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PDF M27W801-200N6TR Data sheet ( Hoja de datos )
| Número de pieza | M27W801-200N6TR | |
| Descripción | 8 Mbit 1Mb x8 Low Voltage UV EPROM and OTP EPROM | |
| Fabricantes | STMicroelectronics | |
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Plastic Packages for Integrated Circuits
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
N
INDEX
AREA
E1
-B-
E
0.25(0.010) M B M
GAUGE
PLANE
123
TOP VIEW
0.05(0.002) SEATING PLANE
-A-
D
A
0.25
0.010
-C-
e A1
b
0.10(0.004) M C A M B S
α
A2
0.10(0.004)
L
c
123
P1
N
P
BOTTOM VIEW
M28.173A
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A - 0.047 - 1.20 -
A1 0.002 0.006 0.05 0.15
-
A2 0.031 0.051 0.80 1.05
-
b
0.0075 0.0118 0.19
0.30
9
c
0.0035 0.0079 0.09
0.20
-
D 0.378 0.386 9.60 9.80
3
E1 0.169 0.177 4.30 4.50
4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50
-
L
0.0177 0.0295 0.45
0.75
6
N 28
28 7
α 0o 8o 0o 8o -
P
-
0.138
-
3.50 11
P1
-
0.118
-
3.0
11
NOTES:
Rev. 1 6/99
1. These package dimensions are within allowable dimensions
of JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not
exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protru-
sions. Interlead flash and protrusions shall not exceed
0.15mm (0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a vi-
sual index feature must be located within the crosshatched
area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allow-
able dambar protrusion shall be 0.08mm (0.003 inch) total
in excess of “b” dimension at maximum material condition.
Minimum space between protrusion and adjacent lead is
0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch di-
mensions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical en-
hanced variations. Values shown are maximum size of ex-
posed pad within lead count and body size.
52
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