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PDF X0202MA Data sheet ( Hoja de datos )

Número de pieza X0202MA
Descripción 1.25A SCRs
Fabricantes STMicroelectronics 
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No Preview Available ! X0202MA Hoja de datos, Descripción, Manual

®
SENSITIVE
X02 Series
1.25A SCRs
MAIN FEATURES:
Symbol
Value
Unit
IT(RMS)
1.25 A
VDRM/VRRM
600 and 800
V
IGT
50 to 200
µA
DESCRIPTION
Thanks to highly sensitive triggering levels, the
X02 SCR series is suitable for all applications
where the available gate current is limited, such as
ground fault circuit interruptors, overvoltage
crowbar protection in low power supplies,
capacitive ignition circuits, ...
Available in though-hole or surface-mount
packages, these devices are optimized in forward
voltage drop and inrush current capabilities, for
reduced power losses and high reliability in harsh
environments.
A
G
K
TO-92
(X02xxA)
SOT-223
(X02xxN)
ABSOLUTE RATINGS (limiting values)
Symbol
IT(RMS)
IT(AV)
ITSM
I²t
dI/dt
IGM
PG(AV)
Tstg
Tj
Parameter
RMS on-state current
(180° conduction angle)
Average on-state current
(180° conduction angle)
Non repetitive surge peak on-state
current
I²t Value for fusing
Critical rate of rise of on-state current
IG = 2 x IGT , tr 100 ns
Peak gate current
TO-92
SOT-223
TO-92
SOT-223
tp = 8.3 ms
tp = 10 ms
tp = 10 ms
F = 60 Hz
tp = 20 µs
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
TI = 55°C
Ttab = 95°C
TI = 55°C
Ttab = 95°C
Tj = 25°C
Tj = 25°C
Value
1.25
0.8
25
22.5
2.5
Tj = 125°C
50
Tj = 125°C
Tj = 125°C
1.2
0.2
- 40 to + 150
- 40 to + 125
Unit
A
A
A
A2S
A/µs
A
W
°C
September 2000 - Ed: 3
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1 page




X0202MA pdf
X02 Series
Fig. 8: Surge peak on-state current versus
number of cycles.
Fig. 9: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding value of I²t.
ITSM(A)
25
20 tp=10ms
Onecycle
Nonrepetitive
15 Tjinitial=25°C
10
Repetitive
Tamb=25°C
5
Number of cycles
0
1 10 100 1000
ITSM(A), I2t(A2S)
300
100
10
1
0.01
tp(ms)
0.10 1.00
10.00
Fig. 10: On-state characteristics (maximum
values).
Fig. 11: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 µm)
(SOT-223).
ITM(A)
3E+1
1E+1
1E+0
VTM(V)
1E-1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Rth(j-a) (°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10 S(cm2)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
PACKAGE MECHANICAL DATA
TO-92 (Plastic)
A
BC
F
D
E
DIMENSIONS
REF.
Millimeters
Inches
a Min. Typ. Max. Min. Typ. Max.
A 1.35
0.053
B
4.70
0.185
C 2.54
0.100
D 4.40
0.173
E 12.70
0.500
F
3.70
0.146
a
0.50
0.019
5/6

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