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PDF TDA8356 Data sheet ( Hoja de datos )

Número de pieza TDA8356
Descripción DC-coupled vertical deflection circuit
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! TDA8356 Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS
DATA SHEET
TDA8356
DC-coupled vertical deflection
circuit
Product specification
Supersedes data of 1998 Sep 07
File under Integrated Circuits, IC02
1999 Sep 27

1 page




TDA8356 pdf
Philips Semiconductors
DC-coupled vertical deflection circuit
Product specification
TDA8356
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
DC supply
VP
supply voltage
non-operating
VFB
Vertical circuit
flyback supply voltage
IO(p-p)
VO(A)
Flyback switch
output current (peak-to-peak value)
output voltage (pin 7)
IM peak output current
Thermal data (in accordance with IEC 747-1)
Tstg
Tamb
Tvj
tsc
storage temperature
operating ambient temperature
virtual junction temperature
short-circuiting time
Notes
1. IO maximum determined by current protection.
2. Up to VP = 18 V.
note 1
note 2
THERMAL CHARACTERISTICS
SYMBOL
Rth vj-c
Rth vj-a
PARAMETER
thermal resistance vj-case
thermal resistance vj-ambient
CONDITIONS
in free air
MIN. MAX. UNIT
40 V
25 V
50 V
2A
52 V
− ±1.5 A
55 +150 °C
25 +75 °C
150 °C
1 hr
VALUE
4
40
UNIT
K/W
K/W
1999 Sep 27
5

5 Page





TDA8356 arduino
Philips Semiconductors
DC-coupled vertical deflection circuit
Product specification
TDA8356
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can
be found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must
not exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
PACKAGE
DBS, DIP, HDIP, SDIP, SIL
suitable
DIPPING
SOLDERING METHOD
suitable(1)
WAVE
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 27
11

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