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Número de pieza | UPC2723 | |
Descripción | 1.1 GHz AGC AMPLIFIER FOR DBS TUNER AND MOBILE TELEPHONE | |
Fabricantes | NEC | |
Logotipo | ||
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No Preview Available ! DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2723T
1.1 GHz AGC AMPLIFIER
FOR DBS TUNER AND MOBILE TELEPHONE
FEATURES
• Wide frequency response – fu = 1.1 GHzTYP @ – 3 dB GPMAX.
• Maximum power gain – GPMAX. = 13 dBTYP
• Single supply voltage: 5 V, 15 mA TYP.
• AGC Dynamic range: GCR = 38 dB TYP. @ f = 500 MHz
• Packaged in 6 pins mini mold suitable for high-density surface mounting.
DESCRIPTION
The µPC2723T is a silicon monolithic integrated circuit designed for miniature AGC amplifier. This amplifier realizes Auto
gain control with external control circuit. This IC operates up to 1.1 GHz and therefore is suitable for DBS tuner, mobile
telephone and other applications.
The µPC2723T is manufactured using NEC’s 20 GHz fT NESAT™ III silicon bipolar process. This process uses silicon
nitride passivation film and gold metallization wirings. These materials can protect the chips from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
ORDER INFORMATION
ORDER NUMBER
PACKAGE
µPC2723T–E3
6pin mini mold
SUPPLYING FORM
Embossed tape 8mm wide. 3kp/reel.
Pin1, 2, 3 face to perforation side of the tape.
MARKING
C1M
Remarks To order evaluation samples, please contact your local NEC sales office. (Order number: µPC2723T)
PIN CONNECTIONS
(Top View)
(Bottom View)
3
4 1. INPUT
4
3
2. GND
2 5 3. OUTPUT 5 2
4. VCC
5. VAGC
1
6 6. INPUT
6
1
Caution: Electro-static sensitive device
Document No. P10922EJ2V0DS00 (2nd edition)
(Previous No. ID-3258)
Date Published November 1995 P
Printed in Japan
© 1995
1 page TYPICAL CHARACTERISTICS (TA = +25 °C)
20
VAGC = 1.0 V
No input signal
15
ICC – VCC
10
5
0 123456
VCC – Supply Voltage – V
20
15
10
15 5
10 0
5 –5
0.01
NF, GP – f
GPMAX.
VCC = 5.5 V
VCC = 5.0 V
VCC = 4.5 V
VCC = 5.0 V
VAGC = 1.0 V
0.1 1.0
f – Frequency – GHz
3.0
GP – VAGC
20
10
0
RAGC =1 kΩ 15 kΩ
–10
–20
VCC = 5.0 V
f = 500 MHz
–30
0
2
4
VAGC – AGC Control Voltage – V
6
µPC2723T
ICC – Topt
20
VCC = 5.0 V
VAGC = 1.0 V
No input signal
10
–40 –20
0 20 40 60 80
Topt – Operating Temperature – °C
GP – f
20
VCC = 5.0 V
VAGC = 1.0 V
TA = –40 °C
15
TA = +25 °C TA = +85 °C
10
5
0
0.01
0.1 1.0
f – Frequency – GHz
3.0
GP – f
40
VCC = 5.0 V
20 VAGC = 3.3 V
VAGC = 3.6 V
0 VAGC = 3.68 V
VAGC = 3.71 V
–20
VAGC = 3.8 V
–40
–60
0.01
0.1 1.0
f – Frequency – GHz
3.0
5
5 Page µPC2723T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than
the recommended conditions are to be consulted with our sales representatives.
µPC2723T
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 °C,
Hour: within 30 s. (more than 210 °C),
Time: 2 times, Limited days: no.*
Package peak temperature: 215 °C,
Hour: within 40 s. (more than 200 °C),
Time: 2 times, Limited days: no.*
Soldering tub temperature: less than 260 °C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 °C,
Hour: within 3 s/pin.
Limited days: no.*
Recommended
condition symbol
IR35–00-2
VP15–00-2
WS60–00-1
*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207).
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet UPC2723.PDF ] |
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