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PDF RFS04ZG-M6 Data sheet ( Hoja de datos )

Número de pieza RFS04ZG-M6
Descripción RFS Series: 20W / 6.0A DC/DC Converters 36-75V Input 1.5V/ 1.8V/ 2.5V/ 3.3V and 5.0V Outputs
Fabricantes Power-One 
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RFS Series: 20W / 6.0A DC/DC Converters
36-75V Input
1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs
Product Specifications
Oct 2001
Features
Applications
Distributed power architectures
Telecommunications equipment
LAN/WAN applications
Data processing
Single board design
Low profile SMT design
Input/output isolation: 1500 Vdc
High current density
Output over-current protection
Full rated output power up to 80°C with 200
LFM (1 m/s) airflow
Operating temperature to 100°C
Remote shutdown (primary referenced)
Output voltage trim adjust, positive or
negative
UL, CSA and EN/IEC60950 (3rd ed.) approved
Description
The RFS series of converters are low profile, single output, DC/DC converters intended for SMT placement
and reflow soldering. The product provides on-board conversion of standard telecom and datacom input
voltages to isolated low output voltages. Proprietary patented manufacturing processes with full process
automation ensure optimal product quality. These are very high performance, cost effective converters with
a very small PCB footprint.
Model
RFS06ZA-M6
RFS06ZB-M6
RFS06ZD-M6
RFS06ZE-M6
RFS04ZG-M6
Input
voltage,
Vdc
36-75
36-75
36-75
36-75
36-75
Input
current,
max, Adc
0.35
0.45
0.55
0.65
0.65
Selection Chart
Output Output rated
voltage,
current,
Vdc Adc
1.5 6.0
1.8 6.0
2.5 6.0
3.3 6.0
5.0 4.0
Output ripple
and noise,
mVp-p
70
70
75
75
50
Efficiency,
%
77
79
83
85
87
18-Oct-01
Rev 1.0
www.power-one.com
Page 1 of 14

1 page




RFS04ZG-M6 pdf
RFS Series: 20W / 6.0A DC/DC Converters
36-75V Input
1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs
Product Specifications
Oct 2001
Output Specifications
All specifications apply over input voltage, output load and temperature range, unless otherwise noted.
RFS06ZD : 2.5V/6.0A
Parameter
Output Voltage
Setpoint Accuracy
Output Current
Line Regulation
Load Regulation
Dynamic Regulation
Peak Deviation
Settling Time
Output Voltage Ripple
Admissible Load
Capacitance
Output Current Limit
Threshold
Switching Frequency
Temperature
Coefficient
Trim Range
Vo
Io
Vr
Comax
Icl
Fs
Tco
Vt
Conditions/Description
Vin.Nom, Io = 3.0A, 25°C
Vin.Min to Vin.Max
Vin.Min to Vin.Max, 50%
Io.Max
Vin.Nom, Io.Min to Io.Max
50-100% Io.Max load step
change.
to 1% error band
Vin.Min to Vin.Max, Io.Min to
Io Max, 20MHz Bandwidth
Io.Max, Vin.Nom
Vout =0.90 Vo.Nom
Vin.Nom, Io.Max
Io.Min to Io.Max, Vin.Min to
Vin.Max
Min
2.47
0
120
2.25
Nom
2.5
75
220
Max
2.53
Units
Vdc
6.0 Adc
50 mV
50 mV
150
1000
100
± mV
µs
mVp-p
2,200
µF
200 %Io.Max
kHz
0.02 %Vo/°C
2.75 Vo
RFS06ZD Characteristic curves
Vout (V)
3.00
2.50
2.00
1.50
1.00
0.50
0.00
Output Voltage Vs Load
Vin Min
Vin Nom
Vin Max
Iout (A)
Efficiency
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
Efficiency Vs Load
Vin Min
Vin Nom
Vin Max
Iout (A)
18-Oct-01
Rev 1.0
www.power-one.com
Page 5 of 14

5 Page





RFS04ZG-M6 arduino
RFS Series: 20W / 6.0A DC/DC Converters
36-75V Input
1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs
Surface Mount Assembly
Soldering:
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-
One will not honor any warranty claims arising from
failure to observe these instructions.
This product is approved for forced convection
reflow soldering only.
The curves below define the maximum peak reflow
temperature permissible measured on Pins 1 and
10 of the converter.
The lead-frame is constructed from a high
temperature glass filled, UL94V0 flame retardant,
diallyl ortho-phthalate moulding compound
commonly used for packaging of electronics
components. It has passed NASA outgassing
tests and is certified to MIL-M-14. The coefficient
of thermal expansion is equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore
they facilitate visual inspection (manual or
automatic). The leads are formed from a 97% Cu
alloy plated with Cu and Sn 90. This material is
commonly used in the manufacture of integrated
circuits. It has good corrosion resistance and
exhibits the nobility inherent to all high copper
alloys. Unlike brasses, this material is essentially
immune to stress corrosion cracking. It also
exhibits excellent solderability. It is readily wetted
by solders and performs well in standard
solderability tests. (Dip of Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’.
This ensures that there is no contamination or
mechanical stress on the lead-frame so that the co
planarity and solderability are maintained.
The product is shipped in JEDEC trays to
guarantee preservation of the co-planarity and
enable fully automated assembly in the final
application.
Product Specifications
Oct 2001
. Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
300
Peak Temperature
(See fig below)
250
200
150 tp
100
50
0
190 – 450 s
Time (s)
Restriction curve above 215ºC
Peak temp. at pins 1 and 10 (ºC)
245
240
235
230
225
220
215
210
205
200
10 20 30 40 50 60
tp (s)
Pick & Place Assembly:
The product is designed with a large flat area in the
center of the top surface to serve as a pick up point
for automated vacuum pick and place equipment.
The ‘open board’ construction of the unit ensures
that weight is kept to a minimum. However due to
the relatively large size of the component, a large
nozzle (> 4 .0mm, depending on vacuum pressure)
is recommended for picking and placing.
The unit may also be automatically handled using
‘odd-form’ placement equipment, with mechanical
grippers. For this type of equipment the end edges
of the device, which have no leads and also feature
the greatest dimensional accuracy, should be used
as pick-up points.
18-Oct-01
Rev 1.0
www.power-one.com
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