11
Industrial Controls
+90%
LOAD 10%+
10%+
TON TOFF
7
8
(N/C)
10
9
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
+90%
+10%
TOFF
+90%
TON
1. (N/C)
2. + LED - Form B Relay #1
3. LED - Form B Relay #1
4. + LED - Form B Relay #2
5. LED - Form B Relay #2
6. Emitter - Phototransistor
7. Collector - Phototransistor
8. (N/C)
9. LED - Phototransistor +/
10. LED - Phototransistor /+
11. Output - Form B Relay #2
12. Common Source Relay #2
13. Output - Form B Relay #2
14. Output - Form B Relay #1
15. Common Source Relay #1
16. Output - Form B Relay #1
DS-IBB110P-R2
www.clare.com
1

1 page




IBB110P pdf
IBB110P
Mechanical Dimensions
16 Pin SOIC (PSuffix)
10.160 ± .051
(.400 ± .002)
1.981 TYP.
(.078)
7.493 ± .051
(.295 ± .002)
1.270 TYP.
(.050)
2.108 MAX.
(.083)
1.016
(.040)
7.493 ± .127
(.295 ± .005)
.254
(.010)
10.363 ± .127
(.408 ± .005)
.406 TYP.
(.016)
8.890 TYP.
(.350)
PC Board Pattern
(Top View)
1.270
(.050)
1.193
(.047)
.787
(.031)
9.728 ± .051
(.383 ± .002)
Tape and Reel Packaging for 16 Pin SOIC Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
6.731 MAX.
(.265)
1.753 ± .102
(.069 ± .004)
.406 MAX.
(.016)
7.493 ± .102
(.295 ± .004)
12.090
(.476)
3.175
(.125)
2.007 ± .102 1.498 ± .102 3.987 ± .102
(.079 ± .004) (.059 ± .004) (.157 ± .004)
1 16
16.002 ± .305
(.630 ± .012)
10.693 ± .025
(.421 ± .001)
Embossed Carrier
Embossment
Top Cover
Tape
.050R TYP.
11.989 ± .102
(.472 ± .004)
10.897 ± .025 1.549 ± .102
(.429 ± .001) (.061 ± .004)
User Direction of Feed
Dimensions
mm
(inches)
Rev. 2
5

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