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PDF ULN2074B Data sheet ( Hoja de datos )

Número de pieza ULN2074B
Descripción 50V - 1.5A QUAD DARLINGTON SWITCHES
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



Total 8 Páginas
		
ULN2074B Hoja de datos, Descripción, Manual
ULN2064B - ULN2066B
ULN2068B - ULN2070B
ULN2074B - ULN2076B
50V - 1.5A QUAD DARLINGTON SWITCHES
. OUTPUT CURRENT TO 1.5 A EACH DAR-
LINGTON
. MINIMUM BREAKDOWN 50 V
. SUSTAINING VOLTAGE AT LEAST 35 V
. INTEGRAL SUPPRESSION DIODES
(ULN2064B, ULN2066B, ULN2068B and
ULN2070B)
. ISOLATED
DARLINGTON
PINOUT
(ULN2074B, ULN2076B)
. VERSIONS COMPATIBLE WITH ALL POPU-
LAR LOGIC FAMILIES
DESCRIPTION
Designed to interface logic to a wide variety of high
current, high voltageloads, thesedeviceseach con-
tain four NPN darlington switches delivering up to
1.5 A with a specified minimum breakdown of 50 V
and a sustaining voltage of 35 V measured at 100
mA. The ULN2064B, ULN2066B, ULN2068B and
ULN2070B contain integral suppression diodes for
inductive loads have common emitters. The
ULN2074B and ULN2076B feature isolated dar-
lington pinouts and are intended for applications
such as emitter followerconfigurations.Inputsof the
ULN2064B, ULN2068B and ULN2074B are com-
patible with popular 5 V logic families and the
ULN2066B and ULN2076B are compatible with 6-
15 V CMOS and PMOS. Types ULN2068B and
ULN2070Binclude a predriverstageto reduceload-
ing on the control logic.
PIN CONNECTIONS AND ORDER CODES
POWERDIP
12 + 2 + 2
April 1993
ULN2064B
ULN2066B
ULN2068B
ULN2070B
ULN2074B
ULN2076B
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1 page

ULN2074B pdf
ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
MOUNTING INSTRUCTIONS
The Rth j-amb can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Fig. 12) or to an external heatsink (Fig. 13).
The diagram of Figure 14 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ”α” of two equal square copper areas hav-
ing a thickness of 35 µ (1.4 mils).
Figure 12 : Example of P.C. Board Area which is
Used as Heatsink.
During soldering the pins temperature must not ex-
ceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 : ExternalHeatsink Mounting Example.
Figure 14 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
vs. Side ”α”.
Figure 15 : Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.
5/8

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