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PDF TMP124 Data sheet ( Hoja de datos )

Número de pieza TMP124
Descripción 1.5C Accurate Programmable Digital Temperature Sensors with SPI Interface
Fabricantes Burr-Brown Corporation 
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TMP122
TMP124
SBOS272B – JUNE 2003 – REVISED DECEMBER 2003
1.5°C Accurate Programmable
Digital Temperature Sensors
with SPI™ Interface
FEATURES
q DIGITAL OUTPUT: SPI-Compatible Interface
q PROGRAMMABLE RESOLUTION:
9- to 12-Bits + Sign
q ACCURACY:
±1.5°C from –25°C to +85°C (max)
±2.0°C from –40°C to +125°C (max)
q LOW QUIESCENT CURRENT: 50µA
q WIDE SUPPLY RANGE: 2.7V to 5.5V
q TINY SOT23-6 AND SO-8 PACKAGES
q OPERATION TO 150°C
q PROGRAMMABLE HIGH/LOW SETPOINTS
APPLICATIONS
q POWER-SUPPLY TEMPERATURE MONITORING
q COMPUTER PERIPHERAL THERMAL PROTECTION
q NOTEBOOK COMPUTERS
q CELL PHONES
q BATTERY MANAGEMENT
q OFFICE MACHINES
q THERMOSTAT CONTROLS
q ENVIRONMENTAL MONITORING and HVAC
q ELECTROMECHANICAL DEVICE TEMPERATURE
Temperature
ALERT
1
Diode
Temp.
Sensor
Control
Logic
6 SO/I
GND
2 ∆Σ
A/D
Converter
Serial
Interface
5
CS
V+ 3
OSC
Config
and Temp
Register
4
SCK
DESCRIPTION
The TMP122 and TMP124 are SPI-compatible temperature
sensors available in SOT23-6 and SO-8 packages. Requir-
ing only a pull-up resistor for complete function, the TMP122
and TMP124 temperature sensors are capable of measuring
temperatures within 2°C of accuracy over a temperature
range of –40°C to +125°C, with operation up to 150°C.
Programmable resolution, programmable set points and shut
down function provide versatility for any application. Low
supply current and a supply range from 2.7V to 5.5V make
the TMP122 and TMP124 excellent candidates for low-
power applications.
The TMP122 and TMP124 are ideal for extended thermal
measurement in a variety of communication, computer, con-
sumer, environmental, industrial, and instrumentation appli-
cations.
Temperature
SO/I
1
Diode
Temp.
Sensor
SCK
2 ∆Σ
A/D
Converter
NC 3
GND
4
OSC
Control
Logic
8 V+
Serial
Interface
7
CS
Config
and Temp
Register
6
5
NC
ALERT
TMP122
TMP124
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a registered trademark of Motorola. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
Copyright © 2003, Texas Instruments Incorporated

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TMP124 pdf
APPLICATIONS INFORMATION
The TMP122 and TMP124 digital temperature sensors are
optimal for thermal management and thermal protection appli-
cations. The TMP122/TMP124 are SPI interface-compatible
and specified for a temperature range of 40°C to +125°C.
The TMP122/TMP124 require minimal external components
for operation, needing only a pull-up resistor on the ALERT
pin and a bypass capacitor on the supply. Bypass capacitors
of 0.1µF is recommended. Figure 1 shows typical connec-
tions for the TMP122 and TMP124.
V+ V+
SCK 4
3
1
SO/I 6 TMP122
5
0.1µF
ALERT
(Output)
CS
SO/I
SCK
NC
2
GND
NOTE: Alert requires
pull-up resistor (open drain).
NC indicates pin should be left
open or floating.
8
17
26
TMP124
35
4
0.1µF
CS
NC
ALERT
(Output)
GND
FIGURE 1. Typical Connections of the TMP122 and TMP124.
To maintain accuracy in applications requiring air or surface
temperature measurement, care should be taken to isolate
the package and leads from ambient air temperature.
CS
SO/I
16-Bit
READ
16-Bit
READ
COMMAND
16-Bit
Response
16-Bit
WRITE/
Embedded
Address
16-Bit
READ
FIGURE 2.Multiple Command Sequence.
COMMUNICATING WITH THE TMP122
The TMP122/TMP124 converts continuously. If CS is brought
low during a conversion the conversion process continues, but
the last completed conversion is available at the output regis-
ter. Communication with the TMP122/TMP124 is initiated by
pulling CS low. The first 16 clocks of data transfer will return
temperature data from the temperature sensors. The 16-bit
data word is clocked out sign bit first, followed by the MSB. Any
portion of the 16-bit word may be read before raising CS . If the
user wishes to continue with CS low, the following 16 clocks
transfer in a READ or WRITE command. READ and WRITE
commands are described in Tables I and II.
The READ command contains an embedded address in bits
D4 and D3 to identify which register to read. Bits D4 and D3
are internally registered and will hold their value following a
READ command until a entire 16-bit read is completed by the
user. The completion of the 16-bit READ acknowledges that
the READ command has been completed. If the user issues
a READ command and then raises CS with less than 16
subsequent clocks, the data from that register will be available
at the next fall of CS . The registered READ address will
remain in effect until a full 16 clocks have been received. After
the completion of a 16-bit READ from the part, the READ
address is reset to return data from the Temperature Register.
A WRITE command to a register will not change the READ
address registered. For further discussion on the READ ad-
dress register, see the Read Address Register section.
Multiple commands may be strung together as illustrated in
Figure 2. The TMP122/TMP124 accepts commands alternat-
ing with 16-bit response data. On lowering CS , the part
always responds with a READ from the address location
indicated by the READ address register. If the next com-
mand is a READ command then data is returned from the
address specified by the READ command with the 16th clock
resetting the READ address register to the default tempera-
ture register. The TMP122/TMP124 then expect a 16-bit
command. If the command is a WRITE command, then the
16 clocks following the command will again return tempera-
ture data.
Figures 3, 4, 5, and 6 detail the communication sequences.
Read Command
Temperature
Configuration Register
Low Temp Threshold
High Temp Threshold
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1 0 0 0 0 0 0 00 0 0 0 0 0 0 0
1 0 0 0 0 0 0 00 0 0 0 1 0 0 0
1 0 0 0 0 0 0 00 0 0 1 0 0 0 0
1 0 0 0 0 0 0 00 0 0 1 1 0 0 0
TABLE I. Read Command.
Write Command
Configuration Register
Low Temp Threshold
High Temp Threshold
Shutdown Command
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2
000
T12 T11 T10
T12 T11 T10
xxx
0
T9
T9
x
D1 D0 R1 R0 F1
T8 T7 T6 T5 T4
T8 T7 T6 T5 T4
xxxx1
F0 POL TM1 TM0
T3 T2 T1 T0
T3 T2 T1 T0
111 1
0
1
1
1
TABLE II. Write Command.
D1 D0
10
00
10
11
TMP122, TMP124
SBOS272B
www.ti.com
5

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TMP124 arduino
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PACKAGE OPTION ADDENDUM
9-Dec-2004
PACKAGING INFORMATION
Orderable Device
TMP122AIDBVR
TMP122AIDBVT
TMP124AID
TMP124AIDR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
SOT-23
SOIC
Package
Drawing
DBV
DBV
D
SOIC
D
Pins Package Eco Plan (2)
Qty
6 3000
None
6 250
None
8 100
Pb-Free
(RoHS)
8 2500
Pb-Free
(RoHS)
Lead/Ball Finish MSL Peak Temp (3)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1

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