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PDF K6X8008C2B-TB70 Data sheet ( Hoja de datos )

Número de pieza K6X8008C2B-TB70
Descripción 1Mx8 bit Low Power and Low Voltage CMOS Static RAM
Fabricantes Samsung semiconductor 
Logotipo Samsung semiconductor Logotipo



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No Preview Available ! K6X8008C2B-TB70 Hoja de datos, Descripción, Manual

K6X8008C2B Family
Document Title
1Mx8 bit Low Power and Low Voltage CMOS Static RAM
CMOS SRAM
Revision History
Revision No. History
0.0 Initial draft
0.1 Revised
- Deleted 44-TSOP2-400R package type.
- Added Commercial product.
1.0 Finalized
- Changed ICC from 10mA to 6mA
- Changed ICC1 from 10mA to 7mA
- Changed ICC2 from 50mA to 35mA
- Changed ISB from 3mA to 0.4mA
- Changed ISB1(Commercial) from 40µA to 25µA
- Changed ISB1(industrial) from 40µA to 25µA
- Changed ISB1(Automotive) from 50µA to 40µA
- Changed IDR(Commercial) from 30µA to 15µA
- Changed IDR(industrial) from 30µA to 15µA
- Changed IDR(Automotive) from 40µA to 30µA
Draft Date
October 31, 2002
Remark
Preliminary
December 11, 2002 Preliminary
September 16, 2003 Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
products. SAMSUNG Electronics will answer to yourquestions about device. If you have any questions, please contact the SAMSUNG branch offices.
1 Revision 1.0
September 2003

1 page




K6X8008C2B-TB70 pdf
K6X8008C2B Family
CMOS SRAM
AC OPERATING CONDITIONS
TEST CONDITIONS(Test Load and Input/Output Reference)
Input pulse level: 0.8 to 2.4V
Input rising and falling time: 5ns
Input and output reference voltage: 1.5V
Output load(see right): CL=100pF+1TTL
CL=50pF+1TTL
CL1)
1.Including scope and jig capacitance
AC CHARACTERISTICS
(VCC=4.5~5.5V, Commercial product: TA=0 to 70°C, Industrial product: TA=-40 to 85°C, Automotive product: TA=-40 to 125°C)
Parameter List
Read
Write
Read Cycle Time
Address Access Time
Chip Select to Output
Output Enable to Valid Output
Chip Select to Low-Z Output
Output Enable to Low-Z Output
Chip Disable to High-Z Output
Output Disable to High-Z Output
Output Hold from Address Change
Write Cycle Time
Chip Select to End of Write
Address Set-up Time
Address Valid to End of Write
Write Pulse Width
Write Recovery Time
Write to Output High-Z
Data to Write Time Overlap
Data Hold from Write Time
End Write to Output Low-Z
Symbol
tRC
tAA
tCO
tOE
tLZ
tOLZ
tHZ
tOHZ
tOH
tWC
tCW
tAS
tAW
tWP
tWR
tWHZ
tDW
tDH
tOW
Speed Bins
55ns
70ns
Min Max Min Max
55 - 70 -
- 55 - 70
- 55 - 70
- 25 - 35
10 - 10 -
5-5-
0 20 0 25
0 20 0 25
10 - 10 -
55 - 70 -
45 - 60 -
0-0-
45 - 60 -
40 - 50 -
0-0-
0 20 0 20
25 - 30 -
0-0-
5-5-
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DATA RETENTION CHARACTERISTICS
Item
Symbol
Test Condition
Min Typ Max Unit
Vcc for data retention
Data retention current
VDR CS1Vcc-0.2V1)
2.0 - 5.5 V
K6X8008C2B-B
15
IDR Vcc=3.0V, CS1Vcc-0.2V1) K6X8008C2B-F -
- 15 µA
K6X8008C2B-Q
30
Data retention set-up time
tSDR
See data retention waveform
Recovery time
tRDR
0- -
ms
5- -
1. CS1Vcc-0.2V,CS2Vcc-0.2V(CS1 controlled) or CS2Vcc-0.2V(CS2 controlled).
5 Revision 1.0
September 2003

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