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PDF RBO40-40M Data sheet ( Hoja de datos )
| Número de pieza | RBO40-40M | |
| Descripción | REVERSED BATTERY AND OVERVOLTAGE PROTECTION | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de RBO40-40M (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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® RBO40-40G/M/T
Application Specific Discretes
REVERSEDBATTERYAND
A.S.D.TM
OVERVOLTAGEPROTECTIONCIRCUIT (RBO)
FEATURES
PROTECTION AGAINST ”LOAD DUMP” PULSE
40A DIODE TO GUARD AGAINST BATTERY
REVERSAL
MONOLITHIC STRUCTURE FOR GREATER
RELIABILITY
BREAKDOWN VOLTAGE : 24 V min.
CLAMPING VOLTAGE : ± 40 V max.
COMPLIANT WITH ISO / DTR 7637
D2PAK
RBO40-40G
DESCRIPTION
Designed to protect against battery reversal and
load dump overvoltagesin automotiveapplica-
tions, this monolithic component offers multiple
functions in the same package :
D1 : reversed battery protection
T1 : clamping against negative overvoltages
T2 : Transil function against ”load dump” effect.
PowerSO-10TM
RBO40-40M
TO220AB
RBO40-40T
FUNCTIONAL DIAGRAM
1
3
January 1997 - Ed : 3
2
1/15
1 page  
PINOUT configuration in D2PAK :
- Input (1) : Pin 1
- Output (3) : Pin 3
- Gnd (2) : Connected to base Tab
Marking : Logo, date code, RBO40-40G
RBO40-40G / RBO40-40M / RBO40-40T
D1
T2
T1
TAB
PINOUT configuration in PowerSO-10 :
- Input (1) : Pin 1 to 5
- Output (3) : Pin 6 to 10
- Gnd (2) : Connected to base Tab
Marking : Logo, date code, RBO40-40M
Pin 1
D1
Input (1)
T1
Output (3)
T2
Gnd (2)
Tab
TOP VIEW
Pin 6
PINOUT configuration in TO220AB :
- Input (1) : Pin 1
- Output (3) : Pin 3
- GND (2) : Connected to base Tab
Marking : Logo, date code, RBO40-40T
D1
T2
T1
(TAB)
5/15
®
5 Page 
SUBSTRATES AND MOUNTING INFORMATION
The use of epoxy FR4 boards is quite common for
surface mounting techniques, however, their poor
thermal conduction compromises the otherwise
outstanding thermal performance of the
PowerSO-10. Some methods to overcome this
limitation are discussed below.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the
copper layer of the PC board. This leads to a
reduction of thermal resistance to 35 °C for 6 cm2
of the board heatsink (see fig. 2).
Use of copper-filled through holes on conventional
FR4 techniques will increase the metallization and
RBO40-40G / RBO40-40M / RBO40-40T
decrease thermal resistance accordingly. Using
a configurationwith 16 holes under the spreader of
the package with a pitch of 1.8 mm and a diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12°C/W (see fig. 3).
Beside the thermal advantage, this solution allows
multi-layer boards to be used. However, a
drawback of this traditional material prevents its
use in very high power, high current circuits. For
instance, it is not advisable to surface mount
devices with currents greater than 10 A on FR4
boards. A Power Mosfet or Schottky diode in a
surface mount power package can handle up to
around 50 A if better substrates are used.
Fig. 2 : Mounting on epoxy FR4 head dissipation by extending the area of the copper layer
Copper foil
FR4 board
Fig. 3 : Mounting on epoxy FR4 by using copper-filled through holes for heat transfer
Copper foil
FR4 board
heatsink
heat transfer
11/15
®
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet RBO40-40M.PDF ] | |
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