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PDF FIN1026 Data sheet ( Hoja de datos )
| Número de pieza | FIN1026 | |
| Descripción | 3.3V LVDS 2-Bit High Speed Differential Receiver | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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June 2002
Revised June 2002
FIN1026
3.3V LVDS 2-Bit High Speed Differential Receiver
General Description
This dual receiver is designed for high speed interconnects
utilizing Low Voltage Differential Signaling (LVDS) technol-
ogy. The receiver translates LVDS levels, with a typical dif-
ferential input threshold of 100mV, to LVTTL signal levels.
LVDS provides low EMI at ultra low power dissipation even
at high frequencies. This device is ideal for high speed
transfer of clock and data.
The FIN1026 can be paired with its companion driver, the
FIN1025, or any other LVDS driver.
Features
s Greater than 400Mbs data rate
s Flow-through pinout simplifies PCB layout
s 3.3V power supply operation
s 0.4ns maximum differential pulse skew
s 2.5ns maximum propagation delay
s Low power dissipation
s Power-Off protection
s Fail safe protection for open-circuit, shorted and termi-
nated non-driven input conditions
s Meets or exceeds the TIA/EIA-644 LVDS standard
s 14-Lead TSSOP package saves space
Ordering Code:
Order Number Package Number
Package Description
FIN1026MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Name
ROUT1, ROUT2
RIN1+, RIN2+
RIN1−, RIN2−
EN
EN
VCC
GND
NC
Description
LVTTL Data Outputs
Non-Inverting LVDS Inputs
Inverting LVDS Inputs
Driver Enable Pin
Inverting Driver Enable Pin
Power Supply
Ground
No Connect
Truth Table
Inputs
Outputs
EN
EN
RIN+
RIN−
H L or Open H
L
H L or Open L
H
H L or Open Fail Safe Condition
X HXX
L or Open
X
X
X
H = HIGH Logic Level
L = LOW Logic Level
X = Don’t Care
Z = High Impedance
Fail Safe = Open, Shorted, Terminated
ROUT
H
L
H
Z
Z
© 2002 Fairchild Semiconductor Corporation DS500784
www.fairchildsemi.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
5 www.fairchildsemi.com
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| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet FIN1026.PDF ] | |
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