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PDF UPC2758TB Data sheet ( Hoja de datos )
| Número de pieza | UPC2758TB | |
| Descripción | SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE | |
| Fabricantes | NEC | |
| Logotipo |  |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC2757TB, µPC2758TB
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
FOR CELLULAR/CORDLESS TELEPHONE
DESCRIPTION
The µPC2757TB and µPC2758TB are silicon monolithic integrated circuit designed as 1st frequency down-
converter for cellular/cordless telephone receiver stage. The ICs consist of mixer and local amplifier. The
µPC2757TB features low current consumption and the µPC2758TB features improved intermodulation. From these
two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller
package than conventional T suffix ICs contribute to reduce your system size.
The µPC2757TB and µPC2758TB are manufactured using NEC’s 20 GHz fT NESAT™||| silicon bipolar process.
This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from
external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Wideband operation
• High-density surface mounting
• Low current consumption
• Supply voltage
• Minimized carrier leakage
• Equable output impedance
• Built-in power save function
: fRFin = 0.1 to 2.0 GHz, fIFin = 20 to 300 MHz
: 6-pin super minimold package
: ICC = 5.6 mA TYP. @ µPC2757TB
ICC = 11 mA TYP. @ µPC2758TB
: VCC = 2.7 to 3.3 V
: Due to double balanced mixer
: Single-end push-pull IF amplifier
APPLICATIONS
• Cellular/cordless telephone up to 2.0 GHz MAX. (example: GSM, PDC800M, PDC1.5G and so on): µPC2758TB
• Cellular/cordless telephone up to 2.0 GHz MAX. (example: CT1, CT2 and so on): µPC2757TB
ORDERING INFORMATION
Part Number
µPC2757TB-E3
µPC2758TB-E3
Package
6-pin
super
minimold
Markings
C1X
C1Y
Supplying Form
Embossed tape 8 mm wide.
Pin 1, 2, 3 face the tape perforation side.
Qty 3kpcs/reel.
Product Type
Low current consumption
High OIP3
Remark To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order: µPC2757TB, µPC2758TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12771EJ2V0DS00 (2nd edition)
Date Published June 2000 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1997, 2000
1 page  
µPC2757TB, µPC2758TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Power Dissipation of Package Allowance
Operating Ambient Temperature
Storage Temperature
PS Pin Voltage
Symbol
VCC
PD
TA
Tstg
VPS
Conditions
TA = +25°C
Mounted on 50 × 50 × 1.6 mm
double sided copper clad epoxy
glass board at TA = +85°C
TA = +25°C
Ratings
5.5
200
Unit
V
mW
–40 to +85
–55 to +150
5.5
°C
°C
V
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating Ambient Temperature
LO Input Level
Symbol
VCC
TA
PLOin
MIN.
2.7
–40
–15
TYP.
3.0
+25
–10
MAX.
3.3
+85
0
Unit
V
°C
dBm
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VPS = 3.0 V, PLOin = –10 dBm, ZS = ZL = 50 Ω)
Parameter
Circuit Current
RF Frequency
Response
IF Frequency
Response
Conversion Gain 1
Conversion Gain 2
Single Sideband
Noise Figure 1
Single Sideband
Noise Figure 2
Saturated Output
Power 1
Saturated Output
Power 2
Symbol
Conditions
µPC2757TB
MIN. TYP. MAX.
µPC2758TB
MIN. TYP. MAX.
Unit
ICC No input signal
fRF CG ≥ (CG1 –3 dB)
fIFout = 130 MHz constant
fIF CG ≥ (CG1 –3 dB)
fRFin = 0.8 GHz constant
3.7 5.6 7.7 6.6 11 14.8 mA
0.1 − 2.0 0.1 − 2.0 GHz
20 − 300 20 − 300 MHz
CG1
fRFin = 0.8 GHz, fIFout = 130 MHz
12
15
18
16
19
22
dB
PRFin = –40 dBm, Upper local
CG2
fRFin = 2.0 GHz, fIFout = 250 MHz
10
13
16
14
17
20
dB
PRFin = –40 dBm, Lower local
SSB • NF1 fRFin = 0.8 GHz, fIFout = 130 MHz,
SSB mode, Upper local
−
10 13
−
9 12 dB
SSB • NF2 fRFin = 2.0 GHz, fIFout = 250 MHz, − 13 16 − 13 15 dB
SSB mode, Lower local
PO(sat) 1 fRFin = 0.8 GHz, fIFout = 130 MHz –11
–3
−
–7 +1
− dBm
PRFin = –10 dBm, Upper local
PO(sat) 2 fRFin = 2.0 GHz, fIFout = 250 MHz –11
–8
−
–7 –4
− dBm
PRFin = –10 dBm, Lower local
Data Sheet P12771EJ2V0DS00
5
5 Page 
µPC2757TB, µPC2758TB
TYPICAL CHARACTERISTICS (TA = +25°C, on Measurement Circuit)
− µPC2758TB −
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
20
no signals
VCC = VPS
15
10
5
0
0123456
Supply Voltage VCC (V)
SSB NOISE FIGURE vs. RF INPUT FREQUENCY
20
VCC = VPS = 3.0 V
PRFin = –40 dBm
PLOin = –10 dBm
fIFout = 130 MHz
15
10
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0
RF Input Frequency fRFin (GHz)
CONVERSION GAIN vs. LO INPUT LEVEL
25
20
15
10
5
0
–5
–50
VCC = VPS = 3.0 V
fRFin = 800 MHz
fLOin = 930 MHz
PRFin = –40 dBm
–40 –30 –20 –10 0
LO Input Level PLOin (dBm)
10
CONVERSION GAIN vs. RF INPUT FREQUENCY
24 VCC = VPS = 3.0 V
PRFin = –40 dBm
22 PLOin = –10 dBm
fIFout = 130 MHz
20
18
16
14
12
10
0 0.5 1.0 1.5 2.0 2.5 3.0
RF Input Frequency fRFin (GHz)
CONVERSION GAIN vs. IF OUTPUT FREQUENCY
20
19
18
17
16
15
14
13
VCC = VPS = 3.0 V
12 PRFin = –40 dBm
11 PLOin = –10 dBm
fRFin = 800 MHz
10
0 100 200 300 400 500 600
IF Output Frequency fIFout (MHz)
CONVERSION GAIN vs. LO INPUT LEVEL
25
20
15
10
5
0
–5
–50
VCC = VPS = 3.0 V
fRFin = 2.0 GHz
fLOin = 1.9 GHz
PRFin = –40 dBm
–40 –30 –20 –10 0
LO Input Level PLOin (dBm)
10
Data Sheet P12771EJ2V0DS00
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet UPC2758TB.PDF ] | |
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