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PDF TDA1574 Data sheet ( Hoja de datos )
| Número de pieza | TDA1574 | |
| Descripción | Integrated FM tuner for radio receivers | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA1574
Integrated FM tuner for radio
receivers
Product specification
File under Integrated Circuits, IC01
February 1985
1 page  
Philips Semiconductors
Integrated FM tuner for radio receivers
Product specification
TDA1574
CHARACTERISTICS
VP = V15-4 = 8,5 V; Tamb = 25 °C; measured in test circuit Fig.1; unless otherwise specified
PARAMETER
SYMBOL MIN. TYP.
Supply (pin 15)
Supply voltage
Supply current (except mixer)
Reference voltage (pin 5)
Mixer
VP = V15-4
IP = I15
V5-4
7
16
3,9
−
23
4,1
D.C. characteristics
Input bias voltage (pins 1 and 2)
Output voltage (pins 16 and 17)
Output current (pin 16 + pin 17)
A.C. characteristics (fi = 98 MHz)
Noise figure
Noise figure including transforming network
3rd order intercept point
Conversion power gain
10 log 4-----(--(-V-E---M-M----(-F-o---u1--t--)-9--1-8--0---M-,-7---H--M--z----)H---2--z---)--2 × R-R----MS----1L-
V1,2-4
V16,17-4
I16 + I17
−
4
−
NF
NF
EMF1IP3
−
−
−
GP −
1
−
4,0
9
11
115
14
MAX. UNIT
16 V
30 mA
4,4 V
−V
35 V
− mA
− dB
− dB
− dBµV
− dB
Input resistance (pins 1 and 2)
Output capacitance (pins 16 and 17)
Oscillator
D.C. characteristics
Input voltage (pins 7 and 8)
Output voltage (pin 6)
A.C. characteristics (fosc = 108,7 MHz)
Residual FM (Bandwidth 300 Hz to 15 kHz);
de-emphasis = 50 µs
R1,2-4
C16,17
−
−
14 −
13 −
Ω
pF
V7,8-4 − 1,3 − V
V6-4 − 2 − V
∆f − 2,2 − Hz
February 1985
5
5 Page 
Philips Semiconductors
Integrated FM tuner for radio receivers
Product specification
TDA1574
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 1985
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA1574.PDF ] | |
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