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PDF IRF7702 Data sheet ( Hoja de datos )
| Número de pieza | IRF7702 | |
| Descripción | Power MOSFET(Vdss=-12V) | |
| Fabricantes | International Rectifier | |
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l Ultra Low On-Resistance
l -1.8V Rated
l P-Channel MOSFET
l Very Small SOIC Package
l Low Profile ( < 1.1mm)
l Available in Tape & Reel
PROVISIONAL
VDSS
-12V
PD - 93849C
IRF7702
HEXFET® Power MOSFET
RDS(on) max
0.014@VGS = -4.5V
0.019@VGS = -2.5V
0.027@VGS = -1.8V
ID
-8.0A
-7.0A
-5.8A
Description
HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for, provides thedesigner
with an extremely efficient and reliable device for
battery and load management.
1
2
3G
4
1= D
2= S
3= S
4= G
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.1mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
Absolute Maximum Ratings
VDS
ID @ TC = 25°C
ID @ TC = 70°C
IDM
PD @TC = 25°C
PD @TC = 70°C
VGS
TJ, TSTG
Parameter
Drain- Source Voltage
Continuous Drain Current, VGS @ -4.5V
Continuous Drain Current, VGS @ -4.5V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
D8
7
6
S5
8= D
7= S
6= S
5= D
Max.
-12
±8.0
±7.0
±70
1.5
0.96
0.01
± 8.0
-55 to + 150
TSSOP-8
Units
V
A
W
W/°C
V
°C
Thermal Resistance
RθJA
www.irf.com
Parameter
Maximum Junction-to-Ambient
Max.
83
Units
°C/W
1
6/19/00
1 page  
PROVISIONAL
IRF7702
8.0 40
6.0 30
4.0 20
2.0 10
0.0
25
50 75 100 125
TC , Case Temperature ( °C)
150
Fig 9. Maximum Drain Current Vs.
Case Temperature
0
0.01
0.10 1.00 10.00
Time (sec)
100.00
Fig 10. Typical Power Vs. Time
100
D = 0.50
0.20
10 0.10
0.05
0.02
1 0.01
0.1
0.00001
PDM
t1
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.0001
0.001
Notes:
1. Duty factor D = t1 / t 2
2. Peak TJ = P DM x ZthJA + TA
0.01 0.1
1
t1, Rectangular Pulse Duration (sec)
10
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
www.irf.com
100
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet IRF7702.PDF ] | |
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