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PDF XCB170S Data sheet ( Hoja de datos )

Número de pieza XCB170S
Descripción Single Pole OptoMOS Relays
Fabricantes Clare. 
Logotipo Clare. Logotipo



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No Preview Available ! XCB170S Hoja de datos, Descripción, Manual

XCB170
Single Pole OptoMOS® Relays
Load Voltage
Load Current
Max RON
XCB170
350
100
50
Units
V
mA
Features
Small 6 Pin DIP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
3750VRMS Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount and Tape & Reel
Versions Available
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket
Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Description
The XCB170 is a 1-Form-B relay which uses optically
coupled MOSFET technology to provide 3750V of
input to output isolation. The efficient MOSFET switch-
es and photovoltaic die use Clare’s patented
OptoMOS® architecture. A highly efficient GaAIAs
infrared LED controls the optically coupled input. The
device is available in small 6-pin dual in line package
in standard through hole and surface mount lead bend.
Approvals
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
BSI Certified to:
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
BS EN 41003:1993
Certificate #: 7344
Ordering Information
Part #
XCB170
XCB170S
XCB170STR
Description
6 Pin DIP (50/Tube)
6 Pin Surface Mount (50/Tube)
6 Pin Surface Mount (1000/Reel)
Pin Configuration
XCB170 Pinout
AC/DC Configuration
XCB170 Pinout
DC Only Configuration
1
+ Control
2
Control
3
Do Not Use
6
Load
5
Do Not Use
4
Load
1
+ Control
2
Control
3
Do Not Use
6
+ Load
5
Load
4
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
+90%
+10%
TOFF
+90%
TON
DS-XBA170-R2.0
www.clare.com
1

1 page




XCB170S pdf
XCB170
6Pin DIP Through Hole (Standard)
MECHANICAL DIMENSIONS
PC Board Pattern
(Top View)
2.540 ± .127
6-.800 DIA. (.100 ± .005)
(6-.031 DIA.)
6.350 ± .127
(.250 ± .005)
7.620 ± .127
(.300 ± .005)
5.080 ± .127
(.200 ± .005)
6Pin DIP Surface Mount (SSuffix)
PC Board Pattern
(Top View) 2.540 ± .127
(.100 ± .005)
1.905 ± .127
(.075 ± .005)
8.305 ± .127
(.327 ± .005)
1.499 ± .127
(.059 ± .005)
Rev. 2.0
www.clare.com
Dimensions
mm
(inches)
5

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