DataSheet.es    


PDF DF12E-30DP-0.5V Data sheet ( Hoja de datos )

Número de pieza DF12E-30DP-0.5V
Descripción 0.5mm Pitch SMT Board to Board Connector
Fabricantes Hirose Electric 
Logotipo Hirose Electric Logotipo



Hay una vista previa y un enlace de descarga de DF12E-30DP-0.5V (archivo pdf) en la parte inferior de esta página.


Total 11 Páginas

No Preview Available ! DF12E-30DP-0.5V Hoja de datos, Descripción, Manual

0.5mm Pitch SMT Board to Board Connector
DF12 Series
Correspond to automatic mounting
The vacuum pick-up area secures the automatic mounting
machine for pick and place.
sFeatures
1. Broad Variations of Stacking Height
In addition to 0.5mm pitch ultra-miniature size connector, the stacking height of 3mm, 3.5mm, 4mm, and 5mm are provided.
Header/Receptacle
DF12#(3.0)-*DP-0.5V
DF12#(3.5)-VDP-0.5V
DF12#(4.0)-*DP-0.5V
DF12#(5.0)-*DP-0.5V
DF12#(3.0)-*DS-0.5V
DF12#-*DS-0.5V
Combination stacking height Combination stacking height
3.0 –––––––
–––––––
3.5
–––––––
4.0
–––––––
5.0
Note 1 : (**) of the product name DF12# (**) indicates the stacking height.
Note 2 : The stacking height doesn't include the soldering paste thickness.
[Stacking Height Variation]
Stacking Height
3.0mm
3.5mm
4.0mm
20 contacts
K
K
K
30 contacts
K
K
K
32 contacts K ––––––– –––––––
Number of Contacts 38 contacts
K
K
K
40 contacts
K
K
K
50 contacts
K
K
K
60 contacts
K
K
K
2. Corresponding to Automatic Mounting
The connector has the vacuum pick-up area to enable automatic mounting with the embossed tape packaging.
3. Metal Fitting Available
The product including the metal fitting to prevent solder peeling is provided, considering the mounting on FPC.
5.0mm
K
K
–––––––
K
K
K
K
sApplications
Mobile phone, LCD(Liquid Crystal Display), MO(Optical Disk), Note PC
A297

1 page




DF12E-30DP-0.5V pdf
sHeader Without metal fitting
[Specific No.] – **, (**)
(81): Gold plated embossed tape packaging
qStacking Height: 3.5 to 5mm Product
Part Number
CL No.
Number of Contacts A
DF12D (3.0)-20DP-0.5V (**) 537-0793-0- ** 20 07.2
DF12D (3.0)-30DP-0.5V (**) 537-0795-6- ** 30 09.7
DF12D (3.0)-32DP-0.5V (**) 537-0802-0- ** 32 10.2
DF12D (3.0)-36DP-0.5V (**) 537-0796-9- ** 36 11.2
DF12D (3.0)-40DP-0.5V (**) 537-0797-1- ** 40 12.2
DF12D (3.0)-50DP-0.5V (**) 537-0799-7- ** 50 14.7
DF12D (3.0)-60DP-0.5V (**) 537-0801-7- ** 60 17.2
DF12E (3.0)-20DP-0.5V (**) 537-0828-3- ** 20 07.2
DF12E (3.0)-30DP-0.5V (**) 537-0830-5- ** 30 09.7
DF12E (3.0)-32DP-0.5V (**) 537-0837-4- ** 32 10.2
DF12E (3.0)-36DP-0.5V (**) 537-0831-8- ** 36 11.2
DF12E (3.0)-40DP-0.5V (**) 537-0832-0- ** 40 12.2
DF12E (3.0)-50DP-0.5V (**) 537-0834-6- ** 50 14.7
DF12E (3.0)-60DP-0.5V (**) 537-0836-1- ** 60 17.2
Note : Order the emboss package product per reel. (1000 pcs./reel)
B
04.5
07.0
07.5
08.5
09.5
12.0
14.5
04.5
07.0
07.5
08.5
09.5
12.0
14.5
CD
05.7 06.6
08.2 09.1
08.7 09.6
09.7 10.6
10.7 11.6
13.2 14.1
15.7 16.6
05.7 ––––
08.2 ––––
08.7 ––––
09.7 ––––
10.7 ––––
13.2 ––––
15.7 ––––
E
2.3
2.3
Unit: mm
Remarks
Without metal fitting
With boss
Without metal fitting
Without boss
A301

5 Page





DF12E-30DP-0.5V arduino
BPrecautions for Use
1.Recommended Temperature Profile (SMT)
Note 1 : Maximum twice action is allowed under the same condition. However, the interval
between the first and second actions must be maintained at the room temperature.
Note 2 : The temperature indicates the board surface temperature In the connector lead area.
2.Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
3.Recommended Screen Thickness (SMT) 0.12mm
When the 0.15mm thickness is used, set the metal mask open area to 85% as a target.
4.Board Warp(SMT)
Maxmum 0.02mm in the connector center area, based on both connector edges
5.Cleaning Condition
Refer to "Nylon Connector Use Hand book".
6.Cautions
s The receptacle is designed in a structure where contacts are exposed. Touching it with
bare hands would cause contact failure or electrostatic element damage.
s Where no board is mounted, the insertion or extraction will cause damage or
contact deformation.
s Avoid retaining the board with the connector only, and fix the board by any other means
than the connector.
s Excessive scoop insertion or extraction may result in damage.
s In the manual soldering process, don't carry out the flux coating which will cause a flux
blister on the connector.
s The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
A307

11 Page







PáginasTotal 11 Páginas
PDF Descargar[ Datasheet DF12E-30DP-0.5V.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
DF12E-30DP-0.5V0.5mm Pitch SMT Board to Board ConnectorHirose Electric
Hirose Electric

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar