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PDF TDA8008 Data sheet ( Hoja de datos )

Número de pieza TDA8008
Descripción Dual multiprotocol smart card coupler
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! TDA8008 Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS
DATA SHEET
TDA8008
Dual multiprotocol smart card
coupler
Objective specification
File under Integrated Circuits, IC02
1999 Dec 14

1 page




TDA8008 pdf
Philips Semiconductors
Dual multiprotocol smart card coupler
Objective specification
TDA8008
PINNING
SYMBOL
P16
P17
RESET
VDDA
GNDA
CDELAY
INHIB
PRES2
IO2
C82
C42
RST2
VCC2
CLK2
GNDC2
SAM
GNDP
SBM
n.c.
n.c.
n.c.
n.c.
VDDP
SBP
SAP
VUP
GNDC1
CLK1
VCC1
RST1
C41
PRES1
C81
IO1
INTAUX
PIN DESCRIPTION
1 8xC51 general purpose I/O port
2 8xC51 general purpose I/O port
3 reset input: a HIGH on this pin for 2 machine cycles while the oscillator is running, resets the
device. An internal diffused resistor connected to GNDD permits a Power-on reset using an
external capacitor connected to VDDD.
4 analog supply voltage
5 analog ground
6 pin for an external delay capacitor
7 test pin (must be left open-circuit in the application)
8 card 2 presence contact input (active HIGH or LOW by mask option)
9 data line to/from card 2 (ISO C7 contact)
10 auxiliary I/O for ISO C8 contact for card 2 (i.e. synchronous cards)
11 auxiliary I/O for ISO C4 contact for card 2 (i.e. synchronous cards)
12 card 2 reset output (ISO C2 contact)
13 card 2 output supply voltage (ISO C1 contact)
14 clock output of card 2 (ISO C3 contact)
15 ground for card 2
16 contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
17 ground for the step-up converter
18 contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
19 not connected
20 not connected
21 not connected
22 not connected
23 supply voltage for the step-up converter
24 contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
25 contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
26 output of the step-up converter
27 ground for card 1
28 clock output of card 1 (ISO C3 contact)
29 card 1 output supply voltage (ISO C1 contact)
30 card 1 reset output (ISO C2 contact)
31 auxiliary I/O for ISO C4 contact for card 1 (i.e. synchronous cards)
32 card 1 presence contact input (active HIGH or LOW by mask option)
33 auxiliary I/O for ISO C8 contact for card 1 (i.e. synchronous cards)
34 data line to and from card 1 (ISO C7 contact)
35 auxiliary interrupt input
1999 Dec 14
5

5 Page





TDA8008 arduino
Philips Semiconductors
Dual multiprotocol smart card coupler
Objective specification
TDA8008
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW(1)
not suitable
suitable
not suitable(2)
suitable
suitable
suitable
not recommended(3)(4) suitable
not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Dec 14
11

11 Page







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