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PDF X24C00PM Data sheet ( Hoja de datos )

Número de pieza X24C00PM
Descripción Serial E2PROM
Fabricantes Xicor 
Logotipo Xicor Logotipo



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APPLICATION NOTES
AVA I L A B L E
X24C00AN4 • AN12 • AN22 • AN26 • AN32
128 Bit
X24C00
Serial E2PROM
16 x 8 Bit
FEATURES
2.7V to 5.5V Power Supply
128 Bit Serial E2PROM
Low Power CMOS
—Active Current Less Than 3mA
—Standby Current Less Than 50µA
Internally Organized 16 x 8
2 Wire Serial Interface
—Bidirectional Data Transfer Protocol
Byte Mode Write
Self Timed Write Cycle
—Typical Write Cycle Time of 5ms
Push/Pull Output
High Reliability
—Endurance: 100,000 Cycles
—Data Retention: 100 Years
Available Packages
—8-Lead MSOP
—8-Lead PDIP
—8-Lead SOIC
DESCRIPTION
The X24C00 is a CMOS 128 bit serial E2PROM, inter-
nally organized as 16 x 8. The X24C00 features a serial
interface and software protocol allowing operation on a
simple two wire bus.
Xicor E2PROMs are designed and tested for applica-
tions requiring extended endurance. Inherent data re-
tention is greater than 100 years.
The X24C00 is fabricated with Xicor’s Advanced CMOS
Floating Gate technology.
FUNCTIONAL DIAGRAM
PIN CONFIGURATION
SCL CONTROL
LOGIC
SDA
INPUT/
OUTPUT
BUFFER
COMMAND/ADDRESS
REGISTER
SHIFT REGISTER
MEMORY ARRAY
3836 FHD F01
MSOP/DIP/SOIC
NC
NC
NC
VSS
18
27
X24C00
36
45
VCC
NC
SCL
SDA
3836 FHD F02.1
© Xicor, Inc. 1991, 1995, 1996 Patents Pending
3836-1.5 6/10/96 T2/C1/D0 NS
1
Characteristics subject to change without notice

1 page




X24C00PM pdf
X24C00
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias
X24C00 ...................................... –65°C to +135°C
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to VSS ............................................ –1V to +7V
D.C. Output Current ............................................. 5mA
Lead Temperature
(Soldering, 10 seconds) .............................. 300°C
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
Max.
Commercial
Industrial
Military
0°C
–40°C
–55°C
+70°C
+85°C
+125°C
3836 PGM T02.1
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
Supply Voltage
X24C00
X24C00-3
X24C00-2.7
Limits
5V ±10%
3V to 5.5V
2.7V to 5.5V
3836 PGM T03.1
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions unless otherwise specified.)
Symbol
Parameter
Limits
Min.
Max.
Units
Test Conditions
lCC1
ICC2
ISB1
ISB2
ILI
ILO
VlL(1)
VIH(1)
VOL
VOH
VCC Supply Current Read
VCC Supply Current Write
VCC Standby Current
1 mA
3
100 µA
VCC Standby Current
50 µA
Input Leakage Current
Output Leakage Current
Input LOW Voltage
Input HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
–1
VCC x 0.7
VCC – 0.8
10
10
VCC x 0.3
VCC + 0.5
0.4
µA
µA
V
V
V
V
SCL = VCC x 0.1/VCC x 0.9
Levels @ 1MHz, SDA = Open
SCL = SDA = VCC
VCC = 5V ±10%
SCL = SDA = VCC
VCC = 2.7V
VIN = VSS to VCC
VOUT = VSS to VCC
IOL = 2.1mA
IOH = 1mA
3841 PGM T04.3
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol
Parameter
CI/O(2)
CIN(2)
Input/Output Capacitance (SDA)
Input Capacitance (SCL)
Notes: (1) VIL min. and VIH max. are for reference only and are not tested.
(2) This parameter is periodically sampled and not 100% tested.
Max.
8
6
Units
pF
pF
Test Conditions
VI/O = 0V
VIN = 0V
3836 PGM T05.1
5

5 Page





X24C00PM arduino
X24C00
ORDERING INFORMATION
Device
Part Mark Convention
X24C00 X X -X
VCC Range
Blank = 5V ±10%
3 = 3V to 5.5V
2.7 = 2.7V to 5.5V
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
M = Military = –55°C to +125°C
Package
M = 8-Lead MSOP
P = 8-Lead Plastic DIP
S = 8-Lead SOIC
X24C00 X
X
Blank = 8-Lead SOIC
P = 8-Lead Plastic DIP
Blank = 4.5V to 5.5V, 0°C to +70°C
I = 4.5V to 5.5V, –40°C to +85°C
M = 4.5V to 5.5V, –55°C to +85°C
D = 3V to 5.5V, 0°C to +70°C
E = 3V to 5.5V, –40°C to +85°C
F = 2.7V to 5.5V, 0°C to +70°C
G = 2.7V to 5.5V, –40°C to +85°C
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes
no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness tor any purpose. Xicor, Inc. reserves the right to
discontinue production and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,
licenses are implied.
US. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;
4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976;
4,980,859; 5,012,132; 5,003,197; 5,023,694. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with
appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use as critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life,
and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected
to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure
of the life support device or system, or to affect its satety or effectiveness.
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