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PDF 236 Data sheet ( Hoja de datos )
| Número de pieza | 236 | |
| Descripción | Board Level Power Semiconductor Heat Sinks | |
| Fabricantes | Wakefield Thermal Solutions | |
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BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT 361317
216 SERIES Surface Mount Heat Sinks
D2PAK, TO-220, SOL-20
Standard
P/N
216-40CT
216-40CTT
216-40CTR
Height Above
PC Board
.390 in. (9.9)
.390 in. (9.9)
.390 in. (9.9)
Footprint Dimensions
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
25
250
Thermal Performance at Typical Load
Natural Convection Forced Convection
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of
high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder
reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path
from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,
tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
MECHANICAL DIMENSIONS
.740
(18.8)
216-40CT
.600
(15.2)
.640
(16.3)
.600
(15.2)
.020
(0.5)
.215
(5.5) .215
(5.5)
.600
(15.2)
.020
(0.5)
216-40CTT
NOTES:
1. ESD MATERIAL WITH PLUGS
2. LENGTH OF TUBE: 16.25 INCHES
3. QUANTITY PER TUBE: 25 PIECES
TUBE DETAILS
.390 .265
(9.9) .640 (6.7)
(16.3)
.470
(11.9)
.840
(21.3)
.350
(8.9)
.025
(0.6)
216-40CTR
A
TAPE
DETAILS
USE MAX
COPPER
TO ALLOW
MAX
CONDUCTION
TO HEAT SINK
RECOMMENDED COPPER FOOTPRINT
.660
(16.8)
.640
(16.3)
.660
(16.8)
.060
(1.5)
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
AIR VELOCITY (LFM)
7 0 100 200 300 400 500
6
.626
(15.9)
A
.768
(19.5)
.390
(9.9)
REEL
DETAILS
.945
(24.0)
SECTION
A-A
COPPER FOOTPRINT
FOR HEAT SINK
.640
(16.3)
5
4
1.260
(32.0)
13.000
(330.2)
MIN COPPER
FOR HEAT
3
SINK
2
.390 REF:
(9.9)
JEDEC TO-263 D2PAK
JEDEC TO-220AB
1
JEDEC TO-261AA
.409
.215
(5.5)
JEDEC MO-184
JEDEC MS-013
JEDEC MS-025
(10.4)
NATURAL CONVECTION
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
THERMAL PERFORMANCE
DATA
POWER, W
100
30 0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
NO HEAT SINK
6 LAYER BOARD, D2PAK
AIR VELOCITY (LFM)
100 200 300 400 500
25
80
1.28
(32.5)
60
40
20
15
10
20
NOTES:
1. ESD MATERIAL
2. EIA STANDARD, EIA-481-3
3. LENGTH OF REEL: APPROXIMATELY 6 METERS
4. QUANTITY PER REEL: 250 PIECES
0
HS, 2 IN. BOARD
HS, 4 IN. BOARD
NO HS, 2 IN. BOARD
NO HS, 4 IN. BOARD
0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
Dimensions: in. (mm)
PATENT PENDING
230 and 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
TO-220
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Height Above
PC Board
.750 in. (19.1)
.750 in. (19.1)
.500 in. (12.7)
.875 in. (22.2)
.790 in. (20.0)
.790 in. (20.0)
.500 in. (12.7)
Footprint Dimensions
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.750 in. (19.1) x .570 in. (14.5)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.790 in. (20.0) x .570 in. (14.5)
Mounting
Configuration
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz.
Vertical
Horizontal
Solderable
Tab Option
No Tab
01
05
10
No Tab
01
05
Mounting Thermal Performance at Typical Load
Style Natural Convection Forced Convection
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures
uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating
the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used
interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10
to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.500
(12.7)
.570 MAX
(14.5)
230-75AB-01
.500
(12.7)
230-75AB
.500
(12.7)
234-75AB
.750
(19.1)
.050
(1.3)
.570 MAX
(14.5)
.250
(6.4)
.500
(12.7)
230 AND 234 SERIES
230-75AB-10
.125
(3.2)
.063
(1.6)
234-75AB-01
.375 .020 TAB 10
(9.5) (0.5)
.032 TAB 01
(0.8)
.090
(2.3) 234-75AB-05
.720 .790
(18.3) (20.1)
.540
(13.7)
Dimensions: in. (mm)
.720 .790
(18.3) (20.1)
.032 .050
(0.8) (1.3)
.210
(5.3) .430
(10.9)
.032
(0.8)
.165
(4.2)
.570 MAX
(14.5)
230
and
234
SERIES
.500 MIN
(12.7)
.050
(1.3)
2x.100
(2.5)
230-75AB-05
.750
(19.1)
.032
(0.8) .165
(4.2)
234 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
.370
(9.4)
2x.125
(3.2)
.500
(12.7)
230 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80
230/234
8
60 6
40
230/234
20
4
2
0
01
23
0
45
POWER DISSIPATION (WATTS)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
2
Refer to Full Line Catalog for additional
Board-Level Heat Sinks and
Thermal Accessory Products
1 page  
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks
Standard
Height Above
P/N PC Board
242-125AB-22 1.285 in. (32.6)
Mounting Solderable
Footprint Dimensions Configuration Tab Option
.875 in. (22.2) x .250 in. (6.4)
Vertical
22
Mounting
Style
Mtg Hole
TO-220
Thermal Performance at Typical Load
Natural Convection Forced Convection
48°C @ 2W 6.2°C/W @ 400 LFM
Efficient, low-profile twisted fin heat sinks for vertical mounting of TO-220 devices. Its slim design minimizes PC board space occupied and the
alternating twisted fins increase air turbulence for improved cooling. Standard models include wavesolderable tinned tabs for direct PC board
mounting. Specify part number 242-125AB-22. Material: Aluminum, black anodized.
