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PDF TD62505P Data sheet ( Hoja de datos )

Número de pieza TD62505P
Descripción 7 SINGLE DRIVER
Fabricantes Toshiba 
Logotipo Toshiba Logotipo



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No Preview Available ! TD62505P Hoja de datos, Descripción, Manual

TD62501~507P/F
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62501P,TD62501F,TD62502P,TD62502F,TD62503P,TD62503F,TD62504P
TD62504F,TD62505P,TD62505F,TD62506P,TD62506F,TD62507P,TD62507F
7CH SINGLE DRIVER
TD62501, 502, 503, 504P / F : COMMON EMITTER
TD62505, 506P / F
: COMMON COLLECTOR
TD62507P / F
: ISOLATED
The TD62501P / F Series are comprised of seven or five NPN
Transistor Arrays.
For proper operation, the substrate (SUB) must be connected to
the most negative voltage.
Applications include relay, hammer, Lamp and display (LED)
drivers.
FEATURES
l Output Current (Single Output) 200 mA MAX.
l High Sustaining Voltage Output 35 V MIN.
l Inputs Compatible with Various Types of Logic.
l TD62501P / F, TD62505P / F and TD62507P / F: Using
external resistor···General Purpose
l TD62502P / F
: RIN = 10.5 k+ 7V Zener Diode···14~25 V PMOS
l TD62503P / F, TD62506P / F
: RIN = 2.7 k···TTL, 5 V CMOS
l TD62504P / F, : RIN = 10.5 k···6~15 V PMOS, CMOS
l Package TypeP : DIP16 pin
l Package TypeF : SOP16 pin
Weight
DIP16P3002.54A : 1.11 g (Typ.)
SOP16P2251.27 : 0.16 g (Typ.)
1 2001-07-04

1 page




TD62505P pdf
TEST CIRCUIT
1. ICEX
2. hFE, VCE (sat)
TD62501~507P/F
3. VIN (ON)
4. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 , tr 5 ns, tf 10 ns
Note 2: See below
INPUT CONDITION
TYPE NUMBER
TD62501P / F
TD62502P / F
TD62503P / F
TD62504P / F
TD62505P / F
TD62506P / F
TD62507P / F
RI
2.7 k
0
0
0
2.7 k
0
2.7 k
Note 3: CL includes probe and jig capacitance
VIH
3V
15 V
3V
10 V
3V
3V
3V
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
shortcircuit between outputs, air contamination fault, or fault by improper grounding.
5 2001-07-04

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