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PDF IRF9Z24NL Data sheet ( Hoja de datos )
| Número de pieza | IRF9Z24NL | |
| Descripción | Power MOSFET(Vdss=-55V/ Rds(on)=0.175ohm/ Id=-12A) | |
| Fabricantes | International Rectifier | |
| Logotipo |  |
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l Advanced Process Technology
l Surface Mount (IRF9Z24NS)
l Low-profile through-hole (IRF9Z24NL)
l 175°C Operating Temperature
l P-Channel
l Fast Switching
l Fully Avalanche Rated
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9Z24NL) is available for
low-profile applications.
Absolute Maximum Ratings
G
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TA = 25°C
PD @TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Parameter
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
RθJC
RθJA
www.irf.com
Parameter
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
PD - 91742A
IRF9Z24NS/L
HEXFET® Power MOSFET
D VDSS = -55V
RDS(on) = 0.175Ω
ID = -12A
S
D 2 Pak
T O -26 2
Max.
-12
-8.5
-48
3.8
45
0.30
± 20
96
-7.2
4.5
-5.0
-55 to + 175
300 (1.6mm from case )
Typ.
–––
–––
Max.
3.3
40
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
Units
°C/W
1
7/16/99
1 page  
IRF9Z24NS/L
12
9
6
3
0A
25 50 75 100 125 150 175
TC , C ase Tem perature (°C )
Fig 9. Maximum Drain Current Vs.
Case Temperature
10
VDS
VGS
RG
RD
D.U.T.
-10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
-
+ VDD
Fig 10a. Switching Time Test Circuit
VGS
10%
td(on) tr
td(off) tf
90%
VDS
Fig 10b. Switching Time Waveforms
D = 0.50
1
0 .20
0.10
0.05
0.02
0 .0 1
0.1
S IN G LE P U L S E
(THE R MA L R ES PO NS E )
0.01
0.00001
0.0001
PD M
N otes:
1. D uty factor D = t1 / t 2
t1
t2
2. P eak TJ = P D M x Z thJ C + T C
0.001
0.01
0.1
t1 , Rectangular Pulse D uration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
A
1
5
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet IRF9Z24NL.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| IRF9Z24N | Power MOSFET(Vdss=-55V/ Rds(on)=0.175ohm/ Id=-12A) | International Rectifier |
| IRF9Z24NL | Power MOSFET(Vdss=-55V/ Rds(on)=0.175ohm/ Id=-12A) | International Rectifier |
| IRF9Z24NLPBF | Power MOSFET ( Transistor ) | International Rectifier |
| IRF9Z24NPBF | HEXFET Power MOSFET | International Rectifier |
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