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Número de pieza | K4S161622E-TC60 | |
Descripción | 1M x 16 SDRAM | |
Fabricantes | Samsung semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de K4S161622E-TC60 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
No Preview Available ! K4S161622E
CMOS SDRAM
1M x 16 SDRAM
512K x 16bit x 2 Banks
Synchronous DRAM
LVTTL
Revision 1.1
Jan 2003
Samsung Electronics reserves the right to change products or specification without notice.
Rev 1.1 Jan '03
1 page K4S161622E
CMOS SDRAM
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter
Symbol
Test Condition
CAS
Latency -55
Version
-60 -70 -80
-10
Unit
Note
Operating Current
(One Bank Active)
Burst Length =1
ICC1
tRC≥tRC(min)
Io = 0 mA
3 120 115 105 95 85
mA 2
2 - - 95 95 80
Precharge Standby Current
in power-down mode
ICC2P
ICC2PS
CKE≤VIL(max), tCC = 15ns
CKE & CLK≤VIL(max), tCC = ∞
2
mA
2
Precharge Standby Current
in non power-down mode
ICC2N
ICC2NS
CKE≥VIH(min), CS≥VIH(min), tCC = 15ns
Input signals are changed one time during 30ns
CKE≥VIH(min), CLK≤VIL(max), tCC = ∞
Input signals are stable
15
5
mA
Active Standby Current
in power-down mode
ICC3P
ICC3PS
CKE≤VIL(max), tCC = 15ns
CKE & CLK≤VIL(max), tCC = ∞
3
mA
3
Active Standby Current
ICC3N
CKE≥VIH(min), CS≥VIH(min), tCC = 15ns
Input signals are changed one time during 30ns
25
mA
in non power-down mode
(One Bank Active)
ICC3NS
CKE≥VIH(min), CLK≤VIL(max), tCC = ∞
Input signals are stable
15 mA
Operating Current
(Burst Mode)
Io = 0 mA
3 155 150 140 130 115
ICC4 Page Burst 2Banks Activated
mA 2
tCCD = 2CLKs
2 - - 115 115 100
Refresh Current
Self Refresh Current
ICC5
ICC6
tRC≥tRC(min)
CKE≤0.2V
3 105 100 90 90 80
mA 3
2 - - 90 90 80
1 mA 4
Note : 1. Unless otherwise notes, Input level is CMOS(VIH/VIL=VDDQ/VSSQ) in LVTTL.
2. Measured with outputs open. Addresses are changed only one time during tcc(min).
3. Refresh period is 32ms. Addresses are changed only one time during tcc(min).
4. K4S161622E-TC**
Rev 1.1 Jan '03
5 Page K4S161622E
CMOS SDRAM
DEVICE OPERATIONS
CLOCK (CLK)
The clock input is used as the reference for all SDRAM opera-
tions. All operations are synchronized to the positive going edge
of the clock. The clock transitions must be monotonic between
VIL and VIH. During operation with CKE high all inputs are
assumed to be in a valid state (low or high) for the duration of
set-up and hold time around positive edge of the clock in order
to function well Q perform and ICC specifications.
CLOCK ENABLE (CKE)
The clock enable(CKE) gates the clock onto SDRAM. If CKE
goes low synchronously with clock (set-up and hold time are the
same as other inputs), the internal clock is suspended from the
next clock cycle and the state of output and burst address is fro-
zen as long as the CKE remains low. All other inputs are ignored
from the next clock cycle after CKE goes low. When all banks
are in the idle state and CKE goes low synchronously with clock,
the SDRAM enters the power down mode from the next clock
cycle. The SDRAM remains in the power down mode ignoring
the other inputs as long as CKE remains low. The power down
exit is synchronous as the internal clock is suspended. When
CKE goes high at least "1CLK + tSS" before the high going edge
of the clock, then the SDRAM becomes active from the same
clock edge accepting all the input commands.
BANK ADDRESS (BA)
: In case x 4
This SDRAM is organized as two independent banks of
2,097,152 words x 4 bits memory arrays. The BA input is latched
at the time of assertion of RAS and CAS to select the bank to be
used for the operation. The bank select BA is latched at bank
active, read, write, mode register set and precharge operations.
: In case x 8
This SDRAM is organized as two independent banks of
1,048,576 words x 8 bits memory arrays. The BA input is latched
at the time of assertion of RAS and CAS to select the bank to be
used for the operation. The bank select BA is latched at bank
active, read, write, mode register set and precharge operations.
: In case x 16
This SDRAM is organized as two independent banks of 524,288
words x 16 bits memory arrays. The BA input is latched at the
time of assertion of RAS and CAS to select the bank to be used
for the operation. The bank select BA is latched at bank active,
read, write, mode register set and precharge operations.
ADDRESS INPUTS (A0 ~ A10/AP)
: In case x 4
The 21 address bits are required to decode the 2,097,152 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 10 bit column
addresses are latched along with CAS, WE and BA during read
or write command.
: In case x 8
The 20 address bits are required to decode the 1,048,576 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 9 bit column addresses
are latched along with CAS, WE and BA during read or write
command.
: In case x 16
The 19 address bits are required to decode the 524,288 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 8 bit column addresses
are latched along with CAS, WE and BA during read or write
command.
NOP and DEVICE DESELECT
When RAS, CAS and WE are high, the SDRAM performs no
operation (NOP). NOP does not initiate any new operation, but
is needed to complete operations which require more than sin-
gle clock cycle like bank activate, burst read, auto refresh, etc.
The device deselect is also a NOP and is entered by asserting
CS high. CS high disables the command decoder so that RAS,
CAS, WE and all the address inputs are ignored.
POWER-UP
SDRAMs must be powered up and initialized in a pre-
defined manner to prevent undefined operations.
1. Apply power and start clock. Must maintain CKE= "H", DQM=
"H" and the other pins are NOP condition at the inputs.
2. Maintain stable power, stable clock and NOP input condition
for a minimum of 200us.
3. Issue precharge commands for both banks of the devices.
4. Issue 2 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode reg-
ister.
cf.) Sequence of 4 & 5 is regardless of the order.
The device is now ready for normal operation.
Rev 1.1 Jan '03
11 Page |
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