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PDF TDA4555 Data sheet ( Hoja de datos )
| Número de pieza | TDA4555 | |
| Descripción | Multistandard decoder | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA4555
TDA4556
Multistandard decoder
Product specification
File under Integrated Circuits, IC02
November 1984
1 page  
Philips Semiconductors
Multistandard decoder
Product specification
TDA4555
TDA4556
CHARACTERISTICS
VP = V13-9 = 12 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified
PARAMETER
SYMBOL MIN.
TYP.
MAX. UNIT
Supply (pin 13)
Supply voltage range
Supply current
VP = V13-9
IP = I13
Chrominance part
Chrominance input signal (pin 15)
input voltage with 75% colour bar signal (peak-to-peak
value)
V15-9(p-p)
input impedance
Chrominance output signal (pin 12)
Z15-9
output voltage
(peak-to-peak value)
V12-9(p-p)
output impedance
(n-p-n emitter follower)
Z12-9
d.c. output voltage
Input for delayed signal (pin 10)
V12-9
d.c. input current
input resistance
I10
R10-9
Demodulator part (PAL/NTSC)
Colour difference output signals
output voltage (proportional to V13-9) (peak-to-peak value)
TDA4555
− (R-Y) signal (pin 1)
− (B-Y) signal (pin 3)
TDA4556
V1-9(p-p)
V3-9(p-p)
+ (R-Y) signal (pin 1)
+ (B-Y) signal (pin 3)
Ratio of colour difference output signals
V1-9(p-p)
V3-9(p-p)
(R-Y)/(B-Y)
Residual carrier (subcarrier frequency)
V1/3-9
(peak-to-peak value)
Residual carrier (PAL only)
V1,3-9(p-p)
(peak-to-peak value)
H/2 ripple at (R-Y) output (pin 1)
V1,3-9(p-p)
(peak-to-peak value)
without input signal
V1-9(p-p)
D.C. output voltage
n-p-n emitter follower with internal current source of 0,3 mA V1,3-9
output impedance
Z1, 3-9
10,8 −
− 65
20 100
2,3 3,3
− 1,6
−−
− 8,2
−−
10 −
13,2 V
− mA
200 mV
− kΩ
−V
20 Ω
−V
10 µA
− kΩ
− 1,05 V ± 2 dB − V
− 1,33 V ± 2 dB − V
− 1,05 V ± 2 dB − V
− 1,33 V ± 2 dB − V
− 0,79 ± 10% −
−−
30 mV
− 10
− mV
−−
10 mV
− 7,7
−−
−V
150 Ω
November 1984
5
5 Page 
Philips Semiconductors
Multistandard decoder
Product specification
TDA4555
TDA4556
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1984
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA4555.PDF ] | |
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