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PDF FAN1539 Data sheet ( Hoja de datos )

Número de pieza FAN1539
Descripción 1A/1.3A/ LDO With Low Quiescent Current
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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FAN1539/FAN1540
1A/1.3A, LDO With Low Quiescent Current
Features
• Very Low Ground Current (IGND = 1mA)
• Excellent Line Regulation
• Excellent Load Regulation
• Very Low Transient Overshoot
• Stable with low ESR Output Capacitor (ESR = 0m)
• Thermal Shutdown
• Current Limit
• Output Options: 3.3V and 1.8V
Applications
• Disk Drive Circuits
• Desktop Computers
• Laptop, Notebook Computers
• General purpose Three Terminal Regulator
Description
The FAN1539/FAN1540 series of high current LDO (1.0A
and 1.3A) has been developed for portable applications
where low quiescent current is an important requirement.
The device features excellent line and load transient response
which does not exceed 10% of nominal output value for full
operating temperature range even during power ON cycle
and short circuit removal. Internally trimmed, temperature
compensated bandgap reference guarantees 2.5% accuracy
for full range of input voltage, output current and tempera-
ture. Included on the chip are accurate current limit and ther-
mal shutdown protection. Device stability is achieved with
only two external low ESR ceramic capacitors.
The FAN1539/FAN1540 is available in thermally enhanced
3x3mm 6-lead MLP, 5x6mm 8-lead MLP package and
3-lead TO-252 packages. The 5x6mm MLP package version
features separate Kelvin sense pin for high precision applica-
tions.
Block Diagram
VIN
SRART-UP
CIRCUIT
BANDGAP
REFERENCE
ERROR
AMPLIFIER
THERMAL
SHUTDOWN
Notes:
1. No connection for FAN1540MMPX.
2. VSEN available for FAN1540MMPX.
CURRRENT
LIMIT
VOUT
X (Note1)
VSENSE
(Note2)
GND
REV. 1.0.8 3/22/04

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FAN1539 pdf
PRODUCT SPECIFICATION
FAN1539/FAN1540
Electrical CharacteristicsFAN1539MPX, FAN1540MPX, FAN1540MMPX,
FAN1540DX (Continued)
Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25°C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface
limits apply over operating junction temperature range of 0°C TJ 125°C.
Parameter
Transient
Response
Short circuit
Removal
Response
(Note 9)
Symbol
-----V----O---U----T-
VIN
@IOUT
= short
TEST CONDITIONS
VIN IOUT
5V IOUT = short
to
IOUT = 10mA
TEST LIMITS
Min. Typ. Max. Units
5.0 10 %
(over-
shoot
or un-
der-
shoot
of VO)
Quiescent
Current
Quiescent
Current
Quiescent
Current
Thermal
Shutdown
Thermal
Hysteresis
IGND
IGND
IGND
TjSD
THYST
VIN 7V
VIN 7V
VIN = 5V
3.0V VIN 5.25V
3.0 VIN 5.25V
IOUT = 0mA
2mA IOUT IMAX
0mA IOUT 50mA
1.0 2.0 mA
1.0 2.0 mA
1.0 2.0 mA
160 °C
15 °C
Notes:
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal
value measured at VIN = 5V.
7. Measured within 10Hz to 10kHz bandwidth.
8. Measured at DC, specified at 120 Hz.
9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type.
Test Circuit
VIN
IN DUT OUT
VOUT
CIN 22µF
GND
10µF
COUT
Notes: 1. Use low ESR capacitors.
2. CIN should be placed as close to VIN as possible.
REV. 1.0.8 3/22/04
5