.450
(11.4)
FLAT
1.250
(31.8)
.770
(19.6)
2x.075
(1.9)
.700
(17.8)
.875
(22.2)
ø.125
(3.2)
242-125AB-22
MECHANICAL DIMENSIONS
P.C. BOARD MTG. SUR-
FACE
.250
(6.4)
242 SERIES
ø.100 PLATED
(2.5)
.185
(4.7)
.032
(0.8)
PARTIAL VIEW
ONLY NEAR SIDE FINS SHOWN
.150
(3.8)
.700
(17.8)
TAB HOLES
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100020
80 16
60 12
40 8
20 4
0
0123
0
45
POWER DISSIPATION (WATTS)
232 and 238 SERIES Staggered Fin Heat Sinks for Vertical Mounting
TO-202, TO-220
Standard
P/N
232-200AB
232-200AB-23
238-200AB
238-200AB-23
Height Above
PC Board
2.000 in. (50.8)
2.000 in. (50.8)
2.000 in. (50.8)
2.000 in. (50.8)
Mounting Tab Options Mounting Thermal Performance at Typical Load
Footprint Dimensions Configuration Type
Style Natural Convection Forced Convection
1.380 in. (35.1) x .500 in. (12.7) Vertical
2, Twisted Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
1.380 in. (35.1) x .500 in. (12.7) Vertical 2, Solderable Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
1.380 in. (35.1) x .500 in. (12.7) Vertical
2, Twisted Mtg Slot
48°C @ 4W 3.3°C/W @ 400 LFM
1.380 in. (35.1) x .500 in. (12.7) Vertical 2, Solderable Mtg Slot
48°C @ 4W 3.3°C/W @ 400 LFM
Staggered fin design for efficient cooling of TO-202 (Series 238) and TO-220 (Series 232) semiconductor devices. Models mount vertically and are
available with two solderable tabs (232-200AB-23 or 238-200AB-23) or two twisted tabs (232-200AB or 238-200AB). Order SpeedClips™ 285SC
or 330SC separately (232 Series only) for rapid component installation, lowering manufacturing costs. Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
232-200AB
232 SERIES 232-200AB-23
238-200AB
.125
(3.2)
Optional
SpeedClip™
Mounting
ø.125 PL
(3.2)
2.000
(50.8)
1.000
.720 (25.4)
(18.3)
Optional
SpeedClip™
Mounting
.375
(9.5)
.382
(9.7)
.097
(2.5)
1.000
(25.4)
.100 REF
(2.5)
.097
(2.5)
.187
(4.8)
Stainless
Steel
330SC 4#
Order SpeedClips™ Separately
Spring
Steel
285SC 10#
238-200AB-23
238 SERIES
2.000
(50.8)
.187
(4.8)
.700
(17.8)
.100 REF
.440 (2.5)
(11.2) 1.000
(25.4)
.440
(11.2)
1.000
(25.4)
Dimensions: in. (mm)
232 AND 238 SERIES
.500
(12.7)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80 8
60
.187
(4.8) 40
20
6
4
2
.050
(1.3)
.150
(3.8)
.032 REF
(0.8)
0
0
.650 FLAT
(16.5)
246 8
POWER DISSIPATION (WATTS)
TAB HOLES ø.130 PLATED
(3.3)
0
10
1.380
(35.1)
1.000
(25.4)
251 SERIES Slim-Profile Heat Sinks With Integral Clips
15 Lead Multiwatt
Standard
P/N
251-62AB
251-80AB
251-80AB-19
Height Above
PC Board
.620 in. (15.7)
.845 in. (21.5)
.875 in. (22.2)
Footprint Dimensions
.910 in. (23.1) x .380 in. (9.7)
.910 in. (23.1) x .380 in. (9.7)
.910 in. (23.1) x .380 in. (9.7)
Mounting Solderable
Configuration Tab Option
Vertical/Horizontal No Tab
Vertical/Horizontal No Tab
Vertical
19
Mounting
Style
Clip
Clip
Clip
Thermal Performance at Typical Load
Natural Convection Forced Convection
66°C @ 3W
6.6°C/W @ 400 LFM
64°C @ 3W
6.4°C/W @ 400 LFM
64°C @ 3W
6.4°C/W @ 400 LFM
Lightweight, slim-profile heat sinks with integral self-locking clips occupy minimum board real estate and reduce assembly costs. Their small
footprint is ideal for a variety of low-power multiwatt component applications. Models are available in heights of .620 in. (15.7) and .845 in.
(21.5). Specify solderable tab option for the 251-80AB (only) by the addition of suffix 19 to the standard part number (i.e. 251-80AB-19).
Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.910
(23.1)
.460
(11.7)
.620
(15.8)
251-62AB
.380
(9.7)
Suggested Tab Holes
ø.075 (1.9) (Plated)
with ø.100 (2.5) PAD
2x.060
(1.5)
.640
(16.3)
251-80AB
.150
(3.8)
.875
(22.2)
2x.170
(4.3)
251 SERIES
.800
(20.3) .045
(1.1)
.112
(2.8)
.120
(3.1)
.200
(5.1)
251-80AB-19
.032
(0.8)
.875
(22.2)
.050
(1.3)
.187
(4.8)
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100020
80
251-62AB
16
251-80AB
60 12
40 8
251-62AB
20 251-80AB
4
0
0123
0
45
POWER DISSIPATION (WATTS)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
6
Refer to Full Line Catalog for additional
Board-Level Heat Sinks and
Thermal Accessory Products
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet 236.PDF ] | |
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