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PDF IP2002 Data sheet ( Hoja de datos )
| Número de pieza | IP2002 | |
| Descripción | Synchronous Buck Synchronous Buck Integrated Power Semiconductors/ Drivers & Passives | |
| Fabricantes | International Rectifier | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de IP2002 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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PD - 94568A
iP2002
Synchronous Buck
Multiphase Optimized BGA Power Block
Features:
Integrated Power Semiconductors, Drivers & Passives
• Output current 30A continuous with no derating up to
•
TPCB = 90°C and TCASE = 90°C
Operating frequency up to 1MHz
• Dual sided heatsink capable
• Very small 11mm x 11mm x 2.6mm profile
• iP2001 footprint compatible
• Internal features minimize layout sensitivity *
• Optimized for very low power losses
iP2002 Power Block
Description
The iP2002 is a fully optimized solution for high current synchronous buck multiphase applications.
Board space and design time are greatly reduced because most of the components required for each
phase of a typical discrete-based multiphase circuit are integrated into a single 11mm x 11mm x 2.6mm
BGA power block. The only additional components required for a complete multiphase converter are a PWM
IC, the external inductors, and the input and output capacitors.
iPOWIR technology offers designers an innovative board space saving solution for applications
requiring high power densities. iPOWIR technology eases design for applications where component
integration offers benefits in performance and functionality. iPOWIR technology solutions are also optimized
internally for layout, heat transfer and component selection.
iP2002 Internal Block Diagram
P RDY
ENABLE
PWM
VDD
MOSFET
Driver with
dead time
cont ro l
VIN
VSW
SGND
P GND
* All of the difficult PCB layout and bypassing issues have been addressed with the internal design of the iPOWIR Block. There are no concerns about double
pulsing, unwanted shutdown, or other malfunctions which often occur in switching power supplies. The iPOWIR Block will function normally without any
additional input power supply bypass capacitors. However, for reliable long term operation it is recommended that at least four 10uF ceramic input
decoupling capacitors are provided to the VIN pin of each power block. No additional bypassing is required on the VDD pin.
www.irf.com
03/20/03
1
1 page  
Typical Performance Curves
iP2002
1.40
13.5
1.35
VOUT = 1.3V
12.5
IOUT = 30A
11.5
1.30
fSW = 1MHz
10.5
1.25
L = 0.30uH
TBLK = 125°C
9.5
8.5
7.5
1.20
6.5
1.15
5.5
4.5
1.10
3.5
1.05
2.5
1.5
0.5
1.00
-0.5
0.95
-1.5
-2.5
0.90
-3.5
3 4 5 6 7 8 9 10 11 12 13
Input Voltage (V)
Fig. 3: Normalized Power Loss vs. VIN
1.30
1.25
VIN = 12V
IOUT = 30A
1.20 fSW = 1MHz
L = 0.30uH
1.15 TBLK = 125°C
1.10
1.05
1.00
0.95
10.5
8.5
6.5
4.5
2.5
0.5
-1.5
0.90 -3.5
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6
Output Voltage (V)
Fig. 4: Normalized Power Loss vs. VOUT
1.00
VIN = 12V
0.95 VOUT = 1.3V
IOUT = 30A
L = 0.30uH
0.90 TBLK = 125°C
0.85
0.80
0.75
-0.5
-2.5
-4.5
-6.5
-8.5
0.70 -10.5
250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000
Switching Frequency (kHz)
Fig. 5: Normalized Power Loss vs. Frequency
1.10
VIN = 12V
3.5
1.08
VOUT = 1.3V
3.0
IOUT = 30A
1.06
fSW = 1MHz
2.5
TBLK = 125°C
2.0
1.04
1.5
1.02
1.0
1.00
0.5
-0.1
0.98
-0.6
0.96
-1.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Output Inductance (uH)
Fig. 6: Normalized Power Loss vs. Inductance
www.irf.com
70
60
50
40
30
20
Does not include
PRDY current
10 TBLK = 25°C
0
250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000
Switching Frequency (kHz)
Fig. 7: IDD vs. Frequency
5
5 Page 
iP2002
0.15 [.006] C
2X 6
BALL A1
CORNER ID
11.00
[.433]
TOP VIEW
BA
11.00
[.433]
5C
0.12 [.005] C
0.15 [.006] C
2X 6
133X Ø
0.55 [.0216]
0.45 [.0178]
7
0.15 [.006]
0.08 [.003]
CAB
C
0.45 [.0177]
0.35 [.0138]
NOTES:
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
3. CONTROLLING DIMENSION: MILLIMETER
4. SOLDER BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
5 PRIMARY DATUM C (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
6 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE
PACKAGE BODY.
7 SOLDER BALL DIAMETER IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER, IN A PLANE PARALLEL TO DATUM C.
0.40
[.016]
4X
BOTTOM VIEW
0.80
[.032]
22X
(4X 1.1 [.043])
2.31 [.0909]
2.11 [.0831]
2.76 [.1087]
2.46 [.0969]
SIDE VIEW
Mechanical Drawing
www.irf.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet IP2002.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| IP2002 | Synchronous Buck Synchronous Buck Integrated Power Semiconductors/ Drivers & Passives | International Rectifier |
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