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PDF EBS52EC8APFA-75 Data sheet ( Hoja de datos )

Número de pieza EBS52EC8APFA-75
Descripción 512MB Unbuffered SDRAM DIMM
Fabricantes Elpida Memory 
Logotipo Elpida Memory Logotipo



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DATA SHEET
512MB Unbuffered SDRAM DIMM
EBS52EC8APFA (64M words × 72 bits, 2 banks)
Description
The EBS52EC8APFA is 64M words × 72 bits, 2 banks
Synchronous Dynamic RAM Unbuffered Module,
mounted 18 pieces of 256M bits SDRAM sealed in
TSOP package. This module provides high density
and large quantities of memory in a small space
without utilizing the surface mounting technology.
Decoupling capacitors are mounted on power supply
line for noise reduction.
Features
Fully compatible with 8 bytes DIMM: JEDEC
standard outline
168-pin socket type dual in line memory module
(DIMM)
PCB height: 34.93mm (1.38inch )
Lead pitch: 1.27mm
3.3V power supply
Clock frequency: 133MHz (max.)
LVTTL interface
Data bus width: × 72 ECC
Single pulsed /RAS
4 Banks can operates simultaneously and
independently
Burst read/write operation and burst read/single write
operation capability
Programmable burst length (BL): 1, 2, 4, 8
2 variations of burst sequence
Sequential
Interleave
Programmable /CAS latency (CL): 2, 3
Byte control by DQMB
Refresh cycles: 8192 refresh cycles/64ms
2 variations of refresh
Auto refresh
Self refresh
Document No. E0207E20 (Ver. 2.0)
Date Published June 2002 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2001-2002

1 page




EBS52EC8APFA-75 pdf
EBS52EC8APFA
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value
29
/RAS to /CAS delay min
(-7A)
(-75)
0 0 0 0 1 1 1 1 0FH
0 0 0 1 0 1 0 0 14H
30 Minimum /RAS pulse width
0 0 1 0 1 1 0 1 2DH
31
Density of each bank on module
0 1 0 0 0 0 0 0 40H
32
Address and command signal input
setup time
0
0
0
1
0
1
0
1
15H
33
Address and command signal input
hold time
0
0
0
0
1
0
0
0
08H
34 Data signal input setup time
0 0 0 1 0 1 0 1 15H
35 Data signal input hold time
0 0 0 0 1 0 0 0 08H
36 to 61 Superset information
0 0 0 0 0 0 0 0 00H
62 SPD data revision code
63
Checksum for Bytes 0 to 62
(-7A)
(-75)
0 0 0 1 0 0 1 0 12H
1 0 1 0 0 1 0 0 A4H
1 1 1 0 0 1 0 1 E5H
64
Manufacturer’s JEDEC ID code
0 1 1 1 1 1 1 1 7FH
65
Manufacturer’s JEDEC ID code
0 1 1 1 1 1 1 1 7FH
66
Manufacturer’s JEDEC ID code
1 1 1 1 1 1 1 0 FEH
67 to 71 Manufacturer’s JEDEC ID code
0 0 0 0 0 0 0 0 00H
72 Manufacturing location
73 to 90 Manufacturer’s part number
91 to 92 Revision code
93 to 94 Manufacturing date
95 to 98 Assembly serial number
99 to 125 Manufacturer specific data
126
Reserved (Intel specification
frequency)
0 1 1 0 0 1 0 0 64H
127
Reserved (Intel specification /CAS#
latency support)
1
1
1
1
1
1
1
1
FFH
Comments
15ns
20ns
45ns
256MB
1.5ns
0.8ns
1.5ns
0.8ns
1.2
Continuation Code
Continuation Code
Elpida Memory
100MHz
Data Sheet E0207E20 (Ver. 2.0)
5

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EBS52EC8APFA-75 arduino
EBS52EC8APFA
Pin Functions
CLK0 to CLK3 (input pin): CLK is the master clock input to this pin. The other input signals are referred at CLK
rising edge.
/CS0 to /CS3 (input pin): When /CS is Low, the command input cycle becomes valid. When /CS is High, all inputs
are ignored. However, internal operations (bank active, burst operations, etc.) are held.
/RAS, /CAS and /WE (input pins): Although these pin names are the same as those of conventional DRAMs, they
function in a different way. These pins define operation commands (read, write, etc.) depending on the combination
of their voltage levels. For details, refer to the command operation section.
A0 to A12 (input pins): Row address (AX0 to AX12) is determined by A0 to A12 level at the bank active command
cycle CLK rising edge. Column address (AY0 to AY9) is determined by A0 to A9 level at the read or write command
cycle CLK rising edge. And this column address becomes burst access start address. A10 defines the precharge
mode. When A10 = High at the precharge command cycle, all banks are precharged. But when A10 = Low at the
precharge command cycle, only the bank that is selected by BA0 and BA1 (BA) is precharged.
BA0 and BA1 (input pin)
BA0 and BA1 are bank select signal (BA). (See Bank Select Signal Table)
[Bank Select Signal Table]
BA0
Bank 0
L
Bank 1
H
Bank 2
L
Bank 3
H
Remark: H: VIH. L: VIL.
BA1
L
L
H
H
CKE0, CKE1 (input pin): This pin determines whether or not the next CLK is valid. If CKE is High, the next CLK
rising edge is valid. If CKE is Low, the next CLK rising edge is invalid. This pin is used for power-down and clock
suspend modes.
DQMB0 to DQMB7 (input pins): Read operation: If DQMB is High, the output buffer becomes High-Z. If the
DQMB is Low, the output buffer becomes Low-Z.
Write operation: If DQMB is High, the previous data is held (the new data is not written). If DQMB is Low, the data
is written.
DQ0 to DQ63 (input/output pins): Data is input to and output from these pins.
VDD (power supply pins): 3.3V is applied.
VSS (power supply pins): Ground is connected.
Detailed Operation Part
Refer to the EDS2504APTA/08APTA/16APTA datasheet (E0272E).
Data Sheet E0207E20 (Ver. 2.0)
11

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