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PDF K4S641632C Data sheet ( Hoja de datos )

Número de pieza K4S641632C
Descripción 1M x 16Bit x 4 Banks Synchronous DRAM
Fabricantes Samsung semiconductor 
Logotipo Samsung semiconductor Logotipo



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K4S641632C
1M x 16Bit x 4 Banks Synchronous DRAM
CMOS SDRAM
FEATURES
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock
• Burst read single-bit write operation
• DQM for masking
• Auto & self refresh
• 64ms refresh period (4K cycle)
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION
The K4S641632C is 67,108,864 bits synchronous high data
rate Dynamic RAM organized as 4 x 1,048,576 words by 16
bits, fabricated with SAMSUNGs high performance CMOS
technology. Synchronous design allows precise cycle control
with the use of system clock I/O transactions are possible on
every clock cycle. Range of operating frequencies, programma-
ble burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high perfor-
mance memory system applications.
ORDERING INFORMATION
Part No.
K4S641632C-TC/L60
K4S641632C-TC/L70
K4S641632C-TC/L75
K4S641632C-TC/L80
K4S641632C-TC/L1H
K4S641632C-TC/L1L
K4S641632C-TC/L10
Max Freq. Interface Package
166MHz(CL=3)
143MHz(CL=3)
133MHz(CL=3)
125MHz(CL=3)
100MHz(CL=2)
LVTTL
54
TSOP(II)
100MHz(CL=3)
66MHz(CL=3&2)
Data Input Register
CLK
ADD
Bank Select
1M x 16
1M x 16
1M x 16
1M x 16
Column Decoder
LCKE
LRAS LCBR
LWE
LCAS
Latency & Burst Length
Programming Register
LWCBR
Timing Register
LWE
LDQM
DQi
LDQM
CLK CKE
CS
RAS
CAS
WE L(U)DQM
* Samsung Electronics reserves the right to change products or specification without notice.

1 page




K4S641632C pdf
K4S641632C
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)
Parameter
AC input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Value
2.4/0.4
1.4
tr/tf = 1/1
1.4
See Fig. 2
3.3V
Output
870
1200
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
50pF*Note1
Output
CMOS SDRAM
Unit
V
V
ns
V
Z0 = 50
Vtt = 1.4V
50
50pF*Note1
(Fig. 1) DC output load circuit
Note : 1. The DC/AC test Output Load of K4S641632C-60 is 30pF.
2. The VDD condition of K4S641632C-60 is 3.135V~3.6V.
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Symbol
Version
Unit
-60 -70 -75 -80 -1H -1L -10
Row active to row active delay
tRRD(min) 12 14 14 16 20 20 20 ns
RAS to CAS delay
tRCD(min) 18 20 20 20 20 20 24 ns
Row precharge time
tRP(min)
18
20
20
20
20
20
24 ns
Row active time
tRAS(min)
42
48
48
48
50
50
50 ns
tRAS(max)
100
us
Row cycle time
tRC(min)
60
68
68
68
70
70
80 ns
Last data in to row precharge
tRDL(min)
6
7
7
8 10 10 12 ns
Last data in to new col. address Delay tCDL(min) 1 CLK
Last data in to burst stop
tBDL(min)
1
CLK
Col. address to col. address delay
tCCD(min)
1
CLK
Number of valid output
data
CAS latency=3
CAS latency=2
2
ea
1
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
Not
e
1
1
1
1
1
2
2
2
3
4

5 Page





K4S641632C arduino
K4S641632C
CMOS SDRAM
BURST SEQUENCE (BURST LENGTH = 4)
Initial Address
A1 A0
Sequential
Interleave
0001230123
0112301032
1023012301
1130123210
BURST SEQUENCE (BURST LENGTH = 8)
Initial Address
A2 A1 A0
Sequential
Interleave
0 0 0 0 123 4 5 6 70 1234 5 6 7
0 0 1 1 234 5 6 7 01 0325 4 7 6
0 1 0 2 345 6 7 0 12 3016 7 4 5
0 1 1 3 456 7 0 1 23 2107 6 5 4
1 0 0 4 567 0 1 2 34 5670 1 2 3
1 0 1 5 670 1 2 3 45 4761 0 3 2
1 1 0 6 701 2 3 4 56 7452 3 0 1
1 1 1 7 012 3 4 5 67 6543 2 1 0
ELECTRONICS

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