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PDF UPD4712D Data sheet ( Hoja de datos )

Número de pieza UPD4712D
Descripción RS-232 LINE DRIVER/RECEIVER
Fabricantes NEC 
Logotipo NEC Logotipo



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No Preview Available ! UPD4712D Hoja de datos, Descripción, Manual

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4712C/4712D
RS-232 LINE DRIVER/RECEIVER
The µPD4712C and 4712D are high-voltage silicon gate CMOS line driver/reciever conforming to the
EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter.
In addition, this line driver/receiver has many ancillary functions, including output control, threshold select, and
standby functions. Because the µPD4712C and 4712D are provided with four output driver circuits and four receiver
circuits, it can constitute an RS-232 interface circuit with a single chip.
FEATURES
• Conforms to EIA/TIA-232-E (RS-232C) standard
• +5 V single power source
• Threshold select pin selecting two types of threshold voltages
• Standby mode can be set by making standby pin high to reduce circuit current.
• Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode.
ORDERING INFORMATION
Part Number
µPD4712CCY
µPD4712DCY
µPD4712CGT
µPD4712DGT
Package
28-pin plastic DIP (400 mil)
28-pin plastic DIP (400 mil)
28-pin plastic SOP (375 mil)
28-pin plastic SOP (375 mil)
Document No. S10316EJ3V1DS00 (3rd edition)
Date Published April 1997 N
Printed in Japan
© 1995

1 page




UPD4712D pdf
µPD4712C/4712D
ELECTRICAL CHARACTERISTICS (DRIVER)
(Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF)
Parameter
Low-level input voltage
High-level input voltage
Low-level input current
High-level input current
Output voltage
Output short current
Slew rate
Propagation delay time Note 4
Output resistance
Standby output transition time
Standby output transition time
Symbol
VIL
VIH
IIL
IIH
VDO
ISC
SR
tPHL
tPLH
RO
tDAZ
tDZA
Conditions
VCC = +5.0 V, RL = , TA = 25 ˚C
VCC = +5.0 V, RL = 3 k
VCC = +4.5 V, RL = 3 k
VCC = +5.0 V, vs. GND
CL = 10 pF, RL = 3 to 7 k
CL = 2500 pF, RL = 3 to 7 k
RL = 3.5 k, CL = 2500 pF
VCC = VDD = VSS = 0 V
VOUT = ±2 V
Note 5
Note 5
MIN.
2.0
0
0
±5.5
±5.0
1.5
1.5
TYP.
±9.7
±15
9
5
MAX.
0.8
–1.0
1.0
±40
30
30
Unit
V
V
µA
µA
V
V
V
mA
V/µs
V/µs
0.8 µs
300
4
25
10 µs
50 ms
* TYP.: Typical (reference) value at TA = 25 ˚C.
Note 4. Test point
If the output control pin is made low, the driver output goes low regardless of the driver input state.
6 ns 6 ns
Driver input
5
90 %
1.5 V
0
10 %
Driver output
VOH
VOL
tPLH
10 %
3V
–3 V
SR
10 %
90 %
1.5 V
tPHL
3V
–3 V
90 %
SR
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UPD4712D arduino
µPD4712C/4712D
RECOMMENDED SOLDERING CONDITIONS
Soldering the µPD4712C and 4712D under the conditions listed in the table below is recommended.
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of the surface mount type, refer to Information document
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
µPD4712CGT, 4712DGT
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin partial heating
Soldering Condition
Package peak temperature: 235 ˚C, Time: 3 0 seconds MAX.
(210 ˚C MIN.), Number of times: 2, Number of days: not
limited*
Package peak temperature: 215 ˚C, Time: 40 seconds MAX.
(200 ˚C MIN.), Number of times: 2, Number of days: not
limited*
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds
MAX., Number of times: 1, Number of days: not limited*
Pin temperature: 300 ˚C MAX. (lead temperature), Time: 3
seconds MAX. (per lead pin), Number of days: not limited*
Recommended Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
* The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Throught-hole type
µPD4712CCY, 4712DCY
Soldering Method
Wave soldering
Soldering Conditions
Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX.
REFERENCE DOCUMENTS
“NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212)
“Quality Grade on NEC Semiconductor Devices” (IEI-1209)
“Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00)
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