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PDF PC814X Data sheet ( Hoja de datos )

Número de pieza PC814X
Descripción DEVICE SPECIFICATION FOR PHOTOCOUPLER
Fabricantes Sharp Electrionic Components 
Logotipo Sharp Electrionic Components Logotipo



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No Preview Available ! PC814X Hoja de datos, Descripción, Manual

PREPARED BY:
DATE:
SPEC. No. ED-96 197XB
/I: : .q&l,Li g4fi A, iy$?
APPROVED BY:
DATE:
SW . ISSUE January23, 1998
ELECTRONIC COMPONENTS
GROUP SHARP CORPORATION
SPECI:FICATION
PAGE
10 Pages
REPRESENTATIVE DMSION
II OPTO-ELECTRONIC DEVICES DIV.
DEVICE SPECIFICATION FOR
PHOTOCOUPLER
Business dealing name
MODEL No.
PC814
.
1. These specification sheets include materials protected under copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the Instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas :
* OA equipment * Audio visual equipment - Home appliances
* Telecommunication equipment (Terminal) * Measuring equipment
[ - Tooling machines * Computers
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
- Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
1[- Other safety equipment
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
- Space equipment - Telecommunication equipment (for trunk lines)
[ * Nuclear power control equipment - Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE
BY
DATE
PRESENTED
BY
u“7* PL
T. Matsumura,
Department General Manager of
Engineering Dept.,11
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION

1 page




PC814X pdf
SHARP CORPORRTION
3. Ratings and characteristics
3.1 Absolute maximum ratings
Input
Parameter
*l Forward current
*2 Peak forward current
*l Power dissipation
Collector-emitter voltage
Emitter-collector voltage
ED-96197XB 1 January23. 1998
MODEL No.
t PAGE
PC814X
4/8
Symbol
IF
Im
P
VCEO
vECO
Rating
+50
+1
70
35
6
Ta=25’C
unit
mA
A
mW
V
V
*4 Soldering temperature
*1 The derating factors of absolute maximum ratings due to ambient temperature
are shown in Fig. 1 to 4.
52 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for 1 mm, 40 to 6O%RH
*4 For 10 s

5 Page





PC814X arduino
SHARP CORPORATION
3. Precautions for Soldering Photocouplers
ED-96197XB 1 January23, 1998
MODEL No.
PAGE
PC814X
Attach
sheet- 1
(1) In case of soldering
to lead
260 ‘c 10 s or less
Device
180 -
114600 --
120 -
100
An example of device temperature
vs. soldering time
-
_..-
__--
..-*
_.-- _.--
_..-
.
.D ..--
E
(“C) 40 -
temperature 2i0: --/ -
e;,.S,,dIo,. l,d. ‘,e;r,Ii
‘0 2 4 6 8 10
12 14 16 18 20
Soldering time (s)
(2) If solder reflow :
It is recommended that only one soldering be done at the temperature
and the time within the temperature profile as shown in the figure before.
(3) Other precautions
An infrared lamp used to heat up for soldering may cause a localized
temperature rise In the resin. So keep the package temperature within
that specified in Item (2). Also avoid immersing the resin part in the solder.

11 Page







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