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Número de pieza | PC355 | |
Descripción | Mini-Flat Package/ High Sensitivity Photocoupler | |
Fabricantes | Sharp Electrionic Components | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de PC355 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! PC355NT
PC355NT
Mini-Flat Package,
High Sensitivity Photocoupler
s Features
1. High current transfer ratio
( CTR : MIN. 600% at I F = 1mA, VCE = 2V)
2. Opaque type, mini-flat package
PC355NT (1-channel )
3. Subminirature type
( The volume is smaller than that of our
conventional DIP type by as far as 30%)
4. Isolation voltage between input and output
PC355NT •••Viso : 3 750Vrms
5. Recognized by UL (NO. E64380)
s Package Specifications
Model No.
PC355NT
Taping specifications
Taping reel diameter 178mm (750pcs.)
s Outline Dimensions
(Unit : mm )
PC355NT
2.54 ± 0.25
43
Internal connection
diagram
43
355
1
Anode
mark
2
0.4 ± 0.1
1
3.6 ± 0.3
C0.4
Input side
2
5.3 ± 0.3
1 Anode
2 Cathode
3 Emitter
4 Collector
7.0
+
-
0.2
0.7
0.5
+
-
0.4
0.2
6˚
s Applications
1. Hybrid substrates that require high density
mounting.
2. Programmable controllers
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
1 page Test Circuit For Response Time
Input RD
VCC
Input
RL
Output Output
td ts
tr
10%
90%
tf
PC355NT
Fig.13 Collector-emitter Saturation Voltage
vs. Forward Current
6.4
Ta = 25˚C
IC = 0.5mA
4.8 1mA
3mA
5mA
7mA
3.2 30mA
50mA
1.6
0
0 0.8 1.6 2.4 3.2 4.0
Forward current I F ( mA )
s Temperature Profile of Soldering Reflow
( 1) One time soldering reflow is recommended within the condition of temperature and time
profile shown below.
230˚C
200˚C
180˚C
30 seconds
25˚C
2 minutes
1 minute
1.5 minutes 1 minute
( 2) When using another soldering method such as infrared ray lamp, the temperature may rise
partially in the mold of the device.
Keep the temperature on the package of the device within the condition of above ( 1) .
q Please refer to the chapter “ Precautions for Use.”
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet PC355.PDF ] |
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