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PDF PCD5095 Data sheet ( Hoja de datos )

Número de pieza PCD5095
Descripción DECT baseband controller
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! PCD5095 Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS
DATA SHEET
PCD5095
DECT baseband controller
Objective specification
File under Integrated Circuits, IC17
1997 Nov 19

1 page




PCD5095 pdf
Philips Semiconductors
DECT baseband controller
5 PINNING INFORMATION
5.1 Pinning
handbook, full pagewidth
ANT_SW1 1
ANT_SW0 2
CLK100 3
T_ENABLE 4
T_PWR_RMP 5
T_DATA 6
T_GMSK 7
VCO_BND_SW 8
SYNTH_LOCK 9
S_ENABLE 10
S_DATA 11
S_CLK 12
S_PWR 13
REF_CLK 14
VSS1 15
VDD_RF 16
VDD3V_1 17
SLICE_CTR 18
R_PWR 19
R_DATAP 20
R_DATAM 21
R_ENABLE 22
RSSI_AN 23
VANLI 24
VBAT 25
CLK3 26
DCK 27
DI 28
FS1 29
DO 30
PCD5095
Objective specification
PCD5095
80 TST2
79 TST1
78 VSS4
77 VDD5V_2
76 A16
75 P2.2
74 P2.1
73 P2.0
72 P3.7
71 P3.6
70 P3.5
69 P3.4
68 P3.3
67 P3.2
66 P3.1
65 P3.0
64 VSS3
63 VSS2
62 BZP
61 BZM
60 VDD3V_2
59 P1.7
58 P1.6
57 P1.5
56 P1.4
55 P1.3
54 VDD5V_1
53 R_SLICED
52 DPLL_DATA
51 GP_CLK7
MGL187
1997 Nov 19
Fig.2 Pin configuration (QFP100).
5

5 Page





PCD5095 arduino
Philips Semiconductors
DECT baseband controller
Objective specification
PCD5095
8 SOLDERING
8.1 Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
8.2 Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.
8.3 Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
8.4 Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Nov 19
11

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