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PDF TDA7088T Data sheet ( Hoja de datos )
| Número de pieza | TDA7088T | |
| Descripción | FM receiver circuit for battery supply | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA7088T
FM receiver circuit for battery
supply
Product specification
Supersedes data of January 1991
File under Integrated Circuits, IC01
1996 May 14
1 page  
Philips Semiconductors
FM receiver circuit for battery supply
Product specification
TDA7088T
DC CHARACTERISTICS
VP = 3 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
VP
IP
V1
V3
V6, 7
V8
V9, 10, 13
V11, 12
V15
I2
I5
supply voltage (pin 4)
supply current (pin 4)
DC voltage on pin 1
DC voltage on pin 3
DC voltage on pins 6 and 7
DC voltage on pin 8
DC voltage on pins 9, 10 and 13
DC voltage on pins 11 and 12
DC voltage on pin 15
AF output current on pin 2
oscillator current on pin 5
MIN.
1.8
4.2
2.50
2.64
2.38
1.60
2.42
0.91
2.06
45
275
TYP.
3
5.2
2.55
2.69
2.44
1.67
2.47
0.94
2.12
60
375
MAX.
5
6.6
2.60
2.74
2.50
1.74
2.52
0.98
2.18
80
500
UNIT
V
mA
V
V
V
V
V
V
V
µA
µA
AC CHARACTERISTICS
VP = 3 V; Tamb = 25 °C; fiRF = 96 MHz modulated with fmod = 1 kHz and ±22.5 kHz deviation; Vi = 400 µV (measured as
EMF; RS = 75 Ω) and measurements taken in Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Vi(rms)
RF sensitivity input voltage
(RMS value)
VoAF = −3 dB; VoAF = 0 dB
at Vi = 1 mV; see Fig.3
mute off
−
mute on
3
3
6
6 µV
12 µV
-S-----N+-----N--- = 26 dB
−5
10 µV
signal handling
∆f = ±75 kHz; THD < 10% 100
200
−
mV
S------N+-----N---
signal plus noise-to-noise ratio see Fig.3
52 56
−
dB
THD
total harmonic distortion
∆f = ±22.5 kHz
−
∆f = ±75 kHz
−
αAM AM suppression
FM: 1 kHz; ±75 kHz;
AM: 1 kHz; m = 0.8
47
RR1000
ripple rejection
100 mV RMS ripple on VP; 7
f = 1 kHz
Vo(rms)
audio output signal (RMS value) RL = 22 kΩ
60
Search tuning (with BB910 and C16 = 0.1 µF) see Fig.1
V16
minimum output voltage on
limiting point
pin 16
−
∆V/∆t
tuning steepness
voltage at pin 16
95
∆fosc/∆t
∆IAFC/∆V3
oscillator steepness
AFC steepness
voltage at pin 3
1.25
4.75
1 1.4
2.4 3.3
52 −
10 −
85 120
VP − 1.85 −
210 420
2.83 5.6
9.5 19
%
%
dB
dB
mV
V
mV/s
MHz/s
µS
1996 May 14
5
5 Page 
Philips Semiconductors
FM receiver circuit for battery supply
Product specification
TDA7088T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1996 May 14
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TDA7088T.PDF ] | |
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