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PDF UPC2776T Data sheet ( Hoja de datos )

Número de pieza UPC2776T
Descripción 2.7 GHz SILICON MIMIC WIDE BAND AMPLIFIER
Fabricantes NEC 
Logotipo NEC Logotipo



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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC2776TB
5 V, SUPER MINIMOLD SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
DESCRIPTION
The µPC2776TB is a silicon monolithic integrated circuits designed as wideband amplifier. This amplifier has
impedance near 50 in HF band, so this IC suits to the system of HF to L band. This IC is packaged in super
minimold package which is smaller than conventional minimold.
The µPC2776TB has compatible pin connections and performance to the µPC2776T of conventional minimold
version. So, in the case of reducing your system size, the µPC2776TB is suitable to replace from the µPC2776T.
These IC is manufactured using NEC’s 20 GHz fT NESAT™ III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting: 6-pin super minimold package
• Wideband response
: fu = 2.7 GHzTYP. @ 3 dB bandwidth
• Medium output power
: Po (1 dB) = +6.5 dBm @ f = 1 GHz with external inductor
• Supply voltage
: VCC = 4.5 to 5.5 V
• Power gain
: GP = 23 dBTYP. @ f = 1 GHz
• Port impedance
: input/output 50
APPLICATION
• Systems required wideband operation from HF to 2.0 GHz
ORDERING INFORMATION
PART NUMBER
µPC2776TB-E3
PACKAGE
6-pin super minimold
MARKING
C2L
SUPPLYING FORM
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3 kp/reel.
Remarks To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order: µPC2776TB)
Caution: Electro-static sensitive devices
Document No. P12680EJ2V0DS00 (2nd edition)
Date Published February 1998 N CP(K)
Printed in Japan
© 1997

1 page




UPC2776T pdf
Illustration of the application circuit assembled on evaluation board
µPC2776TB
AMP-2
Top View
IN
Mounting direction
C
OUT
C
L
VCC
C
Component List
Value
C 1 000 pF
L 100 nH, etc
Notes
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
3. Solder plated on pattern
4. : Through holes
5

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UPC2776T arduino
µPC2776TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (e.g. 1 000 pF) should be attached to VCC pin.
(4) The inductor must be attached between VCC and output pin (e.g. 100 nH)
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and condi-
tions than the recommended conditions are to be consulted with our sales representatives.
µPC2776TB
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 °C, Hour: within 30 s.
(more than 210 °C), Time: 3 times, Limited days: no.Note
Package peak temperature: 215 °C, Hour: within 40 s.
(more than 200 °C), Time: 3 times, Limited days: no.Note
Soldering tub temperature: less than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300 °C, Hour: within 3 s/pin.
Limited days: no.Note
Recommended condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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