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FAN1539 arduino
FAN1539/FAN1540
PRODUCT SPECIFICATION
Applications Information
General Circuit Description
The FAN1539/FAN1540 is an advanced low dropout voltage
regulator, specially designed for applications in portable
computers, where high performance and low quiescent cur-
rent is required. The device has an internal trimmed bandgap
voltage reference and an internal output voltage sense
divider. These two signals form the input to the error ampli-
fier which regulates the output voltage.
The FAN1539/FAN1540 has a complete set of internal pro-
tection circuitry including thermal shutdown, short circuit
current limit and electrostatic discharge protection. Low
ESR ceramic capacitors are needed for input as well as out-
put pins to maintain the circuit stability.
Short Circuit Current Limit
The device has internal over-current limit and short circuit
protection. Under over-current conditions the device current
is determined by the current limit threshold. Once the device
is released from short circuit conditions, the normal level of
current limit is gradually re-established as the device output
voltage reaches normal levels. Special circuitry has been
added to ensure that recovery from short circuit current con-
ditions does not lead to excessive overshoot of the output
voltage -- a phenomenon often encountered in conventional
regulators.
Thermal Protection
The FAN1539/FAN1540 is designed to supply at least 1A/
1.3A output currents. Excessive output load at high input -
output voltage difference will cause the device temperature
to increase and exceed maximum ratings due to power dissi-
pation. During output overload conditions, when the die tem-
perature exceeds the shutdown limit temperature of 160°C,
an onboard thermal protection will disable the output until
the temperature drops approximately 15°C below the limit,
at which point the output is re-enabled.
Thermal Characteristics
The FAN1539/FAN1540 is designed to supply at least 1A/
1.3A at the specified output voltage with an operating die
(junction) temperature of up to 125°C. Once the power dissi-
pation and thermal resistance is known, the maximum junc-
tion temperature of the device can be calculated. While the
power dissipation is calculated from known electrical param-
eters, the actual thermal resistance depends on the thermal
characteristics of the chosen package and the surrounding
PC board copper to which it is mounted.
The power dissipation is equal to the product of the input-to-
output voltage differential and the output current plus the
ground current multiplied by the input voltage, or:
PD = (VIN – VOUT)IOUT + VINIGND
The ground pin current, IGND can be found in the charts
provided in the “Electrical Characteristics” section.
The relationship describing the thermal behavior of the
package is:
PD(max)
=
T----J--(--m----a--x--)---–-----T----A-
θJA
where TJ(max) is the maximum allowable junction tempera-
ture of the die, which is 150°C, and TA is the ambient operat-
ing temperature. θJA is dependent on the surrounding PC
board layout and can be empirically obtained. While the θJC
(junction-to-case) of the 6-lead MLP package is specified at
8°C /W, the θJA for a minimum PWB footprint will be in
substantially higher. This can be improved upon by provid-
ing a heat sink of surrounding copper ground on the PWB.
Depending on the size of the copper area, and the thickness
of the copper layer, the resulting θJA can vary over a wide
range. The addition of backside copper with through-holes,
stiffeners, and other enhancements can also aid in reducing
thermal resistance. Thermal simulations performed on a
thermally optimized board layout indicate that θJA as low
as 20°C /W can be achieved. For example, the heat contrib-
uted by the dissipation of other devices located nearby must
be included in the design considerations.
Overload conditions also need to be considered. It is possible
for the device to enter a thermal cycling loop, in which the
circuit enters a shutdown condition, cools, re-enables, and
then again overheats and shuts down repeatedly due to a per-
sistent fault condition.
Capacitor ESR and Printed Circuit Board Layout
The FAN1539/FAN1540 has been optimized to accommo-
date low ESR bypass capacitors down to 0 m. For best
results it is important to place both input and output bypass
capacitors as near to the input and output pins as possible.
Use of X7R types such as Murata’s
GRM31CR70J106KA01B (10µF) and
GRM43ER71A226KE01B (22µF) or similar component
from TDK. The capacitors should connect directly to the
ground plane. Use of ground plane on the top and the bottom
side of the PCB is recommended. As many via as possible
should be used to minimize ground plane resistance.
11 REV. 1.0.8 3/22/04

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