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PDF TISP3250H3SL Data sheet ( Hoja de datos )
| Número de pieza | TISP3250H3SL | |
| Descripción | DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS | |
| Fabricantes | Power Innovations Limited | |
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TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL
TISP3250H3SL THRU TISP3350H3SL
DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
Copyright © 1999, Power Innovations Limited, UK
JANUARY 1999 - REVISED MAY 1999
TELECOMMUNICATION SYSTEM 2x100 A 10/1000 OVERVOLTAGE PROTECTORS
q Ion-Implanted Breakdown Region
- Precise DC and Dynamic Voltages
SL PACKAGE
(TOP VIEW)
DEVICE
‘3070
‘3080
‘3095
‘3125
‘3135
‘3145
‘3180
‘3210
‘3250
‘3290
‘3350
VDRM
V
58
65
75
100
110
120
145
160
190
220
275
V(BO)
V
70
80
95
125
135
145
180
210
250
290
350
T1
G2
R3
device symbol
T
MDXXAG
R
q Rated for International Surge Wave Shapes
- Guaranteed -40 °C to +85 °C Performance
WAVE SHAPE
STANDARD
2/10 µs
8/20 µs
10/160 µs
10/700 µs
10/560 µs
10/1000 µs
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
FCC Part 68
ITU-T K20/21
FCC Part 68
GR-1089-CORE
ITSP
A
500
300
250
200
160
100
SD3XAA
G
Terminals T, R and G correspond to the
alternative line designators of A, B and C
q 3-Pin Through-Hole Packaging
- Compatible with TO-220AB pin-out
- Low Height. . . . . . . . . . . . . . . . . . . . .8.3 mm
q Low Differential Capacitance
- Value at -2 V/-50 V Bias. . . . . . . .67 pF max.
description
The TISP3xxxH3SL limits overvoltages between the telephone line Ring and Tip conductors and Ground.
Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or
conducted on to the telephone line.
The protector consists of two symmetrical voltage-triggered bidirectional thyristors. Overvoltages are initially
clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to
crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the
overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup
as the diverted current subsides.
This TISP3xxxH3SL range consists of eleven voltage variants to meet various maximum system voltage
levels (58 V to 275 V). They are guaranteed to voltage limit and withstand the listed international lightning
surges in both polarities. These high current protection devices are in a 3-pin single-in-line (SL) plastic
package and are supplied in tube pack. For alternative impulse rating, voltage and holding current values in
SL packaged protectors, consult the factory. For lower rated impulse currents in the SL package, the 35 A
10/1000 TISP3xxxF3SL series is available.
These monolithic protection devices are fabricated in ion-implanted planar structures to ensure precise and
matched breakover control and are virtually transparent to the system in normal operation.
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
1 page  
TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL
TISP3250H3SL THRU TISP3350H3SL
DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
JANUARY 1999 - REVISED MAY 1999
PARAMETER MEASUREMENT INFORMATION
+i
ITSP
Quadrant I
Switching
Characteristic
ITSM
IT
IH
VT
V(BO)
I(BO)
VDRM
-v
IDRM
VD ID
ID VD
VDRM
IDRM
+v
I(BO)
V(BO)
IH
VT
IT
ITSM
Quadrant III
Switching
Characteristic
ITSP
-i
VD = ±50 V and ID = ±10 µA
used for reliability release
PM4XAAC
Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR TERMINAL PAIRS
PRODUCT INFORMATION
5
5 Page 
TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL
TISP3250H3SL THRU TISP3350H3SL
DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
JANUARY 1999 - REVISED MAY 1999
SL003
MECHANICAL DATA
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic com-
pound. The compound will withstand soldering temperature with no deformation, and circuit performance charac-
teristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or
processing when used in soldered assembly.
SL003
10,2 (0.400) MAX
4,57 (0.180)
MAX
Index
Dot
8,31 (0.327)
MAX
12,9 (0.492)
MAX
12
1,854 (0.073) MAX
0,711 (0.028)
0,559 (0.022)
3 Places
4,267 (0.168)
MIN
3
Pin Spacing
2,54 (0.100) T.P.
(see Note A)
2 Places
6,60 (0.260)
6,10 (0.240)
0,356 (0.014)
0,203 (0.008)
3 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
PRODUCT INFORMATION
MDXXAD
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TISP3250H3SL.PDF ] | |
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