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PDF RHR1K160 Data sheet ( Hoja de datos )

Número de pieza RHR1K160
Descripción 1A/ 600V Hyperfast Diode
Fabricantes Intersil Corporation 
Logotipo Intersil Corporation Logotipo



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Data Sheet
RHR1K160
January 2000
File Number 4789
1A, 600V Hyperfast Diode
The RHR1K160 is a hyperfast diode with soft recovery
characteristics (trr < 25ns). It has half the recovery time of
ultrafast diodes and is silicon nitride passivated ion-
implanted epitaxial planar construction.
This device is intended for use as freewheeling/clamping
diodes and rectifiers in a variety of switching power supplies
and other power switching applications. Its low stored charge
and hyperfast soft recovery minimize ringing and electrical
noise in many power switching circuits reducing power loss
in the switching transistors.
Formerly developmental type TA49185.
Ordering Information
PART NUMBER
PACKAGE
BRAND
RHR1K160
MS-012AA
RHR1K160
NOTE: When ordering, use the entire part number. For ordering in tape
and reel, add the suffix 96 to the part number, i.e. RHR1K16096.
Symbol
NC (1)
ANODE (2)
ANODE (3)
NC (4)
CATHODE (8)
CATHODE (7)
CATHODE (6)
CATHODE (5)
Features
• Hyperfast with Soft Recovery . . . . . . . . . . . . . . . . . . <25ns
• Operating Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .600V
Thermal Impedance SPICE Model
Thermal Impedance SABER™ Model
• Avalanche Energy Rated
• Planar Construction
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Applications
• Switching Power Supplies
• Power Switching Circuits
• General Purpose
Packaging
JEDEC MS-012AA
BRANDING DASH
123 4
5
Absolute Maximum Ratings TA = 25oC, Unless Otherwise Specified
Peak Repetitive Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VRRM
Working Peak Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VRWM
DC Blocking Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VR
Average Rectified Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IF(AV)
TA = 65oC
Repetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFRM
Square Wave, 20kHz
Nonrepetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFSM
Halfwave, 1 Phase, 60Hz
Maximum Power Dissipation (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Avalanche Energy (See Figures 11 and 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAVL
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSTG,TJ
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Tech brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
RHR1K160
600
600
600
1
2
10
2.5
5
-55 to 150
300
260
UNITS
V
V
V
A
A
A
W
mJ
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
3-1 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000
SABER™ is a Copyright of Analogy, Inc.

1 page




RHR1K160 pdf
RHR1K160
Test Circuits and Waveforms (Continued)
L = 20mH
R < 0.1
EAVL = 1/2LI2 [VR(AVL)/(VR(AVL) - VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
LR
CURRENT
SENSE
Q1
+
VDD
DUT
VDD
-
FIGURE 11. AVALANCHE ENERGY TEST CIRCUIT
Thermal Resistance vs Mounting Pad Area
The maximum rated junction temperature, TJM, and the
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, PDM, in an
application. Therefore the application’s ambient temperature,
TA (oC), and thermal resistance RθJA (oC/W) must be
reviewed to ensure that TJM is never exceeded. Equation 1
mathematically represents the relationship and serves as
the basis for establishing the rating of the part.
PDM = -(--T----J-Z--M--θ----J–---A-T----A----)
(EQ. 1)
In using surface mount devices such as the SO-8 package,
the environment in which it is applied will have a significant
influence on the part’s current and maximum power
dissipation ratings. Precise determination of the PDM is
complex and influenced by many factors:
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 13 defines the
RθJA for the device as a function of the top copper
(component side) area. This is for a horizontally positioned
FR-4 board with 2 oz. copper after 1000 seconds of steady
state power with no air flow. This graph provides the
necessary information for calculation of the steady state
VAVL
IL
IV
IL
t0
t1 t2
t
FIGURE 12. AVALANCHE CURRENT AND VOLTAGE
WAVEFORMS
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
350
lnRθJA = 101.6 - 25.82 x (AREA)
300
250
200
217oC/W - 0.0123in2
150
177oC/W - 0.054in2
100
50
0.001
0.01
0.1
1.0
CATHODE MOUNTING AREA, TOP COPPER AREA (in2)
FIGURE 13. THERMAL RESISTANCE vs MOUNTING PAD
AREA
Displayed on the curve are RθJA values listed in the
Electrical Specifications table. These points were chosen to
depict the compromise between the copper board area, the
thermal resistance and ultimately the power dissipation,
PDM. Thermal resistances corresponding to other
component side copper areas can be obtained from Figure
13 or by calculation using Equation 2. The area, in square
inches is the top copper area including the cathode pad
area.
RθJA = 101.6 25.82 × ln (Area)
(EQ. 2)
3-5

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