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PDF LZ2364BJ Data sheet ( Hoja de datos )

Número de pieza LZ2364BJ
Descripción 1/3-type CCD Area Sensors with 470 k Pixels
Fabricantes Sharp Electrionic Components 
Logotipo Sharp Electrionic Components Logotipo



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LZ2363B/LZ2364BJ
LZ2363B/
LZ2364BJ
1/3-type CCD Area Sensors
with 470 k Pixels
DESCRIPTION
The LZ2363B/LZ2364BJ are 1/3-type (6.0 mm)
solid-state image sensors that consist of PN photo-
diodes and CCDs (charge-coupled devices). With
approximately 470 000 pixels (795 horizontal x 595
vertical), the sensor provides a stable high-resolution
color (LZ2363B)/B/W (LZ2364BJ) image.
FEATURES
• Number of effective pixels : 752 (H) x 582 (V)
• Number of optical black pixels
– Horizontal : 3 front and 40 rear
– Vertical : 11 front and 2 rear
• Pixel pitch : 6.5 µm (H) x 6.3 µm (V)
• Mg, G, Cy, and Ye complementary color filters
(For LZ2363B)
• Low fixed-pattern noise and lag
• No burn-in and no image distortion
• Blooming suppression structure
• Built-in output amplifier
• Variable electronic shutter (1/50 to 1/10 000 s)
• Compatible with PAL standard (LZ2363B)/
CCIR standard (LZ2364BJ)
• Package :
16-pin half-pitch WDIP [Ceramic]
(WDIP016-N-0450)
Row space : 11.43 mm
PIN CONNECTIONS
16-PIN HALF-PITCH WDIP
TOP VIEW
ØV4 1
ØV3 2
ØV2 3
ØV1 4
GND 5
NC1 6
NC2 7
OS 8
16 ØH2
15 ØH1
14 ØLH1
13 ØRS
12 PW
11 OFD
10 GND
9 OD
(WDIP016-N-0450)
PRECAUTIONS
• The exit pupil position of lens should be more
than 25 mm (LZ2363B)/20 mm (LZ2364BJ) from
the top surface of the CCD.
• Refer to "PRECAUTIONS FOR CCD AREA
SENSORS" for details.
COMPARISON TABLE
TV standard
Characteristics
LZ2363B
LZ2364BJ
PAL standard (Color)
CCIR standard (B/W)
Refer to each following specification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
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LZ2364BJ pdf
LZ2363B/LZ2364BJ
CHARACTERISTICS FOR LZ2364BJ (Drive method : Field accumulation)
(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)
PARAMETER
SYMBOL
MIN. TYP. MAX. UNIT NOTE
Standard output voltage
Photo response non-uniformity
VO
PRNU
150 mV
10 %
2
3
Saturation output voltage
Dark output voltage
VSAT
VDARK
650 mV 4
0.5 3.0 mV 1, 5
Dark signal non-uniformity
DSNU
0.5 2.0 mV 1, 6
Sensitivity
R
370 500
mV 7
Gamma
‹1
Smear ratio
SMR
–84 –76 dB
8
Image lag
AI
1.0 %
9
Blooming suppression ratio
ABL 1 000
10
Output transistor drain current
Output impedance
IOD 4.0 8.0 mA
RO 350 $
Dark noise
OB difference in level
VNOISE
0.2 0.3 mV 11
1.0 mV 1, 12
NOTES :
• VOFD should be adjusted to the minimum voltage such
that ABL satisfy the specification, or to the value
displayed on the device.
1. TA = +60 ˚C
2. The average output voltage under uniform illumination.
The standard exposure conditions are defined as when
Vo is 150 mV.
3. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/Vo,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.
4. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. VSAT is the minimum
segment's voltage under 10 times exposure of the
standard exposure conditions.
5. The average output voltage under non-exposure
conditions.
6. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.
7. The average output voltage when a 1 000 lux light
source with a 90% reflector is imaged by a lens of F4,
f50 mm.
8. The sensor is exposed only in the central area of V/10
square with a lens at F4, where V is the vertical image
size. SMR is defined by the ratio of the output voltage
detected during the vertical blanking period to the
maximum output voltage in the V/10 square.
9. The sensor is exposed at the exposure level
corresponding to the standard conditions. AI is defined
by the ratio of the output voltage measured at the 1st
field during the non-exposure period to the standard
output voltage.
10. The sensor is exposed only in the central area of V/10
square, where V is the vertical image size. ABL is
defined by the ratio of the exposure at the standard
conditions to the exposure at a point where blooming is
observed.
11. The RMS value of the dark noise after CDS. (100 kHz to
5.0 MHz, SC trap on.)
12. The difference between the average output voltage of
the effective area and that of the OB area under non-
exposure conditions.
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LZ2364BJ arduino
PRECAUTIONS FOR CCD AREA SENSORS
1. Package Breakage
In order to prevent the package from being broken,
observe the following instructions :
1) The CCD is a precise optical component and
the package material is ceramic or plastic.
Therefore,
ø Take care not to drop the device when
mounting, handling, or transporting.
ø Avoid giving a shock to the package.
Especially when leads are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn’t fixed.
2) When applying force for mounting the device or
any other purposes, fix the leads between a
joint and a stand-off, so that no stress will be
given to the jointed part of the lead. In addition,
when applying force, do it at a point below the
stand-off part.
(In the case of ceramic packages)
– The leads of the package are fixed with low
melting point glass, so stress added to a
lead could cause a crack in the low melting
point glass in the jointed part of the lead.
Low melting point glass
Lead
Fixed
Stand-off
PRECAUTIONS FOR CCD AREA SENSORS
(In the case of plastic packages)
– The leads of the package are fixed with
package body (plastic), so stress added to a
lead could cause a crack in the package
body (plastic) in the jointed part of the lead.
Glass cap
Package
Lead
Fixed
Stand-off
3) When mounting the package on the housing,
be sure that the package is not bent.
– If a bent package is forced into place
between a hard plate or the like, the pack-
age may be broken.
4) If any damage or breakage occurs on the sur-
face of the glass cap, its characteristics could
deteriorate.
Therefore,
ø Do not hit the glass cap.
ø Do not give a shock large enough to cause
distortion.
ø Do not scrub or scratch the glass surface.
– Even a soft cloth or applicator, if dry, could
cause dust to scratch the glass.
2. Electrostatic Damage
As compared with general MOS-LSI, CCD has
lower ESD. Therefore, take the following anti-static
measures when handling the CCD :
1) Always discharge static electricity by grounding
the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.
2) When directly handling the device with the
fingers, hold the part without leads and do not
touch any lead.
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