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PDF FOD817A Data sheet ( Hoja de datos )
| Número de pieza | FOD817A | |
| Descripción | 4-PIN PHOTOTRANSISTOR OPTOCOUPLERS | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de FOD817A (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
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4-PIN PHOTOTRANSISTOR
OPTOCOUPLERS
FOD817 Series
DESCRIPTION
The FOD817 Series consists of a gallium arsenide infrared
emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
FEATURES
• Applicable to Pb-free IR reflow soldering
• Compact 4-pin package
• Current transfer ratio in selected groups:
FOD817: 50-600%
FOD817A: 80-160%
FOD817B: 130-260%
FOD817C: 200-400%
FOD817D: 300-600%
• C-UL, UL and VDE approved
• High input-output isolation voltage of 5000 Vrms
APPLICATIONS
FOD817 Series
• Power supply regulators
• Digital logic inputs
• Microprocessor inputs
4
1
FUNCTIONAL BLOCK DIAGRAM
ANODE 1
CATHODE 2
4 COLLECTOR
3 EMITTER
ABSOLUTE MAXIMUM RATINGS (TA = 25°C Unless otherwise specified.)
Parameter
Symbol
Value
TOTAL DEVICE
Storage Temperature
Operating Temperature
Lead Solder Temperature
Total Device Power Dissipation
EMITTER
Continuous Forward Current
Reverse Voltage
LED Power Dissipation
Derate above 25°C
DETECTOR
Collector-Emitter Voltage
Emitter-Collector Voltage
Continuous Collector Current
Detector Power Dissipation
Derate above 25°C
TSTG
TOPR
TSOL
PD
IF
VR
PD
VCEO
VECO
IC
PD
-55 to +125
-30 to +100
260 for 10 sec
200
50
6
70
0.93
70
6
50
150
2.0
Units
°C
°C
°C
mW
mA
V
mW
mW/°C
V
V
mA
mW
mW/°C
© 2004 Fairchild Semiconductor Corporation
Page 1 of 9
8/19/04
1 page  
4-PIN PHOTOTRANSISTOR
OPTOCOUPLERS
FOD817 Series
Package Dimensions (Through Hole)
0.200 (5.10)
0.161 (4.10)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.300 (7.62)
typ
0.010 (0.26)
Package Dimensions (Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
Package Dimensions (0.4” Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions (Surface Mount)
1.5
1.3
9
2.54
NOTE
All dimensions are in inches (millimeters)
© 2004 Fairchild Semiconductor Corporation
Page 5 of 9
8/19/04
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet FOD817A.PDF ] | |
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