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PDF S29GL256M Data sheet ( Hoja de datos )

Número de pieza S29GL256M
Descripción MirrorBit Flash Family
Fabricantes ETC 
Logotipo ETC Logotipo



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S29GLxxxM MirrorBitTM Flash Family
S29GL256M, S29GL128M, S29GL064M, S29GL032M
256 Megabit, 128 Megabit, 64 Megabit, and 32Megabit,
3.0 Volt-only Page Mode Flash Memory featuring
0.23 um MirrorBit process technology
Datasheet
Distinctive Characteristics
DATASHEET
Architectural Advantages
„ Single power supply operation
— 3 volt read, erase, and program operations
„ Manufactured on 0.23 um MirrorBit process
technology
„ SecSi(Secured Silicon) Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
„ Flexible sector architecture
— 256Mb: 512 32 Kword (64 Kbyte) sectors
— 128Mb: 256 32 Kword (64 Kbyte) sectors
— 64Mb (uniform sector models): 128 32 Kword (64
Kbyte) sectors or 128 32 Kword sectors
— 64Mb (boot sector models): 127 32 Kword (64 Kbyte)
sectors + 8 4Kword (8Kbyte) boot sectors
— 32Mb (uniform sector models): 64 32Kword (64
Kbyte) sectors of 64 32Kword sectors
— 32Mb (boot sector models): 63 32Kword (64 Kbyte)
sectors + 8 4Kword (8Kbyte) boot sectors
„ Compatibility with JEDEC standards
— Provides pinout and software compatibility for single-
power supply flash, and superior inadvertent write
protection
„ 100,000 erase cycles typical per sector
„ 20-year data retention typical
Performance Characteristics
„ High performance
— 90 ns access time (128Mb, 64Mb, 32Mb),
100 ns access time (256Mb)
— 4-word/8-byte page read buffer
— 25 ns page read times (128Mb, 64Mb, 32Mb)
— 30 ns page read times (256Mb)
— 16-word/32-byte write buffer
— 16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
„ Low power consumption (typical values at 3.0 V, 5
MHz)
— 18 mA typical active read current (64 Mb, 32 Mb)
— 25 mA typical active read current (256 Mb, 128 Mb)
— 50 mA typical erase/program current
— 1 µA typical standby mode current
„ Package options
— 40-pin TSOP
— 48-pin TSOP
— 56-pin TSOP
— 64-ball Fortified BGA
— 48-ball fine-pitch BGA
— 63-ball fine-pitch BGA
Software & Hardware Features
„ Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
— Unlock Bypass Program command reduces overall
multiple-word programming time
„ Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Unprotect: VID-level method of
charging code in locked sectors
— WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings on uniform
sector models
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
Publication Number S29GLxxxM Revision B Amendment 3 Issue Date Octorber 18, 2004

1 page




S29GL256M pdf
Datasheet
Product Selector Guide
S29GL256M
Part Number
Speed Option
Max. Access Time (ns)
Max. CE# Access Time (ns)
Max. Page Access Time (ns)
Max. OE# Access Time (ns)
S29GL128M
Part Number
Speed Option
Max. Access Time (ns)
Max. CE# Access Time (ns)
Max. Page Access Time (ns)
Max. OE# Access Time (ns)
S29GL064M
Part Number
Speed Option
Max. Access Time (ns)
Max. CE# Access Time (ns)
Max. Page Access Time (ns)
Max. OE# Access Time (ns)
90
90
90
25
25
S29GL032M
Part Number
Speed Option
Max. Access Time (ns)
Max. CE# Access Time (ns)
Max. Page Access Time (ns)
Max. OE# Access Time (ns)
90
90
90
25
25
10
100
100
30
30
S29GL256M
11
110
110
30
30
S29GL128M
90 10
90 100
90 100
25 30
25 30
S29GL064M
10
100
100
30
30
11
110
110
30
30
S29GL032M
10
100
100
30
30
11
110
110
30
30
Octorber 18, 2004 S29GLxxxM_00_B3
S29GLxxxM MirrorBitTM Flash Family
5

5 Page





S29GL256M arduino
Datasheet
Connection Diagrams
64-ball Fortified BGA
Top View, Balls Facing Down
A8 B8 C8
NC
A222
A233
A7 B7 C7
A13 A12 A14
A6 B6 C6
A9 A8 A10
A5 B5 C5
WE# RESET# A211
A4 B4 C4
RY/BY# WP#/ACC A18
A3 B3 C3
A7 A17 A6
A2 B2 C2
A3 A4 A2
A1 B1 C1
NC NC NC
D8
VIO4
D7
A15
D6
A11
D5
A19
D4
A20
D3
A5
D2
A1
D1
NC
E8 F8 G8 H8
VSS NC
NC NC
E7 F7 G7 H7
A16 BYTE#5 DQ15/A-1 VSS
E6
DQ7
F6
DQ14
G6
DQ13
H6
DQ6
E5
DQ5
F5
DQ12
G5
VCC
H5
DQ4
E4
DQ2
F4
DQ10
G4
DQ11
H4
DQ3
E3
DQ0
F3
DQ8
G3
DQ9
H3
DQ1
E2 F2 G2 H2
A0 CE# OE# VSS
E1 F1 G1
NC VIO4 NC
H1
NC
Notes:
1. Ball C5 is NC on S29GL032M.
2. Ball B8 is NC on S29GL064M and S29GL032M.
3. Ball C8 is NC on S29GL128M, S29GL064M and S29GL032M.
4. Ball D8 and Ball F1 are NC on S29GL064M (models R3, R4) and S29GL032M (models R3, R4, R5, R6).
5. Ball F7 is NC on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in moulded packages (TSOP and BGA). The package and/
or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged
periods of time.
Octorber 18, 2004 S29GLxxxM_00_B3
S29GLxxxM MirrorBitTM Flash Family
11

11 Page







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