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PDF XM20C64M-55 Data sheet ( Hoja de datos )

Número de pieza XM20C64M-55
Descripción High Speed AUTOSTORE NOVRAM
Fabricantes Xicor Inc. 
Logotipo Xicor Inc. Logotipo



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No Preview Available ! XM20C64M-55 Hoja de datos, Descripción, Manual

XM20C64
64K
XM20C64
High Speed AUTOSTORENOVRAM
8K x 8
FEATURES
High Speed: tAA = 55ns
NO Batteries!!
Low Power CMOS
AUTOSTORENOVRAM
—Automatically Stores RAM data to E2PROM
upon Power-fail Detection
Open Drain AUTOSTORE Output Pin
—Provides Interrupt or Status Information
—Linkable to System Reset Circuitry
Auto Recall
—Automatically Recalls E2PROM Data During
Power-on
Fully Decoded Module
Full Military Temperature Range
— –55°C to +125°C
High Reliability
—Endurance: 1,000,000 Nonvolatile Store Cycles
—Data Retention: 100 Years
ESD Protection
2KV All Pins
Also Available in 66 Pin PUMA Package
FUNCTIONAL DIAGRAM
DESCRIPTION
The XM20C64 is a high speed nonvolatile RAM Module.
It is comprised of four Xicor X20C16 high speed
NOVRAMs, a high speed decoder and decoupling
capacitors mounted on a co-fired multilayered Ceramic
substrate. The XM20C64 is configured 8K x 8 and is fully
decoded. The module is a 28-lead DIP conforming to the
industry standard pinout for SRAMs.
The XM20C64 fully supports the AUTOSTORE feature,
providing hands-off automatic storing of RAM data
into E2PROM when VCC falls below the AUTOSTORE
threshold.
The XM20C64 is a highly reliable memory component,
supporting unlimited writes to RAM, a minimum 1,000,000
store cycles and a minimum 100 year data retention.
PIN CONFIGURATION
NE
OE
WE
A11 2 A0
A12 3 A1
CE
4
Y0
5
Y1
6
Y2
7
Y3
1
AUTOSTORE
AUTOSTORE™ NOVRAM is a trademark of Xicor, Inc.
©Xicor, Inc. 1991, 1995, 1996 Patents Pending
3874-1.6 6/20/96 T0/C2/D0 NS
2
NE
25
OE
31
WE
23
CE
2
NE
25
OE
31
WE
23
CE
2
NE
25
OE
31
WE
23
CE
2
NE
25
OE
31
WE
23
CE
A0–A10
I/O
30
A0–A10
I/O
30
A0–A10
I/O
30
A0–A10
I/O
30
1
NE
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A0–A10
28 VCC
27 WE
26 AS
25 A8
24 A9
23 A11
22 OE
21 A10
20 CE
19 I/O7
18 I/O6
17 I/O5
16 I/04
15 I/O3
3874 FHD F02.1
I/O0–I/O7
3874 FHD F01
Characteristics subject to change without notice

1 page




XM20C64M-55 pdf
XM20C64
A.C. CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified)
Read Cycle Limits
Symbol
Parameter
Min.
Limits
Max.
tRC
tCE
tAA
tOE
tLZ(3)
tOLZ(3)
tHZ(3)
tOHZ(3)
tOH
Read Cycle Time
Chip Enable Access Time
Address Access Time
Output Enable Access Time
CE Low to Output in Low Z
OE Low to Output in Low Z
CE High to Output in Low Z
OE High to Output in Low Z
Output Hold
55
55
55
30
0
0
0 25
0 25
0
Read Cycle Timing Diagram
tRC
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
3874 PGM T03
ADDRESS
tCE
CE
tOE
OE
tOLZ
tLZ
tHZ
tOH tOHZ
I/O
tAA
3874 FHD F05
Note: (3) tLZ min., tHZ min., tOLZ min., and tOHZ min. are periodically sampled and not 100% tested. tHZ max. and tOHZ max. are
measured from the point when CE or OE return high (whichever occurs first) to the time when the outputs are no longer driven.
MODE SELECTION
CE WE NE
HXX
L HH
L LH
L LL
L HH
L HL
L HL
L LL
OE
X
L
X
H
H
L
H
L
Mode
Module Not Selected
Read RAM Active
Write RAM
Issue Software Command
Output Disabled
Hardware Array Recall
No Operation
Not Allowed
I/O State
High Z
Data Output
Data Input
Data Input
High Z
High Z
High Z
High Z
Power
Standby
Active
Active
Active
Active
Active
Active
Active
3874 PGM T04.1
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XM20C64M-55 arduino
XM20C64
ORDERING INFORMATION
XM20C64: 2K X 8 CMOS NOVRAM Memory Module
Device
XM20C64 X X -X
Access Time
–55 = 55ns
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
M = Military = –55°C to +125°C
MHR = Military High Rel
Blank = 28 Lead Ceramic DIP Module
P = 66 Pin PUMA Module
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and
prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are
implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;
4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and
additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error
detection and correction, redundancy and back-up features to prevent such an occurrence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant
injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
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