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PDF INA-51063-TR1 Data sheet ( Hoja de datos )

Número de pieza INA-51063-TR1
Descripción 2.4 GHz Low Noise Silicon MMIC Amplifier
Fabricantes Agilent(Hewlett-Packard) 
Logotipo Agilent(Hewlett-Packard) Logotipo



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2.4 GHz Low Noise Silicon MMIC
Amplifier
Technical Data
INA-51063
Features
• Ultra-Miniature Package
• Internally Biased, Single 5 V
Supply (12 mA)
• 20.5 dB Gain
• 3 dB NF
• Unconditionally Stable
Applications
• Amplifier for Cellular,
Cordless, Special Mobile
Radio, PCS, ISM, Wireless
LAN, DBS, TVRO, and TV
Tuner Applications
Surface Mount SOT-363
(SC-70) Package
Pin Connections and
Package Marking
GND 1
GND 2
INPUT 3
6 OUTPUT
5 GND
4 VCC
Note: Package marking provides
orientation and identification.
Equivalent Circuit (Simplified)
VCC
RF
INPUT
RF
OUTPUT
Description
Hewlett-Packard’s INA-51063 is a
Silicon monolithic amplifier that
offers excellent gain and noise
figure for applications to 2.4 GHz.
Packaged in an ultra-miniature
SOT-363 package, it requires half
the board space of a SOT-143
package.
The INA-51063 uses a topology
which is internally biased,
eliminating the need for external
components and providing
decreased sensitivity to ground
inductance.
The INA-51063 is fabricated using
HP’s 30 GHz fMAX ISOSATTM
Silicon bipolar process which
uses nitride self-alignment sub-
micrometer lithography, trench
isolation, ion implantation, gold
metallization, and polyimide
intermetal dielectric and scratch
protection to achieve superior
performance, uniformity, and
reliability.
GROUND
6-151
5965-9680E

1 page




INA-51063-TR1 pdf
with a nominal SOT-363 package
footprint superimposed on the
PCB pads.
RF Layout
The RF layout in Figure 12 is
suggested as a starting point for
designs using the INA-51063
amplifier. Adequate grounding is
needed to obtain maximum
performance and to reduce the
possibility of potential instability.
All three ground pins of the RFIC
should be connected to RF
C VCC
ground by using plated through
holes (vias) near the package
terminals. The power supply
connection to the amplifier must
be RF bypassed by placing a
capacitor directly to ground at
the VCC pin of the package.
It is recommended that the PCB
traces for the ground pins NOT be
connected together underneath
the body of the package. PCB
pads hidden under the package
cannot be adequately inspected
for SMT solder quality.
FR-4 or G-10 PCB material is a
good choice for most low cost
wireless applications. Typical
board thickness is 0.025 or
0.031␣ inches. The width of 50
microstriplines in these PCB
thicknesses is also convenient for
mounting chip components such
as the series inductor at the input
for impedance matching or for
DC blocking capacitors. For noise
figure sensitive applications, the
use of PTFE/glass dielectric
materials may be warranted to
minimize transmission line losses
at the amplifier input.
RF OUTPUT
50
51
Figure 12. RF Layout.
50
RF INPUT
INA-51063 Part Number Ordering Information
Part Number Devices per Container
Container
INA-51063-TR1
3,000
7" reel
INA-51063-BLK
100
Antistatic bag
Package Dimensions
Outline 63 (SOT-363/SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.10 (0.004)
0.00 (0.00)
2.20 (0.087)
1.80 (0.071)
0.650 BSC (0.025)
0.30 REF.
0.425 (0.017)
TYP.
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
0.20 (0.008)
10° 0.30 (0.012) 0.10 (0.004)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
6-155

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