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PDF DDRSDRAM Data sheet ( Hoja de datos )

Número de pieza DDRSDRAM
Descripción DDR SDRAM Specification Version 0.61
Fabricantes Samsung semiconductor 
Logotipo Samsung semiconductor Logotipo



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No Preview Available ! DDRSDRAM Hoja de datos, Descripción, Manual

128Mb DDR SDRAM
Target
DDR SDRAM Specification
Version 0.61
- 1 of 63 -
REV. 0.61 August 9. '99

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DDRSDRAM pdf
128Mb DDR SDRAM
3.3.7 Write Interrupted by a Read & DM
3.3.8 Write Interrupted by a Precharge & DM
3.3.9 Burst Stop
3.3.10 DM masking
3.3.11 Read With Auto Precharge
3.3.12 Write With Auto Precharge
3.3.13 Auto Refresh & Self Refresh
3.3.14 Power Down
4. Command Truth Table
5. Functional Truth Table
6. Absolute Maximum Rating
7. DC Operating Conditions & Specifications
7.1 DC Operating Conditions
7.2 DC Specifications
8. AC Operating Conditions & Timming Specification
8.1 AC Operating Conditions
8.2 AC Timming Parameters & Specification
9. AC Operating Test Conditions
10. Input/Output Capacitance
11. IBIS: I/V Characteristics for Input and Output Buffers
11.1 Normal strength driver
11.2 Half strength driver( will be included in the future)
12. QFC function
QFC definition
QFC timming on Read Operation
QFC timming on Write operation with tDQSSmax
QFC timming on Write operation with tDQSSmin
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REV. 0.61 August 9. '99

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DDRSDRAM arduino
128Mb DDR SDRAM
Target
2.2 Input/Output Function Description
SYMBOL
CK, CK
CKE
CS
RAS, CAS, WE
LDM,(U)DM
BA0, BA1
A [n : 0]
DQ
LDQS,(U)DQS
QFC
NC
VDDQ
VSSQ
VDD
VSS
VREF
TYPE
Input
Input
Input
Input
Input
Input
Input
I/O
I/O
Output
-
Supply
Supply
Supply
Supply
Input
DESCRIPTION
Clock : CK and CK are differential clock inputs. All address and control input signals are sam-
pled on the positive edge of CK/negative edge of CK. Output (read) data is referenced to both
edges of CK. Internal clock signals are derived from CK/CK.
Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Deactivating the clock provides PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any bank). CKE is synchronous for all functions except for disabling outputs,
which is achieved asynchronously. Input buffers, excluding CK, CK and CKE are disabled
during power-down and self refresh modes, providing low standby power. CKE will recognize
an LVCMOS LOW level prior to VREF being stable on power-up.
Chip Select : CS enables(registered LOW) and disables(registered HIGH) the command
decoder. All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks CS is considered part of the command code.
Command Inputs : RAS, CAS and WE (along with CS) define the command being entered.
Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled on both
edges of DQS. DM pins include dummy loading internally, to matches the DQ and DQS load-
ing. For the x16, LDM corresponds to the data on DQ0-DQ7 ; UDM correspons to the data on
DQ8-DQ15.
Bank Addres Inputs : BA0 and BA1 define to which bank ACTIVE, READ, WRITE or PRE-
CHARGE command is being applied.
Address Inputs : Provide the row address for ACTIVE commands, the column address and
AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the mem-
ory array in the respective bank. A10 is sampled during a PRECHARGE command to deter-
mine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH). If
only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also
provide the op-code during a MODE REGISTER SET command. BA0 and BA1 define which
mode register is loaded during the MODE REGISTER SET command (MRS or EMRS).
Data Input/Output : Data bus
Data Strobe : Output with read data, input with write data. Edge-aligned with read data, cen-
tered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on
DQ0-DQ7 ; UDQS corresponds to the data on DQ8-DQ15.
FET Control : Optional. Output during every Read and Write access. Can be used to control
isolation switches on modules.
No Connect : No internal electrical connection is present.
DQ Power Supply : +2.5V ± 0.2V.
DQ Ground.
Power Supply : One of +3.3V ± 0.3V or +2.5V ± 0.2V (device specific).
Ground.
SSTL_2 reference voltage.
Table 3. Input/Output Function Description
- 11 of 63 -
REV. 0.61 August 9. '99

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