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PDF SBL51214N Data sheet ( Hoja de datos )

Número de pieza SBL51214N
Descripción Low Power BIDI Optical Standard Module 1310 nm Emitting/ 1310 nm Receiving
Fabricantes Infineon Technologies AG 
Logotipo Infineon Technologies AG Logotipo



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No Preview Available ! SBL51214N Hoja de datos, Descripción, Manual

Low Power
BIDI® Optical Standard Module
1310 nm Emitting, 1310 nm Receiving
Fiber Optics
SBL52214x
Features
• Designed for application in passive-optical
networks
• Integrated Wavelength Division Multiplexer
(WDM) or Beam Splitter
• Bi-Directional Transmission in one optical window
• Single fiber solution
• FP-Laser Diode with Multi-Quantum Well structure
• Class 3B Laser Product
• Suitable for bit rates up to 1.25 Gbit/s
• Ternary Photodiode at rear mirror for monitoring and control of radiant power
• Low noise / high bandwidth PIN diode
• Hermetically sealed subcomponents, similar to TO 46
• With singlemode fiber pigtail
BIDI® is a registered trademark of Infineon Technologies
Data Sheet
1
2002-05-01

1 page




SBL51214N pdf
SBL52214x
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Module
Operating temperature range at case
Storage temperature range
Soldering temperature (tmax = 10 s,
2 mm distance from bottom edge of case)
Laser Diode
Direct forward current
Radiant power CW
Reverse Voltage
Monitor Diode
Reverse Voltage
Forward Current
Receiver Diode
Reverse Voltage
Forward Current
Optical power into the optical port
Symbol
TC
Tstg
TS
IF max
PF, rad
VR
VR
IF
VR
IF
Pport
Limit Values
min.
max.
–40 85
–40 85
260
120
1
2
10
2
10
2
1.5
Unit
°C
mA
mW
V
V
mA
V
mA
mW
Data Sheet 5 2002-05-01

5 Page





SBL51214N arduino
SBL52214x
Revision History:
2002-05-01
Previous Version:
Page
Subjects (major changes since last revision)
Document’s layout has been changed: 2002-Aug.
DS0
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2002-05-01
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2002.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.

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