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PDF DF16C-60DS-0.5V Data sheet ( Hoja de datos )

Número de pieza DF16C-60DS-0.5V
Descripción 0.5mm Pitch SMT Board to Board Connector
Fabricantes Hirose Electric 
Logotipo Hirose Electric Logotipo



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No Preview Available ! DF16C-60DS-0.5V Hoja de datos, Descripción, Manual

0.5mm Pitch SMT Board to Board Connector
DF16 Series
Correspond to Automatic Mounting
The vacuum pick-up area is prepared for automatic
mounting machine.
sFeatures
1. Miniaturizing and Slimming
In addition to 0.5mm pitch miniaturization, board to stacking height of 2mm and 2.5mm are prrovided.
Header
Header
Receptacle commonly uses DF16#-*DS-0.5V.
Header Product Name
DF16#(2.0)-*DP-0.5V
DF16#(2.5)-*DP-0.5V
Stacking Height
2.0mm
2.5mm
Receptacle
Receptacle
Note1: The stacking height doesn't include the solder paste thickness.
2. High Contact Reliability
The bellows female contact has a sufficient spring characteristic despite the low profile, and achieves high contact reliability.
3. Click Sensitivity in Mating
The click feeling is considered to facilitate insertion check when the connector is mated.
4. Metal Fitting Available
The metal fitting to prevent the solder peel is provided, considering the mounting on FPC.
5. Corresponding to Automatic Mounting
The connector has the vacuum pick-up area, and enables the automatic mounting with the embossed tape packaging.
Connector specification with no boss and no fitting is also.
sApplications
Mobile phone, LCD(Liquid Crystal Display), and so on
A308

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DF16C-60DS-0.5V pdf
sBoard to Board 2mm Header With metal fitting
Ø
qBoard to Board 2mm Header with metal fitting, with boss
Part Number
CL No. Number of Contacts
A
B
C
DF16(2.0)-14DP-0.5V(**) 679-0049-7-**
14
06.7
03.0
06.5
DF16(2.0)-16DP-0.5V(**) 679-0041-5-**
16
07.2
03.5
07.0
DF16(2.0)-20DP-0.5V(**) 679-0042-8-**
20
08.2
04.5
08.0
DF16(2.0)-30DP-0.5V(**) 679-0043-0-**
30
10.7
07.0
10.5
DF16(2.0)-40DP-0.5V(**) 679-0044-3-**
40
13.2
09.5
13.0
DF16(2.0)-50DP-0.5V(**) 679-0045-6-**
50
15.7
12.0
15.5
DF16(2.0)-60DP-0.5V(**) 679-0046-9-**
60
18.2
14.5
18.0
DF16(2.0)-80DP-0.5V(**) 679-0048-4-**
80
23.2
19.5
23.0
qBoard to Board 2mm Header with metal fitting, without boss
Part Number
CL No. Number of Contacts
A
B
C
DF16B(2.0)-14DP-0.5V(**) 679-0069-4-**
14
06.7
03.0
06.5
DF16B(2.0)-16DP-0.5V(**) 679-0061-2-**
16
07.2
03.5
07.0
DF16B(2.0)-20DP-0.5V(**) 679-0062-5-**
20
08.2
04.5
08.0
DF16B(2.0)-30DP-0.5V(**) 679-0063-8-**
30
10.7
07.0
10.5
DF16B(2.0)-40DP-0.5V(**) 679-0064-0-**
40
13.2
09.5
13.0
DF16B(2.0)-50DP-0.5V(**) 679-0065-3-**
50
15.7
12.0
15.5
DF16B(2.0)-60DP-0.5V(**) 679-0066-6-**
60
18.2
14.5
18.0
DF16B(2.0)-80DP-0.5V(**) 679-0068-1-**
80
23.2
19.5
23.0
[Specific No.] * *, (* *)
(80) :Gold plated, tube packaging
(81) :Gold plated, embossed tape packaging
D
05.3
05.8
06.8
09.3
11.8
14.3
16.8
21.8
E
04.4
04.9
05.9
08.4
10.9
13.4
15.9
20.9
Unit: mm
Tube Packaging Quantity( pcs.)
73 pcs.
68 pcs.
59 pcs.
45 pcs.
37 pcs.
31 pcs.
26 pcs.
21 pcs.
D
05.3
05.8
06.8
09.3
11.8
14.3
16.8
21.8
Unit: mm
E Tube Packaging Quantity( pcs.)
––– 73 pcs.
––– 68 pcs.
––– 59 pcs.
––– 45 pcs.
––– 37 pcs.
––– 31 pcs.
––– 26 pcs.
––– 21 pcs.
A312

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DF16C-60DS-0.5V arduino
BPrecautions
Temperature
250ç
200ç
IR reflow condition
Preheating area 150ç
30 to 90 seconds
Soldering area 235ç±5ç 10 seconds max.
220ç min. 10 to 20 seconds
Max 240ç
220ç
150ç
1. Recommended Temperature Profile (SMT)
100ç
50ç
Preheating area
Soldering area
0SSEC
50SSEC
100SSEC
150SSEC
200SSEC
Time
Note1: Maximun twice actions are allowed under the same condition. However, the interval
between the first and second actions must be maintained at the room temperature.
Note2: The temperature indicates the board surface temperature of the connector lead area.
2. Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
3. Recommended Screen Thickness (SMT) 0.15mm
4. Board Warp (SMT)
Maximum 0.2mm in the connector center area, based on the both connector edges
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
6. Cautions
sThe header is designed in a structure where contacts are exposed. Touching it with bare hands
would cause contact failure or electrostatic element damage.
sWhere no board is mounted, the insertion or extraction will cause damage or contact deformation.
sAvoid retaining the board with the connector only, and fix the board by any other means than the connector.
sExcessive scoop insertion or extraction may result in damage.
sIn the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
sThe color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
A318

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