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PDF K9K1G08U0A Data sheet ( Hoja de datos )

Número de pieza K9K1G08U0A
Descripción 128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
Fabricantes Samsung semiconductor 
Logotipo Samsung semiconductor Logotipo



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K9K1G08Q0A K9K1G16Q0A
K9K1G08U0A K9K1G16U0A
Document Title
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
Preliminary
FLASH MEMORY
Revision History
Revision No. History
0.0 Initial issue.
0.1 1. Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
2. 63FBGA,1.8V product is added.
K9K1GXXQ0A-GCB0,GIB0,JCB0,JIB0
0.2
Errata is deleted.
AC parameters are changed.
tWC tWH tWP tRC tREH tRP tREA tCEA
Before 45 15 25 50 15 25 30 45
After 60 20 40 60 20 40 40 55
Draft Date Remark
Mar. 17th 2003 Preliminary
Jun. 4th 2003 Preliminary
Aug. 1st 2003
Preliminary
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
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K9K1G08U0A pdf
K9K1G08Q0A K9K1G16Q0A
K9K1G08U0A K9K1G16U0A
Preliminary
FLASH MEMORY
PACKAGE DIMENSIONS
63-Ball FBGA (measured in millimeters)
Top View
Side View
8.50±0.10
0.10 MAX
#A1
Bottom View
A1 INDEX MARK
(Datum A)
8.50±0.10
0.80x9=7.20
10 9 8 7 6 5 4 3 2 1
A
B
A
B
(Datum B) C
D
E
F
G
H
J
K
L
M
0.80
0.32±0.05
1.10±0.10
63-0.45±0.05
0.20 M A B
3.60
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K9K1G08U0A arduino
K9K1G08Q0A K9K1G16Q0A
K9K1G08U0A K9K1G16U0A
Preliminary
FLASH MEMORY
PIN DESCRIPTION
Pin Name
I/O0 ~ I/O7
(K9K1G08X0A)
I/O0 ~ I/O15
(K9K1G16X0A)
Pin Function
DATA INPUTS/OUTPUTS
The I/O pins are used to input command, address and data, and to output data during read operations. The I/
O pins float to high-z when the chip is deselected or when the outputs are disabled.
I/O8 ~ I/O15 are used only in X16 organization device. Since command input and address input are x8 oper-
ation, I/O8 ~ I/O15 are not used to input command & address. I/O8 ~ I/O15 are used only for data input and
output.
COMMAND LATCH ENABLE
CLE
The CLE input controls the activating path for commands sent to the command register. When active high,
commands are latched into the command register through the I/O ports on the rising edge of the WE signal.
ADDRESS LATCH ENABLE
ALE The ALE input controls the activating path for address to the internal address registers. Addresses are
latched on the rising edge of WE with ALE high.
CHIP ENABLE
CE
The CE input is the device selection control. When the device is in the Busy state, CE high is ignored, and
the device does not return to standby mode in program or erase operation. Regarding CE control during
read operation, refer to ’Page read’section of Device operation .
READ ENABLE
RE The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid
tREA after the falling edge of RE which also increments the internal column address counter by one.
WRITE ENABLE
WE The WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of
the WE pulse.
WRITE PROTECT
WP The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage
generator is reset when the WP pin is active low.
READY/BUSY OUTPUT
R/B
The R/B output indicates the status of the device operation. When low, it indicates that a program, erase or
random read operation is in process and returns to high state upon completion. It is an open drain output and
does not float to high-z condition when the chip is deselected or when outputs are disabled.
VccQ
OUTPUT BUFFER POWER
VccQ is the power supply for Output Buffer.
VccQ is internally connected to Vcc, thus should be biased to Vcc.
Vcc
POWER
VCC is the power supply for device.
Vss GROUND
N.C
NO CONNECTION
Lead is not internally connected.
DNU
DO NOT USE
Leave it disconnected.
NOTE : Connect all VCC and VSS pins of each device to common power supply outputs.
Do not leave VCC or VSS disconnected.
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