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PDF UPD4715A Data sheet ( Hoja de datos )

Número de pieza UPD4715A
Descripción RS-232 LINE DRIVER/RECEIVER
Fabricantes NEC 
Logotipo NEC Logotipo



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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4715A
RS-232 LINE DRIVER/RECEIVER
The µPD4715A is a high-voltage silicon gate CMOS line driver/reciever conforming to the EIA/TIA-232-E standard.
It can operate with a single +5 V power source because it is provided with a DC-DC converter. In addition, this line
driver/receiver has many ancillary functions, including output control, threshold select, and standby functions.
Because the µPD4715A is provided with five output driver circuits and three receiver circuits, it can constitute an
RS-232 interface circuit with a single chip.
FEATURES
• Conforms to EIA/TIA-232-E (RS-232C) standard
• +5 V single power source
• Threshold select pin selecting two types of threshold voltages
• Standby mode can be set by making standby pin high to reduce circuit current.
• Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode.
ORDERING INFORMATION
Part Number
µPD4715ACY
µPD4715AGT
Package
28-pin plastic DIP (400 mil)
28-pin plastic SOP (375 mil)
Document No.S10323EJ3V1DS00 (3rd edition)
Date Published April 1997 N
Printed in Japan
© 1995

1 page




UPD4715A pdf
µPD4715A
ELECTRICAL CHARACTERISTICS (OVERALL)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Circuit current
Circuit current
Standby circuit current
Standby low-level
input voltage
Standby high-level
input voltage
Standby high-level
input current
Standby low-level
input current
Input capacitance
Symbol
Conditions
MIN.
VCC = +5 V, no load, RIN pin open
ICC1 (Standby pin open)
VCC = +5 V, RL = 3 k(DOUT), DIN = GND,
ICC2 RIN and ROUT pins open
(Standby pin open)
ICC VCC = +5 V, no load, RIN pin open
(Standby) (Standby pin high)
VIL Note 3
(Standby)
VIH
(Standby)
2.0
IIH VCC = +5.5 V
(Standby) VI = 5.5 V
IIL VCC = +5.5 V
(Standby) VI = 0 V
Driver input and receiver input
CIN VCC = +5 V, vs. GND, f = 1 MHz
TYP.
9.0
25.0
50
MAX.
18.0
40.0
120
0.8
100
–1
10
Unit
mA
mA
µA
V
V
µA
µA
pF
* TYP.: Typical (reference) value at TA = 25 ˚C.
Note 3. Because the standby pin is internally pulled down, if the standby pin is left open, operating mode is in
effect.
ELECTRICAL CHARACTERISTICS (DRIVER)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Low-level input voltage
High-level input voltage
Low-level input current
High-level input current
Output voltage
Output short current
Slew rate
Propagation delay time Note 4
Output resistance
Standby output transition time
Standby output transition time
Symbol
VIL
VIH
IIL
IIH
VDO
ISC
SR
tPHL
tPLH
RO
tDAZ
tDZA
Conditions
VCC = +5.0 V, RL = , TA = 25 ˚C
VCC = +5.0 V, RL = 3 k
VCC = +4.5 V, RL = 3 k,
VCC = +5.0 V, vs. GND
CL = 10 pF, RL = 3 to 7 k
CL = 2500 pF, RL = 3 to 7 k
RL = 3.5 k, CL = 2500 pF
VCC = VDD = VSS = 0 V
VOUT = ±2 V
Note 5
Note 5
* TYP.: Typical (reference) value at TA = 25 ˚C.
MIN.
2.0
0
0
±5.5
±5.0
1.5
1.5
TYP. MAX.
0.8
±9.7
–1.0
1.0
±15 ±40
9 30
5 30
Unit
V
V
µA
µA
V
V
V
mA
V/µs
V/µs
0.8 µs
300
4 10 µs
25 50 ms
5

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UPD4715A arduino
µPD4715A
RECOMMENDED SOLDERING CONDITIONS
Soldering the µPD4715A under the conditions listed in the table below is recommended.
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of the surface mount type, refer to Information document
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
µPD4715AGT
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin partial heating
Soldering Condition
Package peak temperature: 235 ˚C, Time: 30 seconds MAX.
(210 ˚C MIN.), Number of times: 2, Number of days: not
limited*
Package peak temperature: 215 ˚C, Time: 40 seconds MAX.
(200 ˚C MIN.), Number of times: 2, Number of days: not
limited*
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds
MAX., Number of times : 1, Number of days: not limited*
Pin temperature: 300 ˚C MAX (lead temperature), Time: 3
seconds MAX. (per lead pin), Number of days: not limited*
Recommended Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
* The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Throught-hole type
µPD4715ACY
Soldering Method
Wave soldering
Soldering Conditions
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX.
REFERENCE DOCUMENTS
“NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212)
“Quality Grade on NEC Semiconductor Devices” (IEI-1209)
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
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