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PDF TDA4861 Data sheet ( Hoja de datos )
| Número de pieza | TDA4861 | |
| Descripción | Vertical deflection power amplifier for monitors | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA4861
Vertical deflection power amplifier
for monitors
Product specification
Supersedes data of March 1992
File under Integrated Circuits, IC02
1997 Jan 20
1 page  
Philips Semiconductors
Vertical deflection power amplifier for
monitors
Product specification
TDA4861
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6);
unless otherwise specified.
SYMBOL
VP1
VP2
VP3
V2,3,9
V5,7
I4
I5 (M)
I7 (M)
I9
Tstg
Tamb
Tj
Ves
PARAMETER
supply voltage (pin 1)
supply voltage (pin 4)
supply voltage (pin 8)
voltage on pins 2, 3 and 9
voltage on pins 5 and 7
current on pin 4
output current on pin 5 (peak value)
flyback current on pin 7 (peak value)
current on pin 9
storage temperature
operating ambient temperature
junction temperature
electrostatic handling for all pins
CONDITIONS
note 1
note 1
note 2
MIN.
−
−
−
−
−
−
−
−
−
−25
−20
−
−
MAX.
40
60
60
VP1
60
1
±1.5
±1.5
−8
+150
+75
168
±300
UNIT
V
V
V
V
V
A
A
A
mA
°C
°C
°C
V
Notes
1. Internally limited by thermal protection; switching temperature point at 160 ±8 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-mb
thermal resistance from junction to mounting base
VALUE
5
The heatsink can be estimated according to application circuit (see Fig.1):
Rth j-a = Rth j-mb + Rth mb-h + Rth h-a = T----j-(--m-P---a-I-xC--)--(-m–----a-T-x--)-a--m----b- = 1----0---5------°1--C--.-8---–--W---6---5-----°---C--- = 22.2 K/W .
A heatsink is needed at Rth j-mb < 5 K/W and Rth mb-h = 0.5 K/W (using silicon grease) with
Rth h-a = 22.2 K/W − (5 + 0.5) K/W = 16.7 K/W.
UNIT
K/W
1997 Jan 20
5
5 Page 
Philips Semiconductors
Vertical deflection power amplifier for
monitors
Product specification
TDA4861
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Jan 20
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TDA4861.PDF ] | |
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