(PDF) M14C32DD Datasheet - M14C32 Die Description

Número de pieza	M14C32DD
Descripción	M14C32 Die Description
Fabricantes	STMicroelectronics
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No Preview Available ! M14C32 DD M14C32 Die Description PRODUCT s WAFER SIZE M14C32 152 mm (6 inches) s DIE IDENTIFICATION M14C32KA_R s DIE SIZE (X x Y) 2040 x 2355 µm s SCRIBE LINE 100.5 x 101.7 µm s PAD OPENING 100 x 100 µm DIE LAYOUT s DI Die Identification (at the position shown in Figure 1) s C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1) s C4, C6, C8 These ISO pins do not appear on the M14C32 die s NC This pad, shown in Figure 1, is Not Connected Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm). Figure 1. M14C32 Die Plot C7: SDA (X= –649.92; Y= +993.44) C5: GND (X= +718.0; Y= +1010.0) NC: TEST DI NC: TEST C3: SCL (X= –837.28; Y= –904.24) C2: WC (X= –648.48; Y= –993.6) DD.M14C32/9811V1.1 AI02495 NC: TEST C1: VCC (X= +650.08; Y= –993.76) 1/2 1 page

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PDF M14C32DD Data sheet ( Hoja de datos )