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PDF UPC2722 Data sheet ( Hoja de datos )

Número de pieza UPC2722
Descripción GENERAL PURPOSE L-BAND DOWN CONVERTER ICs
Fabricantes NEC 
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2721, µPC2722
GENERAL PURPOSE L-BAND DOWN CONVERTER ICs
DESCRIPTION
The µPC2721/2722 are Silicon monolithic ICs designed for L-band down converter. These ICs consist of double
balanced mixer, local oscillator, local oscillation buffer amplifier, IF amplifier, and voltage regulator.
The packages are 8 pin SOP or SSOP suitable for high-density surface mount.
FEATURES
• Wide band operation fRF = 0.9 to 2.0 GHz
• Two products in IF output variation are prepared
µPC2721: Emitter follower output type = 50 constant resistive impedance
µPC2722: Open collector output type = High impedance output dependent on external inductance.
• Single-end push-pull IF amplifier suppresses fluctuation in output impedance.
• Supply voltage: 5 V
• Low current consumption (µPC2721: ICC = 38 mA typ., µPC2722: ICC = 28 mA typ.)
• Packaged in 8 pin SOP or SSOP suitable for high-density mounting
ORDERING INFORMATION
PART NUMBER
µPC2721GR-E1
µPC2722GR-E1
µPC2721GR-E2
µPC2722GR-E2
µPC2721GV-E1
µPC2722GV-E1
PACKAGE
8 pin Plastic SOP (225 mil)
8 pin Plastic SOP (225 mil)
8 pin Plastic SSOP (175 mil)
PACKAGE STYLE
Embossed tape 12 mm wide 2.5 k/REEL.
Pin 1 indicates pull-out direction of tape.
Embossed tape 12 mm wide 2.5 k/REEL.
Pin 1 indicates roll-in direction of tape.
Embossed tape 8 mm wide 1 k/REEL.
Pin 1 indicates pull-out direction of tape.
For evaluation sample order, please contact your local NEC office.
(Part number for sample order: µPC2721GR, µPC2722GR, µPC2721GV, µPC2722GV)
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P11102EJ4V0DS00 (4th edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1996, 1999

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UPC2722 pdf
TYPICAL CHARACTERISTICS (TA = +25 °C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
60
No input signal
50
µPC2721
40
30
20
µPC2722
10
0 123456
VCC – Supply Voltage – V
CONVERSION GAIN AND NOISE FIGURE vs.
INPUT FREQUENCY
30
25 25
VCC = 5 V
PRF = –30 dBm
POSC = –5 dBm
fIF = 402 MHz
CG On test circuit
20 20
µPC2721
15 15
10 10
55
µPC2722
µPC2721
NF
µPC2722
0
0 0.5 1.0 1.5 2.0 2.5 3.0
fin – Input Frequency – GHz
IM3 AND OUTPUT POWER vs. INPUT POWER
+10
0
–10
–20
–30
–40
–50
–60
–40
µPC2721
fRF1 = 900 MHz
fRF2 = 938 MHz
fOSC = 1.3 GHz
fRF1 = 2.0 GHz
fRF2 = 2.038 GHz
fOSC = 2.4 GHz
VCC = 5 V
–30 –20 –10
Pin – Input Power – dBm
0
µPC2721, µPC2722
OUTPUT POWER vs. INPUT POWER
+10
fRF = 2.0 GHz
+5
fRF = 900 MHz
fRF = 2.0 GHz
0
fRF = 900 MHz
–5
–10
–15
–20
–40
VCC = 5 V
fIF = 402 MHz
On test circuit
–30 –20 –10 0 +10
Pin – Input Power – dBm
+20
CONVERSION GAIN vs. IF FREQUENCY
30
25 fRF = 2.0 GHz
20 µPC2721
15
fRF = 900 MHz
10
VCC = 5 V
5
POSC = 0 dBm
PRF = –30 dBm
On test circuit
0 100 200 300 400 500
fIF – IF Frequency – MHz
600
IM3 AND OUTPUT POWER vs. INPUT POWER
+10
0
–10
–20
–30
–40
–50
–60
–40
–30
µPC2722
fRF1 = 900 MHz
fRF2 = 938 MHz
fOSC = 1.3 GHz
fRF1 = 2.0 GHz
fRF2 = 2.038 GHz
fOSC = 2.4 GHz
VCC = 5 V
–20 –10
0
Pin – Input Power – dBm
Data Sheet P11102EJ4V0DS00
5

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UPC2722 arduino
µPC2721, µPC2722
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µPC2721/22
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 3, Exposure limitNote: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 3, Exposure limitNote: None
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limitNote: None
Terminal temperature: 300 °C or below,
Flow time: 3 seconds or below,
Exposure limitNote: None
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except the “Partial heating method”.
Data Sheet P11102EJ4V0DS00
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